234521 ⎘
Indexing scheme relating to printed circuits covered by; Shape and layout; Shape and layout details of conductors covering at least two types of conductors provided for in - Alternating conductors, e.g. alternating different shaped pads, twisted pairs; Alternating components
MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
#2Mating backplane for high speed, high density electrical connector
#3Mating backplane for high speed, high density electrical connector
#4Differential circuit board and semiconductor light emitting device
#5Conductor arrangement and production method
#6Mating backplane for high speed, high density electrical connector
#7Wiring substrate, electronic device, and electronic module
#8Mating backplane for high speed, high density electrical connector
#9Wiring board
#10Circuit board, method of manufacturing circuit board, and electronic device
#11Circuit board pad mounting orientation system
#12Method for manufacturing flexible printed circuit board
#13Method of manufacturing a wiring structure of a head suspension
#14FLEXIBLE PRINTED CIRCUIT BOARD AND OPTICAL MODULE
#15Shielded twisted pair of conductors using conductive ink
#16Mating backplane for high speed, high density electrical connector
#17Glass substrate including passive-on-glass device and semiconductor die
#18Terminal connection structure and display apparatus
#19Flexible printed circuit board, printed circuit board structure and method for manufacturing flexible printed circuit board
#20Vehicle accessory control arrangement
#21High-frequency signal line and manufacturing method thereof
#22Vehicle accessory control arrangement
#23Layer-layer registration coupon for printed circuit boards
#24Method of manufacturing a wiring structure of a head suspension
#25Flexible printed circuit boards structure
#26Multilayer substrate
#27Press fit electrical terminal having a solder tab shorter than PCB thickness and method of using same
#28Printed wiring board
#29Current sensing system
#30Shielded twisted pair of conductors using conductive ink
#31Wiring board, and electronic device
#32Controlling apparatus for electric power steering apparatus
#33Printed wiring board and printed circuit board
#34Laminated circuit substrate
#35Dual polarity LED lighting device
#36Electrode of self-capacitive touch panel utilizing serpentine trace to increase resistance
#37Thin low profile strip dual in-line memory module
#38Trace structure for improved electrical signaling
#39Cortical implant system for brain stimulation and recording
#40Weaved electrical components in a substrate package core
#41High-frequency signal line and manufacturing method thereof
#42Vehicle accessory control arrangement
#43Connection structure of electronic device
#44High-frequency signal line
#45Package for housing electronic component and electronic device
#46Current sensor and printed circuit board for this sensor
#47Shielded twisted pair of conductors using conductive ink
#48Electrical characteristics of package substrates and semiconductor packages including the same
#49Stretchable electronic device and method of manufacturing same
#50Heterogeneous integration of microfluidic devices in package structures
#51Suspension with divided positive and negative write trace sections, and head gimbal assembly and disk drive unit with the same
#52Printed flexible multilayer twisted-pair shielded high speed data cable
#53Wiring structure of head suspension having a stacked interleaved part and method of manufacturing the same
#54Coiled magnetic ring
#55Printed circuit board comprising two coils
#56Current sensor
#57Laboratory sample instrument with printed circuit board cable device
#58Method for fabricating a carrier with a three dimensional inductor and structure thereof
#59Method for fabricating a carrier with a three dimensional inductor
#60Multi-layer flexible printed circuit board for electronic device
#61Semiconductor module with micro-buffers
#62Method of forming vertically offset bond on trace interconnects on recessed and raised bond fingers
#63Method and apparatus for low inductive design pattern
#64Folded stacked package and method of manufacturing the same
#65Laminate capacitor stack inside a printed circuit board for electromagnetic compatibility capacitance
#66Electronic apparatus
#67High frequency detection device and coaxial cable including the same
#68High-Frequency Coupler
#69Non-contact power receiving apparatus
#70TRANSMISSION LINE CIRCUIT HAVING PAIRS OF CROSSING CONDUCTIVE LINES
#71STRUCTURE, ELECTRONIC DEVICE, AND CIRCUIT BOARD
#72ELECTROMAGNETIC BANDGAP STRUCTURE AND CIRCUIT BOARD
#73BGA footprint pattern for increasing number of routing channels per PCB layer
#74Magnetic element having improved transformers and common mode chokes
#75Semiconductor device having vertically offset bond on trace interconnects on recessed and raised bond fingers
