SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

CIRCUIT BOARD AND ELECTRONIC DEVICE

ELECTRONIC CONTROL UNIT

SMALL FOOTPRINT POWER SWITCH

SUBSTRATE STRUCTURE

METHOD FOR ELECTRICALLY CONNECTING ELECTRONIC COMPONENTS OF A BATTERY SYSTEM AND BATTERY SYSTEM

PCB For An IC Chip With D-PHY Function And C-PHY Function And An PCB Assembly Including The IC Chip

COVERLAY AS PRINTED CIRCUIT BOARD (PCB) VOLTAGE INSULATOR UNDER CONNECTORS

PRINTED CIRCUIT BOARD

SMALL FOOTPRINT POWER SWITCH

MEMORY MODULE AND ELECTRONIC DEVICE ASSEMBLY INCLUDING THE SAME

VAPORIZER DEVICE BODY

VAPORIZER DEVICE WITH DIFFERENTIAL PRESSURE SENSOR

LAYOUT FOR DUAL IN-LINE MEMORY TO SUPPORT 128-BYTE CACHE LINE PROCESSOR

REFLECTIVE CANCELLATIONS IN A CONNECTOR WIPE OF A SURFACE MOUNT CONNECTOR

REFLECTIVE CANCELLATIONS IN A CONNECTOR WIPE

INTERLINKED GROUND WELLS WITH SPECIALIZED PATTERNS FOR LIQUID METAL INTERPOSER

LIQUID METAL PATCH INTERCONNECT FOR LARGE WARPAGE COMPONENTS

ELECTRONIC DEVICE COMPRISING PLURALITY OF PRINTED CIRCUIT BOARDS

CIRCUIT BOARD, CHIP ON FILM, DISPLAY APPARATUS AND BONDING METHOD

CIRCUIT MODULE

NON-UNIFORM SURFACE MOUNT PADS

SUBSTRATE STRUCTURE CONNECTED ON BASIS OF SOLDER BALL AND ELASTIC BODY

CIRCUIT MODULE

Vaporizer device body

POWER CONVERTER, INTER-COMPONENT CONNECTION SYSTEM, AND INTER-COMPONENT CONNECTION METHOD

PCB pad for SMT process

Vaporizer device with differential pressure sensor

VAPORIZER CARTRIDGE

Heater control circuitry for vaporizer device

Layout for dual in-line memory to support 128-byte cache line processor

Module

PRINTED CIRCUIT BOARD CORNER CONNECTION

Power Semiconductor Module with Accessible Metal Clips

Electronic assembly including cable modules

Power electronics unit comprising a circuit board and a power module, method for producing a power electronics unit, motor vehicle comprising a power electronics unit

Socket alignment and retention system

Interconnect and method for manufacturing the same

Circuit board assembly, display apparatus, terminal, and signal processing system

Surface mount pads for next generation speeds

Power module having metallic heat-dissipation substrate

Electronic assembly including cable modules

Power module package and method of manufacturing the same

Electric drive device and electric power steering device

Display panel and chip-on-film (COF) package bonding structure, panel bonding pins, package bonding pins, and display panel and COF package bonding method

Printed circuit board assembly

Camera head

Lead pin and wiring board having lead pin

Power delivery module for an electronic package

Touch display device and touch display module

LED filament and lamp, and manufacturing process of LED filament

Electronic module with an electrically conductive press-fit terminal having a press-fit section

Power module having metallic heat-dissipation substrate

Voltage regulator module

Electronic device

Appliance control module with in-molded electronics

Module

Heater control circuitry for vaporizer device

Identification of a cartridge for a vaporizer device

Vaporizer device with differential pressure sensor

Vaporizer device body

Vaporizer cartridge for a vaporizer

Camera head

Pin flexure array

Mounting assembly for an electrically-powered device

Sensor having system-in-package module, method for producing the same, and sensor arrangement

Electrode embedded member

Adapter with an insulating body having a circuit board with a plurality of conductive modules surface mounted on the board

Board-to-board connectors and mounting structure

Semiconductor device having bonding regions exposed through protective films provided on circuit patterns onto which components are soldered

Electrical connector with shield structure

Power module based on multi-layer circuit board

Multilayer structure and related method of manufacture for electronics

Power semiconductor module and power semiconductor device

Method for electrically connecting an electronic module and electronic assembly

Board-to-board connectors and mounting structure

Inductor component and method for manufacturing the same

Mounting assembly for an electrically-powered device

Surface mount metal unit and electric device including same

Fingerprint module, method for manufacturing the fingerprint module, and mobile terminal

