234531 ⎘
Indexing scheme relating to printed circuits covered by; Shape and layout; Shape and layout details of conductors covering at least two types of conductors provided for in - Redundant conductors or connections, i.e. more than one current path between two points
NON-COPLANAR PARALLEL RESISTANCE-REDUCING CIRCUIT STRUCTURE
#2WIRING BOARD AND ELECTRONIC DEVICE
#3Conformal Wearable Battery
#4CHIPLETS WITH CONNECTION POSTS
#5WIRING CIRCUIT BOARD
#6Printed circuit boards with plated blind slots for improved vertical electrical and/or thermal connections
#7FLEXIBLE CIRCUIT PACKAGE
#8Chiplets with connection posts
#9WIRING BOARD, LIGHT EMITTING DEVICE, AND METHOD FOR MANUFACTURING THEREOF
#10Anti-interference circuit board and terminal
#11Redundant trace fuse for a conformal wearable battery
#12Layout structure of a flexible circuit board
#13Communication module
#14Flexible circuit package
#15Method for providing an electrical connection and printed circuit board
#16Printed wiring board
#17Resin multilayer substrate, electronic component, and mounting structure thereof
#18Resin multilayer substrate, electronic component, and mounting structure thereof
#19Chiplets with connection posts
#20Flexible circuit structures including connection arrangement connected to load measurement lead
#21Chiplets with connection posts
#22Flexible circuit package
#23Multilayer printed circuit board and electronic device including the same
#24Printed circuit substrate
#25Wiring board
#26Chiplets with connection posts
#27Flexible circuit structures including connection arrangement connected to load measurement lead
#28Transparent conductor and display device including same
#29Substrate, electronic device, and design support method of substrate
#30Circuits for flexible structures
#31Apparatus and methods for via connection with reduced via currents
#32Display apparatus having clock line
#33Method of supplying electrical power from rigid printed circuit board to another rigid printed circuit board in rigid-flex printed circuit board array
#34Printed circuit board structure
#35Power signal transmission structure and design method thereof
#36Method for forming insulating layer, method for producing electronic device, and electronic device
#37Circuit board
#38Filter circuit, multiplexer, and module
#39Illuminated display
#40Apparatus and methods for via connection with reduced via currents
#41Printed circuit board and electric device
#42Multilayer printed circuit board and electronic device including the same
#43Wiring substrate, wiring member, liquid discharge head, liquid discharge device, and liquid discharge apparatus
#44Method for forming insulating layer, method for producing electronic device, and electronic device
#45Vehicle accessory control arrangement
#46Wiring substrate and semiconductor device
#47Impedance matching structure of transmission line
#48High-frequency component
#49Carrier substrate
#50Multilayer substrate
#51Display device having dummy terminals
#52Semiconductor chip mounted on a packaging substrate
#53Multilayer printed circuit board with switching power supply capacitors, broad patterns, and TT-type filter
#54Vehicle accessory control arrangement
#55Chiplets with connection posts
#56Printable component structure with electrical contact
#57Light-emitting device and lighting device provided with the same
#58Via structure and circuit board having the via structure
#59Contactless communications antenna for payment terminals
#60Circuit board and liquid ejection head
#61Converter mounting board
#62Electronic device
#63Printed circuit board with at least one integrated precision resistor
#64Shared resistor pad bypass
#65Method and arrangement for board-to-board interconnection
#66Contact arrangement for a multi-layer circuit board
#67Power supply board
#68Signal trace patterns for flexible substrates
#69Organic EL display device
#70Light-emitting device and lighting device provided with the same
#71Electric redundant circuit
#72Chip component mounting structure, and module component
#73Electronic component mounting structure and printed wiring board
#74High-frequency signal line
#75Wiring board, semiconductor device, and method of manufacturing wiring board
#76Imprinted bi-layer micro-structure method with bi-level stamp
#77Imprinted bi-layer micro-structure method
#78Imprinted multi-layer micro-structure method with multi-level stamp
#79Replacement electrical connectors
#80Light-emitting device and lighting device provided with the same
#81Vehicle accessory control arrangement
#82High-frequency signal line
#83Capacitor arrangement structure and method of mounting capacitor
#84Multilayer ceramic capacitor and board having the same mounted thereon
#85Electronic devices comprising printed circuit boards
#86Carrier substrate and manufacturing method thereof
#87Electrical and mechanical interconnection for electronic components
#88Stacked structure and manufacturing method of the same
#89Uniform impedance circuit board
#90Light-emitting device and lighting device provided with the same
#91Stud bump bonding in implantable medical devices
