234536 ⎘
Indexing scheme relating to printed circuits covered by; Shape and layout; Shape or layout details not covered by a single group of - Oblique hole, via or bump
X-CROSS NON-CIRCULAR MICRO VIAS FOR LAYER INTERCONNECT IN PRINTED WIRING BOARD
#2PRINTED WIRING BOARD, MULTILAYER RESONATOR, AND MULTILAYER FILTER
#3FILLING MATERIALS AND METHODS OF FILLING THROUGH HOLES OF A SUBSTRATE
#4Flexible printed wiring board, joined body, pressure sensor and mass flow controller
#5Trace/via hybrid structure multichip carrier
#6Method of fabricating a glass substrate with a plurality of vias
#7Filling materials and methods of filling through holes of a substrate
#8Methods for gas generation in a sealed gas cell cavity
#9Trace/via hybrid structure multichip carrier
#10Through-hole electrode substrate
#11Component carrier comprising a deformation counteracting structure
#12Through-hole electrode substrate
#13Bus bar plate, electronic component unit, and wire harness
#14Multilayer wiring substrate, manufacturing method therefor, and substrate for probe card
#15PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAGING STRUCTURE HAVING SAME
#16MULTI LAYERED PRINTED CIRCUIT BOARD
#17Wiring board
#18Printed wiring board and method for manufacturing printed wiring board
#19Packaging substrate, method for manufacturing same, and chip packaging structure having same
#20Electronic device and fabrication method thereof
#21Touch member and method of manufacturing the same
#22Through-hole electrode substrate
#23Wave soldering of surface-mounting electronic devices on printed circuit board
#24Printed circuit board
#25INTERPOSER SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
#26DEVICE PACKAGING STRUCTURE AND DEVICE PACKAGING METHOD
#27DEVICE PACKAGING STRUCTURE AND DEVICE PACKAGING METHOD
#28Printed wiring board having through-hole and a method of production thereof
#29PRINTED CIRCUIT BOARD
#30Electronic device having a hidden input key and method of manufacturing an electronic device
#31Printed circuit board
#32DEVICE MOUNTING STRUCTURE AND DEVICE MOUNTING METHOD
#33Method for manufacturing a printed wiring board having a through-hole conductor
#34Spacer, and its manufacturing method
#35Support module for a solid state light source, a lighting device comprising such a module, and a method for manufacturing such a lighting device
#36Method of manufacturing a through-hole electrode substrate
#37Printed wiring board and a method of production thereof
#38Printed wiring board and a method of production thereof
#39CIRCUIT BOARD AND SEMICONDUCTOR ELEMENT MOUNTED STRUCTURE USING THE SAME
#40Circuit boards
#41Method of manufacturing an interposer
#42Printed circuit board including embedded capacitor and method of fabricating same
#43Printed wiring board and a method of production thereof
#44Annular via drilling (AVD) technology
#45Mounting board including a flat-type electrical element and capable of being reduced in size, and lead-attached electric element that is flat in shape and has a lead bonded to each electrode face
#46Electrical circuit pattern design by injection mold
#47Multilayer printed circuit board having via arrangements for reducing crosstalk among vias
#48Thermal conductive electronics substrate and assembly
#49Wiring substrate, method of manufacturing wiring substrate, and liquid droplet ejection head
#50Devices including sloped vias in a substrate and devices including spring-like deflecting contacts
#51Electrical interconnection system
#52Slanted vias for electrical circuits on circuit boards and other substrates
#53Methods for making plated through holes usable as interconnection wire or probe attachments
#54Processes for planarizing substrates and encapsulating printable electronic features
#55Printed circuit board including embedded capacitor and method of fabricating same
#56Component for impedance matching
#57Method and apparatus for forming angled vias in an integrated circuit package substrate
#58Wiring substrate for mounting light emitting element
#59Multi-layer printed circuit board wiring layout
#60Slanted vias for electrical circuits on circuit boards and other substrates
#61Sloped vias in a substrate, spring-like contacts, and methods of making
#62Device and method for tilted land grid array interconnects on a coreless substrate package
#63Build-up structures with multi-angle vias for Chip to Chip interconnects and optical bussing
#64Method and structure for implementing enhanced electronic packaging and PCB layout with diagonal vias
#65Printed circuit board and package having oblique vias
#66Method and device for through-hole plating of substrates and printed circuit boards
#67Methods for making plated through holes usable as interconnection wire or probe attachments
#68Methods for making vertical electric feed through structures usable to form removable substrate tiles in a wafer test system
#69Build-up structures with multi-angle vias for chip to chip interconnects and optical bussing