234543 ⎘
Indexing scheme relating to printed circuits covered by; Shape and layout; Shape or layout details not covered by a single group of - Coating over pads, e.g. solder resist partly over pads
EXTENDED PAD AREA TO PREVENT PRINTED CIRCUIT BOARD DAMAGE
#2CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
#3SOLDER RESIST STRUCTURE TO MITIGATE SOLDER BRIDGE RISK
#4LAMINATED STRUCTURE WITH PADS
#5PRINTED CIRCUIT BOARD
#6PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
#7CIRCUIT BOARD AND ELECTRONIC COMPONENT PACKAGE
#8PRINTED CIRCUIT BOARD
#9Component Carrier and Method of Manufacturing the Same
#10ELECTRONIC COMPONENT
#11WIRING BOARD, SEMICONDUCTOR DEVICE, AND WIRING BOARD MANUFACTURING METHOD
#12SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
#13CIRCUIT BOARD, ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME, AND MANUFACTURING METHOD THEREOF
#14CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
#15WIRING BOARD
#16CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
#17PRINTED CIRCUIT BOARD
#18MULTILAYER SUBSTRATE MANUFACTURING METHOD AND WIRING SUBSTRATE
#19PRINTED CIRCUIT BOARD
#20WIRING CIRCUIT BOARD
#21PRINTED CIRCUIT BOARD
#22MODULE BOARD AND SEMICONDUCTOR MODULE HAVING THE SAME
#23STRESS-RELEASING SOLDER MASK PATTERN FOR SEMICONDUCTOR DEVICES AND RELATED SYSTEMS AND METHODS
#24Electronic component and manufacturing method thereof
#25ELECTRONIC COMPONENT
#26SUBSTRATE
#27Printed circuit board and electronic device
#28Printed circuit board and method of fabricating the same
#29Printed circuit board
#30LAMINATED STRUCTURE WITH PADS AND MANUFACTURING METHOD THEREOF
#31Printed circuit board including conductive pad and electric device using the same
#32Circuit board
#33Substrate bonding pad having a multi-surface trace interface
#34Printed circuit board and electronic device
#35Printed circuit board and method of fabricating the same
#36Flexible circuit board with thermally conductive connection to a heat sink
#37Printed circuit board
#38PRINTED CIRCUIT BOARD
#39Lighting arrangement comprising a substrate for light emitting elements
#40MODULE AND METHOD OF MANUFACTURING THE SAME
#41Ceramic electronic component
#42Printed circuit board and method of fabricating the same
#43Resin substrate and method for producing resin substrate
#44Printed circuit board and method of fabricating the same
#45Wiring board, electronic device, and electronic module
#46Printed circuit board and electronic device
#47Ceramic electronic component
#48Ceramic electronic component
#49Mounting structure for module in electronic device
#50Printed circuit board module
#51Printed wiring board, printed circuit board, and electronic device
#52Printed circuit board and method of fabricating the same
#53Apparatus and method for detecting ion migration
#54Printed circuit board and electronic device
#55Printed wiring board
#56Circuit board pad resonance control system
#57CONDUCTOR PAD FOR FLEXIBLE CIRCUITS AND FLEXIBLE CIRCUIT INCORPORATING THE SAME
#58Mounting structure for module in electronic device
#59Electronic device
#60Ceramic electronic component
#61Printed circuit board and method of fabricating the same
#62Insulating ceramic paste, ceramic electronic component, and method for producing the same
#63Configurable, encapsulated sensor module and method for making same
#64Resin substrate, component-mounted resin substrate, method of manufacturing resin substrate, and method of manufacturing component-mounted resin substrate
#65Mounting structure for module in electronic device
#66Method for void reduction in solder joints
#67Printed wiring board, printed circuit board, and electronic device
#68Rigid-flexible circuit interconnects
#69Printed circuit board and semiconductor package including the same
#70LED lighting apparatus
#71Printed circuit board and method of fabricating the same
#72Conductor pad for flexible circuits and flexible circuit incorporating the same
#73Mounting substrate, method for manufacturing a mounting substrate, and mounted structure including an electronic component
#74Circuit board, power storage device, battery pack, and electronic device
#75Semiconductor device with a gap control electrode and method of manufacturing the semiconductor device
#76Printed circuit board
#77Hybrid fabrication method for large area microwave circuits
#78Printed circuit board and method of fabricating the same
#79Depositing bulk or micro-scale electrodes
#80Printed substrate and shield sheet metal fixing method
#81Planar lighting device and mounting substrate including conduction pattern with extension parts
#82Wiring board and method of manufacturing same