#92Printed circuit board structure with heat dissipation function
#93Interposer having molded low CTE dielectric
#94Multilayer circuit substrate having core layer with through-hole
#95Suspension board assembly sheet with circuits and method for manufacturing the same
#96Internally overlapped conditioners
#97Circuit module
#98Flexible displays
#99Printed circuit board
#100Golden finger and board edge interconnecting device
#101Apparatus comprising a conductive path and a method of forming an apparatus with a conductive path
#102MULTILAYER ELECTRONIC STRUCTURE WITH INTEGRAL FARADAY SHIELDING
#103Multilayer electronic structure with novel transmission lines
#104Organic light emitting display device and reworking method thereof
#105Chip assembly and chip assembling method
#106PRINTED CIRCUIT BOARD WITH GROUNDING PROTECTION
#107Wiring boards and semiconductor modules including the same
#108Printed wiring board, and method of supplying power and forming wiring for printed wiring board
#109Noise filter and transmission apparatus
#110Printed circuit board with connecting wires
#111Via structures and compact three-dimensional filters with the extended low noise out-of-band area
#112Circuit board with higher current
#113Circuit structure of electronic device and its manufacturing method
#114Method for manufacturing interposer
#115Light emitting device module
#116PRINTED CIRCUIT BOARD HAVING HEAT GATHERING STRUCTURES AND MANUFACTURING PROCESS THEREOF
#117Electronic device, wiring board, and method of shielding noise
#118CIRCUIT BOARD, ELECTRONIC APPARATUS, AND NOISE BLOCKING METHOD
#119CIRCUIT BOARD AND RADIATING HEAT SYSTEM FOR CIRCUIT BOARD
#120Wiring device and display device
#121Display panel
#122CIRCUIT BOARD AND RADIATING HEAT SYSTEM FOR CIRCUIT BOARD
#123AT LEAST PARTIALLY REDUNDANT INTERCONNECTS BETWEEN COMPONENT AND PRINTED BOARD
#124VIAS FOR MITIGATING PAD DELAMINATION
#125LED package structure
#126CIRCUIT BOARD HAVING CURRENT BALANCE FUNCTION
#127Interposer having molded low CTE dielectric
#128Ceramic substrate and method for manufacturing the same
#129Printed circuit board
#130Printed circuit board
#131Electronic device
#132Electronic component and substrate module
#133MICROWAVE FILTER
#134Method and apparatus for low inductive design pattern
#135PRINTED CIRCUIT BOARD
#136Electronic circuit
#137Light-emitting device and lighting device provided with the same
#138Printed board and bus bar assembly
#139Printed circuit board having hexagonally aligned bump pads for substrate of semiconductor package, and semiconductor package including the same
#140SPLIT WAVE COMPENSATION FOR OPEN STUBS
#141Multi layer circuit board and method of manufacturing the same
#142Method of repairing probe card and probe board using the same
#143Detonator cartridge and methods of use
#144Method for making internally overlapped conditioners
#145LIGHT-EMITTING DEVICE AND LUMINARE
#146Non-contact power receiving apparatus
#147PRINTED CIRCUIT BOARD AND METHOD FOR MAKING SAME
#148Method for manufacturing a textile-type electronic component package
#149Power Converter and In-Car Electrical System
#150Interconnect for high-frequency printed circuit
#151Circuit substrate including a plurality of signal lines and ground lines forming a 3-D grounding circuit loop
#152Method and Electronic Assembly to Attach a Component to a Substrate
#153Wiring substrate and semiconductor device
#154Display device
#155Method for forming a current distribution structure
#156Interposer and method for manufacturing the same
#157PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
#158Internally overlapped conditioners
#159Solder connection element
#160Printed wiring board and electronic-component package
#161Multilayer chip capacitor and method of fabricating the same
#162RING OF POWER VIA
#163Power distribution system
#164Surface mounting structure for ball grid array
#165Printed circuit board and method of manufacturing the same
#166Printed wiring board and electronic device
#167Printed circuit board and method of manufacturing the same
#168Electrical interconnection devices incorporating Fedundant contact points for reducing capacitive stubs and improved signal integrity
#169Printed circuit board
#170Laminated body and manufacturing method thereof
#171SEMICONDUCTOR DEVICE
#172Golden finger for flexible printed circuitboard
#173Electrostatic discharge (ESD) protection circuit and method
#174Optical transceiver
#175Radio frequency multilayer substrate and manufacturing method of radio frequency multilayer substrate
#176Pin layout of a golden finger for flexible printed circuitboard
#177Package substrate with a conductive connecting pin
#178MULTILAYER WIRING BOARD, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#179Printed wiring board
#180Component-embedded module and manufacturing method thereof
#181Flexible printed circuit, touch panel, display panel and display
#182Flexible printed circuit, touch panel, display panel and display
#183Conductive pin attached to package substrate
#184Flexible printed circuit board and liquid crystal display device including the same