#76INDUCTOR OF CIRCUIT BOARD
#77Packaged structure having magnetic component and method thereof
#78Capacitor containing a large number of filamentous conductors and method of manufacturing the same
#79UNIFIED SCALABLE HIGH SPEED INTERCONNECTS TECHNOLOGIES
#80MULTI-LAYER PRINTED CIRCUIT BOARD
#81DISPLAY DEVICE AND METHOD OF DRIVING THE SAME
#82Electronic apparatus and flexible printed wiring board
#83Implementations of twisted differential pairs on a circuit board
#84Printed wiring board, method for manufacturing printed wiring board, and electric device
#85MINIATURE CIRCUITRY AND INDUCTIVE COMPONENTS AND METHODS FOR MANUFACTURING SAME
#86MINIATURE CIRCUITRY AND INDUCTIVE COMPONENTS AND METHODS FOR MANUFACTURING SAME
#87Printed Circuit Boards, Printed Circuit Board Capacitors, Electronic Filters, Capacitor Forming Methods, and Articles of Manufacture
#88Semiconductor module with micro-buffers
#89Method of forming vertically offset bond on trace interconnects on recessed and raised bond fingers
#90LAYOUT GEOMETRIES FOR DIFFERENTIAL SIGNALS
#91Printed wiring board and connection configuration of the same
#92Flexible printed circuit, touch panel, display panel and display
#93Flexible printed circuit, touch panel, display panel and display
#94PRINTED CIRCUIT BOARD WITH GROUND GRID
#95Semiconductor module, wiring board, and wiring method
#96Circuit board and display device including the same
#97Wiring substrate, tape package having the same, and display device having the same
#98Multilayer passive circuit topology
#99Power line arrangement
#100Printed circuit board with differential traces
#101Printed circuit board coil
#102Miniature circuitry and inductive components and methods for manufacturing same
#103Resistor layout structure and manufacturing method thereof
#104Alternating micro-vias and throughboard vias to create PCB routing channels in BGA interconnect grid
#105Printed circuit board having closed vias
#106Method for fabricating closed vias in a printed circuit board
#107MEMORY MODULE COMPRISING MEMORY DEVICES
#108Circuit board arrangement and method for producing a circuit board arrangement
#109Inductor circuit board, method of forming inductor, and bias-T circuit
#110Miniature circuitry and inductive components and methods for manufacturing same
#111Methods for manufacturing miniature circuitry and inductive components
#112Miniature circuitry and inductive components and methods for manufacturing same
#113Printed wiring board and connection configuration of the same
#114High density flexible wiring board
#115Doubled-sided pluggable backplane
#116Printed multilayer solenoid delay line having at least two sub-sets with different patterns
#117Semiconductor device
#118MEMORY MODULES AND METHODS FOR MANUFACTURING MEMORY MODULES
#119Semiconductor package having non-solder mask defined bonding pads and solder mask defined bonding pads, printed circuit board and semiconductor module having the same
#120Semiconductor memory module
#121Methods for forming connection structures for microelectronic devices
#122Method for hybridization of two components by using different sized solder protrusions and a device that uses two components hybridized according to this method
#123Alternating micro-vias and throughboard vias to create PCB routing channels in BGA interconnect grid
#124Method and apparatus for a dual band gap wideband interference suppression
#125Flexible print cable having alternating signal and ground conductors and connector for the same
#126Inductive filters and methods of fabrication therefor
#127Method and apparatus for routing a differential pair on a printed circuit board
#128Embedded duo-planar printed inductor
#129Flexible printed circuit and liquid crystal display device using same
#130Miniature circuitry and inductive components and methods for manufacturing same
#131Printed circuit board having three-dimensional spiral inductor and method of fabricating same
#132Capacitor pad network to manage equivalent series resistance
#133Circuit board inductor
#134Printed circuit board having improved solder pad layout
#135Multilayer circuit board
#136Memory modules and methods for manufacturing memory modules
#137Connection structures for microelectronic devices and methods for forming such structures
#138Method for providing electrical crossover in a laminated structure
#139Layered structure with electric leads for a body worn device
#140Wireless communications devices including circuit substrates with partially overlapping conductors thereon coupling power to/from power amplifier systems
#141Circuit substrate
#142Mounting structure in integrated circuit module
#143Electronic transformer/inductor devices and methods for making same
#144Circuit board transmitting high frequency signal
#145Actuator employing a bobbin incorporating a winding coil and a manufacturing method thereof
#146Method of manufacturing planar inductors