Backplane and communications device

CIRCUIT SUPPORT FOR AN ELECTRONIC CIRCUIT AND METHOD FOR MANUFACTURING A CIRCUIT SUPPORT OF SAID TYPE

Camera head

Joining part and board unit

IMPROVEMENTS TO SATELLITE TRANSMITTED DATA RECEIVING APPARATUS

Flexible printed circuit boards and related methods

High-frequency module

Fingerprint module, method for manufacturing the fingerprint module, and mobile terminal

Intelligent power module and manufacturing method thereof

Input device and electronic apparatus comprising the same

Electrical connector assembly

Embedded buffer circuit compensation scheme for integrated circuits

Integrated circuit, electronic device and method for transmitting data in electronic device

Integrated power module packaging structure

Backplane and communications device

Electronic device with plug

Power module

Power converter incorporated in case

Circuit board, manufacturing method thereof and display apparatus

Printed wiring board

Pin connector structure and method

Low-profile space-efficient shielding for SIP module

Low profile zero/low insertion force package top side flex cable connector architecture

Power semiconductor module arrangement

CPU package substrates with removable memory mechanical interfaces

Metal post bonding using pre-fabricated metal posts

Low-area overhead connectivity solutions to SIP module

Electric connecting member and LED lamp using the same

Wiring board, wiring board with lead, and electronic device

CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, ELECTRONIC COMPONENT PACKAGE, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT PACKAGE

OLED lighting module

Electronic component module and manufacturing method thereof

Printed circuit boards for communications connectors having openings that improve return loss and/or insertion loss performance and related connectors and methods

Cortical implant system for brain stimulation and recording

Capacitive transparent touch sheet having excellent visibility and durability

Injection molded product and method of manufacturing the same

Power module package

Electronic component module

Power semiconductor module and method for producing a power semiconductor module

Plug connection having a guide element optimized for preventing shavings

Method for manufacturing a plurality of metal posts

Module and method of manufacturing the same

Stud bump bonding in implantable medical devices

Low profile zero/low insertion force package top side flex cable connector architecture

Method for producing multi-layer substrate and multi-layer substrate

Substrate structure, method of mounting semiconductor chip, and solid state relay

Electronic component module and method for manufacturing the same

Pin connector structure and method

3D microelectrode device for live tissue applications

Method for manufacturing mount assembly

Sensor comprising a multi-layered ceramic substrate and method for its production

Method of manufacturing stacked mounting structure

Probe card and method for manufacturing the same

Electronic device and pin thereof

Method for producing an infrared light detector

Method for Manufacturing PCB, Display Module and Method for Fabricating Display Module

Method for manufacturing PCB

Wiring board and method for manufacturing the same

OPTICAL NETWORK UNIT TRANSCEIVER MODULE HAVING DIRECT CONNECT RF PIN CONFIGURATION

LEAD PIN FOR PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE PRINTED CIRCUIT BOARD INCLUDING THE SAME

Wiring board having a reinforcing member with capacitors incorporated therein

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

Lead pin for package substrate, and method for manufacturing package substrate with the same

Interposer lead

PROGRAMMABLE ANTIFUSE MATRIX FOR MODULE DECOUPLING

THERMAL FLEX CONTACT CARRIERS #2

Electronic assemblies without solder and methods for their manufacture

MEMORY SYSTEM, MEMORY MODULE, AND MODULE SOCKET

ASSEMBLY OF AT LEAST TWO ELECTRIC BOARDS

LEAD PIN AND WIRING SUBSTRATE WITH LEAD PIN

Feedthrough flat-through capacitor

Electronic Assemblies without Solder and Methods for their Manufacture

Lead pin and wiring substrate with lead pin, and method of manufacturing the same

Surface mount contact

Lead pin for package substrate

System And Method For Processor Power Delivery And Thermal Management

Circuit device

MOUNT ASSEMBLY AND METHOD FOR MANUFACTURING MOUNT ASSEMBLY

Stacked Mounting Structure and Method of Manufacturing Stacked Mounting Structure

Lead pin for mounting semiconductor and printed wiring board

Power semiconductor module and fabrication method thereof

Method for Manufacturing PCB, Display Module and Method for Fabricating Display Module

Wiring board with lead pins and method of producing the same

Wiring board having lead pin, and lead pin

STUD, CIRCUIT BOARD DEVICE USING THE STUD, AND METHOD OF MOUNTING THE CIRCUIT BOARD DEVICE

Substrate device with a transmission line connected to a connector pad and method of manufacture