#185Solder ball interface
#186Printed circuit board, method for forming frame ground for printed circuit board, and electronic device
#187SUBSTRATE FOR MOUNTING SEMICONDUCTOR DEVICE
#188Conductive connecting pin and package substrate
#189BUS BAR TO PRINTED CIRCUIT BOARD INTERFACE FOR ELECTRIC AND HYBRID ELECTRIC VEHICLES
#190Current distribution structure and method
#191Circuit board for mounting multilayer chip capacitor and circuit board apparatus including the multilayer chip capacitor
#192Multilayer chip capacitor, circuit board apparatus having the capacitor, and circuit board
#193Conductive connecting pins for a package substrate
#194Semiconductor device and printed circuit board
#195Method for improving power distribution current measurement on printed circuit boards
#196Circuit board and radiating heat system for circuit board
#197Circuit board and manufacturing method thereof
#198Split wave compensation for open stubs
#199Manufacturing method of substrate with through electrode
#200Semiconductor package substrate
#201Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integrity
#202Conditioner with coplanar conductors
#203Internally overlapped conditioners
#204Wiring substrate and electronic device
#205Ceramic electronic component and method for manufacturing the same
#206Electronic device and manufacturing method of the same
#207Electronic device
#208ELECTRONIC DEVICE
#209Circuit board having at least one auxiliary scribed line
#210Semiconductor device and printed circuit board
#211Circuit module and power line communication apparatus
#212Transparent electrode for LED array
#213MULTILAYERED PRINTED-WIRING BOARD AND INTER-LAYER CONNECTING METHOD THEREOF
#214Method of fabricating a via attached to a bond pad utilizing a tapered interconnect
#215Differential pair connection arrangement, and method and computer program product for making same
#216Printed board and bus bar assembly
#217Circuit for suppressing electromagnetic interference, implementation structure and electronic apparatus implementing the same
#218Multi-layer wiring board
#219Layout of a printed circuit board
#220METHOD FOR PCB FUSING TRACE ARRANGEMENT FOR MOTOR DRIVE APPLICATIONS
#221Method of reducing noise induced from reference plane currents
#222Circuit board unit
#223Printed circuit board
#224Printed wiring board, semiconductor package with printed wiring board and electronic device having printed circuit board
#225Heat dissipation structure of backlight module
#226Computer system and main board equipped with hybrid hypertransport interfaces
#227Board mounted terminal construction
#228Spread illuminating apparatus
#229Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integrity
#230Wiring substrate and electronic parts packaging structure
#231Interposer for compliant interfacial coupling
#232Semiconductor device and radiation detector employing it
#233High frequency device mounting substrate and communications apparatus
#234Fan-out wire structure
#235Electronic circuit unit having low transmission loss
#236Package frame and semiconductor package using the same
#237Printed circuit board and soldering method and apparatus
#238High speed interface design
#239Multi-layer printed circuit board
#240Flexible printed circuit board
#241Circuit board with trace configuration for high-speed digital differential signaling
#242Semiconductor device
#243Via connection structure with a compensative area on the reference plane
#244Routing vias in a substrate from bypass capacitor pads
#245Via attached to a bond pad utilizing a tapered interconnect
#246Multi-processor module with redundant power
#247Redundant power beneath circuit board
#248Redundant power for processor circuit board
#249Method for processing a thin film substrate
#250Routing vias in a substrate from bypass capacitor pads
#251High frequency semiconductor apparatus, transmitting apparatus and receiving apparatus
#252Method and apparatus for supporting microelectronic substrates
#253Semiconductor device and printed circuit board
#254Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integrity
#255Capacitor-related systems for addressing package/motherboard resonance
#256Circuit board surface mount package
#257Multi-layer wiring board
#258Structure of stacked vias in multiple layer electrode device carriers
#259System for reducing noise induced from reference plane currents
#260Circuit board with trace configuration for high-speed digital differential signaling
#261Pressfit terminal and connection structure
#262Flexible printed circuit board
#263Liquid crystal display device and fabricating method thereof
#264Microwave filter distributed on circuit board of wireless communication product
#265Method for programming a routing layout design through one via layer
#266Printed circuit board for a three-phase power device having embedded directional impedance control channels
#267Electronic control unit
#268Via and via landing structures for smoothing transitions in multi-layer substrates
#269Circuit board with at least one electronic component
#270Plated via interposer