234524 ⎘
Indexing scheme relating to printed circuits covered by; Shape and layout; Shape and layout details of conductors covering at least two types of conductors provided for in - Varying width along a single conductor; Conductors or pads having different widths
FLEXIBLE SUBSTRATE
#2WIRING CIRCUIT BOARD
#3CIRCUIT BOARD, SEMICONDUCTOR MODULE AND SEMICONDUCTOR SYSTEM
#4POWER BOARD
#5WIRING CIRCUIT BOARD
#6PRINTED CIRCUIT BOARD
#7PRINTED CIRCUIT BOARD
#8BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS
#9Core Resonance Suppression in Signal Integrity Optimized Package
#10MULTILAYER BOARD, MULTILAYER BOARD MODULE, AND ELECTRONIC DEVICE
#11PRINTED WIRING BOARD
#12WIRING BOARD AND MANUFACTURING METHOD FOR THE SAME
#13CIRCUIT BOARD
#14WIRING BOARD, ELECTRONIC COMPONENT STORAGE PACKAGE, AND ELECTRONIC DEVICE
#15MULTILAYER SUBSTRATE
#16WIRING CIRCUIT BOARD
#17Backplane footprint for high speed, high density electrical connectors
#18CIRCUIT BOARD
#19DUAL TRACE THICKNESS FOR SINGLE LAYER ROUTING
#20Bump-on-Trace Design for Enlarge Bump-to-Trace Distance
#21Circuit board
#22Transmission module, electronic unit, and electronic device
#23Semiconductor device and display device
#24Backplane footprint for high speed, high density electrical connectors
#25Electronic circuit and circuit board
#26Impedance matching within a signal transmission channel
#27Electrically conductive film
#28Printed wiring board
#29Flexible circuit board
#30WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
#31Printed circuit board and display device including the same
#32Differential circuit board and semiconductor light emitting device
#33Information handling system with split trace for high speed routing
#34Fine feature formation techniques for printed circuit boards
#35Backplane footprint for high speed, high density electrical connectors
#36Land for surface mounted component
#37MODULE AND METHOD OF MANUFACTURING THE SAME
#38Circuit module and power supply chip module
#39Wired circuit board and production method thereof
#40Electronic circuit board and electronic circuit device
#41Backplane footprint for high speed, high density electrical connectors
#42Electrically conductive film
#43Component carrier with electrically reliable bridge with sufficiently thick vertical thickness in through hole of thin dielectric
#44Multi-layered circuit board
#45Semiconductor device and display device
#46Conductive pattern
#47Functional panel, method for manufacturing the same and terminal
#48Transmission line and mounting structure thereof
#49Printed circuit board having a differential pair routing topology with negative plane routing and impedance correction structures
#50Detection device and display device with detection function
#51Light source module
#52Panel, manufacturing method thereof, and terminal
#53Wired circuit board and production method thereof
#54Signal transmission method and apparatus, and display device
#55Ceramic electronic component
#56Ceramic electronic component
#57Wired circuit board and producing method thereof
#58Component carrier with electrically reliable bridge with sufficiently thick vertical thickness in through hole of thin dielectric
#59Information handling system comprising a processor coupled to a board and including a differential trace pair having a first straight differential trace and a second serpentine shape differential trace
#60Input device with reinforcement plate and wider grounding wire
#61Electrical conductors
#62Backplane footprint for high speed, high density electrical connectors
#63Method for through-plating a printed circuit board and such a printed circuit board
#64Method of utilizing serpentine regions
#65Bump-on-trace design for enlarge bump-to-trace distance
#66ELECTRONIC DEVICE
#67Circuit substrate, component-mounted substrate, and methods of manufacturing circuit substrate and component-mounted substrate
#68Differential trace pair system
#69Backplane footprint for high speed, high density electrical connectors
#70Wiring substrate, electronic device, and electronic module
#71Electrically conductive film
#72Detection device and display device with detection function
#73Method for manufacturing circuit board
#74Inter-board connection structure
#75Dual trace thickness for single layer routing
#76Flexible printed circuit board
#77Method for manufacturing circuit board
#78CONDUCTOR PAD FOR FLEXIBLE CIRCUITS AND FLEXIBLE CIRCUIT INCORPORATING THE SAME
#79Differential trace pair system
#80Method for manufacturing a high-current printed circuit board
#81Circuit board pad mounting orientation system
#82System and method of utilizing serpentine regions
#83Semiconductor device and display device
#84DUAL-DRILL PRINTED CIRCUIT BOARD VIA
#85Printed wiring board
#86FLEXIBLE PRINTED CIRCUIT AND ELECTRONIC DEVICE
#87Backplane footprint for high speed, high density electrical connectors
#88Systems and apparatuses for power electronics with high current carrying conductors
#89Printed circuit via for KA satcom circuit boards
#90Communication module packaging
#91Backplane footprint for high speed, high density electrical connectors
#92Fine feature formation techniques for printed circuit boards
#93Transmission line
#94Printed circuit board and method for manufacturing the same
#95Routing-over-void-T-line-compensation
#96High-frequency signal transmission line and electronic device
#97Connection structure between optical device and circuit substrate, and optical transmission apparatus using the same
#98Sensor
#99Circuit board
#100Multi-layer circuit member with reference planes and ground layer surrounding and separating conductive signal pads
#101Detection device and display device with detection function
#102Communication apparatus
#103Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structures
#104Flexible printed circuit board
#105Communications connectors including transmission lines having impedance discontinuities that improve return loss and/or insertion loss performance and related methods