#83Method for producing a module
#84Insulating ceramic paste, ceramic electronic component, and method for producing the same
#85Method of manufacturing substrate and substrate and mask film
#86Method for manufacturing multilayer substrate for having BGA-type component thereon
#87Circuit board having bypass pad
#88Wiring substrate and method of manufacturing wiring substrate
#89Multilayer wiring board
#90Wiring board and method for manufacturing same
#91Electric component module
#92Printed circuit board
#93Method of manufacturing printed circuit board and printed circuit board
#94Flexible cable assembly having reduced-tolerance electrical connection pads
#95Circuit board and electronic device
#96Conductor pad for flexible circuits and flexible circuit incorporating the same
#97Circuit substrate and electronic device
#98Wiring board
#99Method of mounting electronic parts on surface mounting substrate using a film resist standoff
#100Printed circuit board and method of manufacturing the same
#101Rigid-flexible circuit interconnects
#102Method of manufacturing an interlayer connection substrate
#103Module and method for manufacturing the same
#104Wiring substrate and method for producing wiring substrate
#105Depositing bulk or micro-scale electrodes
#106Circuit substrate, method of manufacturing circuit substrate, and electronic component
#107Printed wiring board, printed circuit board, and method for manufacturing printed circuit board
#108Method and system for producing component mounting board
#109Mounting structure of chip component and electronic module using the same
#110Wiring substrate
#111Wiring substrate having a plurality of connection terminals and a filling member provided therebetween
#112Printed circuit board and method for manufacturing the same
#113Circuit module
#114Method for manufacturing printed circuit board
#115Methods of fabricating electrode sensor
#116Wiring board and electronic device using the same
#117Light emitting devices and substrates with improved plating
#118Optical-electrical converting device with increased transmitting efficiency
#119Mounted structure and manufacturing method of mounted structure
#120Printed circuit board, method of producing a printed circuit board and testing device for testing a printed circuit board
#121Solder-mounted board, production method therefor, and semiconductor device
#122Bonding structure
#123Method of reducing solder wicking on a substrate
#124Fabricating method of circuit board and circuit board
#125Circuit board
#126Printed wiring board and method of manufacturing printed wiring board
#127Planar lighting device and mounting substrate including conduction pattern with extension parts
#128Wiring substrate, light emitting device, and manufacturing method of wiring substrate
#129Corrosion protected flexible printed wiring member
#130Printed circuit board and method for manufacturing the same
#131Light-emitting element mounting package, light-emitting element package, and method of manufacturing these
#132Chip-component structure and method of producing same
#133PRINTED CIRCUIT BOARD ASSEMBLY
#134Bump structure and process of manufacturing the same
#135Dual epoxy dielectric and photosensitive solder mask coatings, and processes of making same
#136Light-emitting device and luminaire
#137Circuit board having bypass pad
#138SUBSTRATE FOR MOUNTING ELEMENT AND ITS PRODUCTION PROCESS
#139Manufacturing method of metal structure of flexible multi-layer substrate
#140Circuit board, semiconductor element, semiconductor device, method for manufacturing circuit board, method for manufacturing semiconductor element, and method for manufacturing semiconductor device
#141METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD
#142Contact and contactless differential I/O pads for chip-to-chip communication and wireless probing
#143Hybrid integrated circuit device and electronic device
#144PRINTED CIRCUIT BOARD AND FLIP CHIP PACKAGE USING THE SAME WITH IMPROVED BUMP JOINT RELIABILITY
#145Circuit board and electronic device
#146Wiring board and method of manufacturing the wiring board
#147Packaging substrate with conductive structure
#148Printed wiring board and method for manufacturing printed wiring board
#149Semiconductor device
#150PRINTED CIRCUIT BOARD (PCB) ASSEMBLY WITH ADVANCED QUAD FLAT NO-LEAD (A-QFN) PACKAGE
#151PROCESS FOR FABRICATING CIRCUIT BOARD
#152Hybrid integrated circuit device and electronic device
#153Wiring circuit board and manufacturing method thereof
#154Method for manufacturing multilayer printed wiring board
#155Joined structure and method for producing the same