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE

Semiconductor package and method of manufacturing the same, and semiconductor device and method of manufacturing the same

Package substrate with a conductive connecting pin

Lead pin for package boards

Conductive pin attached to package substrate

COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS INCLUDING THE SAME

Probe card assembly and kit, and methods of making same

Semiconductor die packages with multiple integrated substrates, systems using the same, and methods using the same

METHOD AND APPARATUS TO REDUCE PIN VOIDS

Multi-layer wiring board and method of manufacturing the same

Multi-layer wiring board and method of manufacturing the same

Multilayer printed wiring board and component mounting method thereof

SHUNT RESISTOR WITH MEASUREMENT CIRCUIT

PGA TYPE WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

Multilayer substrate manufacturing method

PRINTED WIRING BOARD UNIT AND METHOD OF MAKING THE SAME

Conductive connecting pin and package substrate

Circuit module and circuit board assembly having surface-mount connector

Circuit device and method of manufacturing the same

Wiring board and method of manufacturing the same

Circuit device and method of manufacturing the same

Circuit device

Method to Form Pin Having Void Reducing Pin Head and Flattening Head to Perform the Method

Wiring substrate with lead pin and lead pin

Conductive connecting pins for a package substrate

Optical network unit transceiver module having direct connect RF pin configuration

WIRING SUBSTRATE WITH LEAD PIN AND LEAD PIN

TFCC (TM) and SWCC (TM) thermal flex contact carriers

Portable electronic device with conducting pole

Pin grid array package substrate including pins having anchoring elements

Pin grid array package substrate including pins having curved pin heads

Electronic assemblies without solder and methods for their manufacture

Substrate with pin, manufacturing method thereof, and semiconductor product

Pin grid array package substrate including slotted pins

SUBSTRATE WITH PIN, WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE

Contact carriers (tiles) for populating larger substrates with spring contacts

Contact lead

ELECTRIC CIRCUIT PACKAGE

Probe card assembly and kit

Stacked package and method for manufacturing the package

ELECTRONIC DEVICE

Multiple-board power converter

Joint member and joint connector for wire harness

Surface mounting piezoelectric oscillator

Method of manufacturing semiconductor device

Lead pin for mounting semiconductor and printed wiring board

System and method for reducing stress-related damage to ball grid array assembly

Wiring board with lead pins, and lead pin

Power semiconductor module and fabrication method thereof

Socket for making with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component

Interconnections resistant to wicking

SYSTEM AND METHOD FOR PROCESSOR POWER DELIVERY AND THERMAL MANAGEMENT

Flexible circuit connectors

Multilayer printed wiring board and component mounting method thereof

Method Of Wirebonding That Utilizes A Gas Flow Within A Capillary From Which A Wire Is Played Out

Probe For Semiconductor Devices

Plastic component having heat resistant hardened resin at thermal-attachment connection points

Plug-in device and method of making the same

Contact carriers (tiles) for populating larger substrates with spring contacts

Mounting Spring Elements on Semiconductor Devices, and Wafer-Level Testing Methodology

Column suction-holding head and column mounting method

Enhanced PGA Interconnection

System and method for processor power delivery and thermal management

Lead-free semiconductor package

Contact Structures Comprising A Core Structure And An Overcoat

Joint member and joint connector for wire harness

Wiring substrate and bonding pad composition

Probe card assembly and kit

Apparatuses and associated methods for improved solder joint reliability

Multilayer substrate and the manufacturing method thereof

Pitch converting connector and method of manufacture thereof

Probe for semiconductor devices

Enhanced PGA interconnection

Electrical switch having an electrical connection element

System and method for processor power delivery and thermal management

Encapsulation of pin solder for maintaining accuracy in pin position

Circuit carrier and fabrication method thereof

Package modification for channel-routed circuit boards

Surface mount connector and circuit board assembly with same

Multilayer wiring board including stacked via structure

Joint member and joint connector for wire harness

Interconnections

Probe card assembly

Contact structures and methods for making same

Printed wiring board and manufacturing method therefor

PCB arrangement and wiring structure of LED lamp beads

Gantry for thermal management

Thermal dissipation and shielding improvement using merged PCB bottom copper post

Fiber optic transceiver FPGA mezzanine card (FMC)

Multilayer structure and related method of manufacture for electronics

Remote control device having motherboard and battery daughterboard connected by interconnect

Pogo pin integrated circuit package mount