#106Wiring substrate, wiring member, liquid discharge head, liquid discharge device, and liquid discharge apparatus
#107Electronic apparatus
#108Signal transmission component and electronic device
#109Electronic device
#110LED light strip and method for manufacturing the same
#111Circuit board and circuit device
#112Dual-drill printed circuit board via
#113Electronic device, method for producing same, and circuit substrate
#114Backplane footprint for high speed, high density electrical connectors
#115Internal/external circuit board connection structure
#116WIRING BOARD AND ELECTRONIC APPARATUS
#117Circuits and methods providing electronic band gap (EBG) structures at memory module electrical coupling
#118Conductive pattern
#119Electrical conductors
#120Electrical contact pad for electrically contacting a connector
#121Metal base circuit board and method of manufacturing the metal base circuit board
#122Wired circuit board including a conductive pattern having a wire and a dummy portion
#123High-frequency signal line, method for producing same, and electronic device
#124Multilayer substrate
#125Shielded, folded connector for a sensor
#126Conductor pad for flexible circuits and flexible circuit incorporating the same
#127Vehicular panel and wiring structure for vehicle
#128Driving printed circuit board for display device and display device having the same
#129Circuit obfuscation using differing dielectric constants
#130Flexible printed circuit board, method for manufacturing the same, and display device
#131Semiconductor device and display device
#132High-frequency signal transmission line and electronic device
#133Differential trace pair system
#134Trace border routing
#135Transmission line member and electronic apparatus
#136Flexible printed circuit and detecting device, detecting method and display device thereof
#137Circuit board and liquid ejection head
#138Method for manufacturing a non-planar printed circuit board assembly
#139Printed wiring board
#140Detection device and display device with detection function
#141Planar lighting device and mounting substrate including conduction pattern with extension parts
#142Multilayer wiring board and probe card having the same
#143High-frequency signal line and electronic device provided with the same
#144High-frequency signal transmission line and electronic apparatus
#145Assembly of circuit boards and electronic device comprising said assembly
#146Avoiding reflections in PCB signal trace
#147High-frequency signal transmission line and electronic device
#148Multilayer substrate
#149High-sensitivity sensor comprising conductive thin film containing cracks and method for manufacturing same
#150Circuit board, electronic component housing package, and electronic device
#151Bump-on-trace design for enlarge bump-to-trace distance
#152Optical module, optical transceiver, printed circuit board, and flexible printed circuit board
#153Signal routing with reduced crosstalk
#154Communications connectors including transmission lines having impedance discontinuities that improve return loss and/or insertion loss performance and related methods
#155Signal transmission component and electronic device
#156Multi-layer substrates including thin film signal lines
#157Electronic component, method of manufacturing electronic component, and electronic device
#158Device for connecting to a power network and method for protecting such a device
#159Multi-layer resin substrate having grounding conductors configured to form triplate line sections and microstrip sections
#160Printed wiring board
#161Printed wiring board
#162Chip electronic component and board for mounting thereof
#163Flat cable
#164Different-pitch flat cable connection structure, pitch-conversion flat cable, and method for producing pitch-conversion flat cable
#165Transmission line, a transmission line apparatus, and an electronic device
#166High-frequency transmission line
#167High-frequency signal transmission line
#168Electromagnetic field manipulation around vias
#169Flexible flat circuit
#170Paddle card with improved performance
#171Tape package and display apparatus including the same
#172Board assembly for transmitting high-speed signal and method of manufacturing the same
#173Touch window
#174Electronic component mounting structure and printed wiring board
#175Chip on film flexible circuit board and display device
#176Transmission line filter with tunable capacitor
#177Trace structure for improved electrical signaling
#178Structural body and wiring board
#179Overcurrent protection device
#180Shaped internal leads for a printed circuit substrate
#181High-frequency signal line
#182EBG structure, semiconductor device, and circuit board
#183Components and circuits for output termination
#184Flex circuit system for a battery assembly of an electrified vehicle
#185High-frequency signal line and electronic device including the same
#186Conductor pad for flexible circuits and flexible circuit incorporating the same
#187High-frequency signal line and method for producing base layer with signal line
#188Laminated flat cable and method for producing same
#189Panel structure
#190High-frequency signal line
#191High-frequency signal transmission line and electronic device
#192Semiconductor device, transmission system, method for manufacturing semiconductor device, and method for manufacturing transmission system
#193Insulation circuit and communication equipment
#194Capacitor arrangement structure and method of mounting capacitor
#195Semiconductor device
#196Suspension board with circuit and method of manufacturing the same
#197Wiring board and light emitting device using same
#198Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structures
#199Semiconductor device and method of forming high routing density interconnect sites on substrate
#200Attenuation reduction grounding pattern structure for connection pads of flexible circuit board