#156Flip Chip Substrate Package Assembly and Process for Making Same
#157ASSEMBLY, AND ASSOCIATED METHOD, FOR FORMING A SOLDER CONNECTION
#158PORTABLE MEMORY DEVICES
#159CIRCUIT DEVICE AND MANUFACTURING METHOD THEREFOR
#160Multilayer wiring substrate
#161Printed wiring board
#162Multilayered wiring board and method of manufacturing the same
#163Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate
#164Multilayer wiring substrate, and method of manufacturing the same
#165Multilayered wiring substrate
#166Method of manufacturing multilayer wiring substrate
#167Hybrid integrated circuit device, and method for fabricating the same, and electronic device
#168Printed circuit board structure
#169Circuit Board with Variable Topography Solder Interconnects
#170Metal structure of flexible multi-layer substrate and manufacturing method thereof
#171Wiring board
#172Circuit module
#173Method of manufacturing a printed wiring board
#174Solder pad structure with high bondability to solder ball
#175Circuit board having bypass pad
#176PRINTED CIRCUIT BOARD
#177Printed circuit board equipped with piezoelectric element
#178Circuit board having bypass pad
#179Semiconductor package
#180Substrate and semiconductor device
#181Method of manufacturing a semiconductor package and semiconductor package having an electrode pad with a small pitch
#182Module substrate and production method
#183Hybrid integrated circuit device, and method for fabricating the same, and electronic device
#184Electronic component
#185Electronic device
#186Ball land structure having barrier pattern
#187Printed wiring board
#188Structure for supporting printed wiring board
#189Interconnect substrate, method of manufacturing interconnect substrate and semiconductor device
#190Electronic device and semiconductor device
#191Multilayer printed wiring board and method for manufacturing multilayer printed wiring board
#192Semiconductor package with passivation island for reducing stress on solder bumps
#193SEMICONDUCTOR DEVICE
#194Method of reducing solder wicking on a substrate
#195Function expansion device, manufacturing method thereof and electronic apparatus system
#196Wiring board and manufacturing method thereof
#197Printed wiring board
#198Manufacture of devices including solder bumps
#199Semiconductor device and method for manufacturing the same
#200Printed circuit board ball grid array system having improved mechanical strength
#201Method of making rigid-flexible printed circuit board having a peelable mask
#202Electronic circuit board including surface mount device
#203Dual epoxy dielectric and photosensitive solder mask coatings, and processes of making same
#204PACKAGE SUBSTRATE HAVING DOUBLE-SIDED CIRCUITS AND FABRICATION METHOD THEREOF
#205Printed circuit board with tin pads
#206Multilayer ceramic substrate, method for producing same, and electronic component
#207WORKPIECE CONTACT PADS WITH ELEVATED RING FOR RESTRICTING HORIZONTAL MOVEMENT OF TERMINALS OF IC DURING PRESSING
#208Electronic carrier board applicable to surface mount technology
#209ELECTRONIC CIRCUIT BOARD
#210Solder ball interface
#211Surface mount power module dual footprint
#212Flip-chip mounting substrate and flip-chip mounting method
#213Printed circuit board assembly
#214METHODS FOR REDUCING CORROSION ON PRINTED CIRCUIT BOARDS
#215Conductor carrier and arrangement comprising a conductor carrier
#216Wiring board having solder bump and method for manufacturing the same
#217Printed circuit board, semiconductor package, card apparatus, and system
#218Hybrid integrated circuit device, and method for fabricating the same, and electronic device
#219Circuit board having bypass pad
#220Semiconductor chip substrate with multi-capacitor footprint
#221Printed wiring board, air conditioner, and method of soldering printed wiring board
#222CIRCUIT BOARD AND PROCESS FOR FABRICATING THE SAME
#223SUBSTRATE STRUCTURE
#224Wiring board of semiconductor device, semiconductor device, electronic apparatus, mother board, method of manufacturing wiring board of semiconductor device, method of manufacturing mother board and method of manufacturing electronic apparatus
#225PRINTED WIRING BOARD AND ELECTRONIC APPARATUS
#226Liquid droplet jetting apparatus and method for manufacturing liquid droplet jetting apparatus
#227Semiconductor package with passivation island for reducing stress on solder bumps
#228Multilayer ceramic substrate, method for producing same, and electronic component
#229Printed circuit board
#230CIRCUIT BOARD, A LIQUID CRYSTAL DISPLAY MODULE HAVING THE SAME, AND A DISPLAY DEVICE HAVING THE SAME
#231Packaging substrate with conductive structure