#201Electronic control device including interrupt wire
#202High-frequency signal line, method for producing same, and electronic device
#203Electronic control device including interrupt wire
#204Flat cable
#205Micro-wire electrode buss
#206Communications connectors including transmission lines having impedance discontinuities that improve return loss and/or insertion loss performance and related methods
#207Optimized via cutouts with ground references
#208High-frequency signal line and electronic device
#209High frequency signal line and electronic device
#210High-frequency signal line and electronic device
#211Circuit board with signal routing layer having uniform impedance
#212Interconnection device for electronic circuits, notably microwave electronic circuits
#213High-frequency signal line and electronic device including the same
#214High-frequency signal transmission line and electronic device
#215Electrical characteristics of package substrates and semiconductor packages including the same
#216Hybrid substrate with high density and low density substrate areas, and method of manufacturing the same
#217Display panel and wiring structure thereof
#218Structure for connecting electrical trace lines of printed circuit boards and optical transceiver module with the same
#219Multilayer circuit substrate
#220High-frequency signal transmission line and electronic apparatus
#221High-frequency signal transmission line and electronic apparatus
#222Optoelectronic device packaging method and chip assembly having an isolation dielectric located on both sides of a high-frequency transmission line to form a coplanar waveguide transmission line
#223Flexible multilayer substrate
#224Circuit board incorporating electronic component and manufacturing method thereof
#225Radiofrequency absorptive filter
#226High-frequency signal transmission line
#227Flexible printed circuit board and circuit-board connection structure
#228High-frequency signal transmission line
#229Routing design for high speed input/output links
#230Wiring board
#231Wiring board for mounting a semiconductor element
#232Parasitic capacitance compensating transmission line
#233CONNECTING STRUCTURE OF CIRCUIT BOARD
#234Connector structure
#235Substrate structure and semiconductor package using the same
#236Printed circuit board
#237Signal transmission line and circuit board
#238Planar lighting device and mounting substrate including conduction pattern with extension parts
#239Television and electronic apparatus
#240Power supply control circuit module
#241Circuit board with higher current
#242Delay line structure
#243Connection substrate
#244Semiconductor device and display device
#245Flip chip interconnection having narrow interconnection sites on the substrate
#246Flexible printed board
#247CIRCUIT BOARD
#248High-frequency signal transmission line
#249Differential transmission circuit and information processing system
#250PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
#251Semiconductor Device and Method of Forming High Routing Density Interconnect Sites on Substrate
#252CIRCUIT BOARD
#253STRUCTURE OF TRANSMISSION LINE FOR DATA COMMUNICATION AND METHOD FOR DESIGNING THE SAME
#254Electronic device and noise suppression method
#255Method For Centering A Print Track
#256Flip Chip Interconnection Having Narrow Interconnection Sites on the Substrate
#257Circuit obfuscation using differing dielectric constants
#258Laminated wiring board
#259Electronic control device including interrupt wire
#260Electronic control device including interrupt wire
#261Electronic control device including interrupt wire
#262Electronic control device including interrupt wire
#263Printed circuit board
#264WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
#265Connection method and substrate
#266Method and device for routing over a void for high speed signal routing in electronic systems
#267CATEGORY 6A SURGE PROTECTOR
#268Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structures
#269ELECTRODE ARRAY
#270Trace border routing
#271Circuit structure of circuit board
#272Stretchable electronic device
#273Signal transmission line and circuit board
#274Printed circuit board
#275Millimeter wave multi-layer packaging including an RFIC cavity and a radiating cavity therein
#276Printed wiring board with crossing wiring pattern
#277Broadband transition from a via interconnection to a planar transmission line in a multilayer substrate
#278Printed wiring board and device including printed wiring board
#279Computer motherboard
#280Receptacle, printed wiring board, and electronic device
#281Light emitting device module
#282Semiconductor device and method of forming high routing density BOL BONL and BONP interconnect sites on substrate
#283Method of manufacturing a printed circuit board
#284Connection device for high frequency signals between a connector and a transmission line
#285Method and structure for coaxial via routing in printed circuit boards for improved signal integrity
#286Different signal transmission line for printed circuit board
#287Receptacle structure, printed wiring board structure, and electronic device
#288FLEXIBLE SUBSTRATE AND DISPLAY DEVICE PROVIDED WITH SAME
#289Printed circuit board
#290Method of providing conductive structures in a multi-foil system and multifoil system comprising same
#291Printed circuit board
#292Electronic module, methods of manufacturing and driving the same, and electronic instrument
#293Display device
#294High-speed ceramic modules with hybrid referencing scheme for improved performance and reduced cost
#295Channel performance of electrical lines
#296Flexible printed circuit and electric apparatus and optical disc drive having flexible printed circuit
#297Flexible interconnect cable having signal trace pairs and ground layer pairs disposed on opposite sides of a flexible dielectric
#298Electronic circuit and IC tag
#299Multilayer wiring board
#300ACTIVE DEVICE ARRAY SUBSTRATE