#232METHOD OF MANUFACTURING INTERCONNECT SUBSTRATE AND SEMICONDUCTOR DEVICE
#233Method for manufacturing a printed wiring board
#234Universal solder pad
#235Circuit device and manufacturing method therefor
#236Surface finish structure of multi-layer substrate and manufacturing method thereof
#237Method for manufacturing a printed wiring board
#238Printed circuit board and flip chip package using the same with improved bump joint reliability
#239Printed circuit board and its designing method, and designing method of IC package terminal and its connecting method
#240Package substrate and its solder pad
#241Electronic component package, electronic component mounted apparatus, method of inspecting bonding portion therein, and circuit board
#242SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME
#243Solder pad and method of making the same
#244POLYMER SUBSTRATE FOR ELECTRONIC COMPONENTS
#245Printed Wiring Board
#246Portable memory devices
#247PRINTED CIRCUIT BOARD CAPABLE OF VOID CONTROL DURING SURFACE MOUNTING PROCESS
#248Semiconductor package and module printed circuit board for mounting the same
#249Crack-resistant solder joint, electronic component such as circuit substrate having the solder joint, semiconductor device, and manufacturing method of electronic component
#250PRINTED CIRCUIT BOARD ASSEMBLY AND DISPLAY HAVING THE SAME
#251Partial Solder Mask Defined Pad Design
#252Flip chip substrate structure and the method for manufacturing the same
#253Printed wiring board and process for manufacturing the same
#254Raised solder-mask-defined (SMD) solder ball pads for a laminate electronic circuit board
#255Printed circuit board and semiconductor package using the same
#256Mounting substrate
#257Hybrid integrated circuit device, and method for fabricating the same, and electronic device
#258Ceramic substrate, electronic apparatus, and method for producing ceramic substrate
#259Interconnect substrate, semiconductor device, and method of manufacturing the same
#260Electronic carrier board applicable to surface mounted technology (SMT)
#261Circuit board, method for manufacturing the same, semiconductor device, and method for manufacturing the same
#262Rounded contact fingers on substrate/PCB for crack prevention
#263Recording disk drive capable of suppressing vibration of flexible printed circuit board
#264Recording disk drive capable of suppressing vibration of flexible printed circuit board
#265Package structure and manufacturing method thereof
#266System and method for flip chip substrate pad
#267Attachment of a QFN to a PCB
#268Flip-chip mounting substrate and flip-chip mounting method
#269Hybrid solder pad
#270Printed wiring board and fabrication method for printed wiring board
#271Cable connector
#272Printed circuit board with interconnection terminal, a printed circuit assembly and electronic apparatus
#273Printed circuit board of semiconductor package and method for mounting semiconductor package using the same
#274Padless substrate for surface mounted components
#275Method and apparatus for reducing electrical interconnection fatigue
#276Semiconductor package having non-solder mask defined bonding pads and solder mask defined bonding pads, printed circuit board and semiconductor module having the same
#277Printed wiring board
#278Printed wiring board
#279Printed wiring board and method for fabricating the same
#280Electronic apparatus with a wiring terminal
#281Printed circuit board, semiconductor package and multi-stack semiconductor package using the same
#282PRINTED CIRCUIT BOARD INTERCONNECTION AND METHOD
#283Method and apparatus for manufacturing and probing test probe access structures on vias
#284Semiconductor device and a manufacturing method of the same
#285Circuit substrate
#286Chip size package
#287ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
#288Substrate for producing a soldering connection to a second substrate
#289Circuit board device and manufacturing method thereof
#290Land structure, printed wiring board, and electronic device
#291Structure and method for connecting flexible printed circuit board to inkjet print head
#292Semiconductor device with a recessed bond pad
#293Side-view type light emitting device
#294Printed-wiring board, printed-circuit board and electronic apparatus
#295Printed circuit board and forming method thereof
#296Circuit board for mounting a semiconductor circuit with a surface mount package
#297Components with solder masks
#298Biaxially oriented copolyester film and laminates thereof
#299Anchored non-solder mask defined ball pad
#300Image forming apparatus and electronic apparatus