H05K2201/10439 - CPC Classification Index

ClassID:

234612 ⎘

H05K2201/10439 - CPC Classification

Classification description:

Indexing scheme relating to printed circuits covered by; Details of components or other objects attached to or integrated in a printed circuit board; Details of mounted components Position of a single component

Sub-classes:

H05K2201/10446 » Mounted on an edge 373
H05K2201/10446 » Mounted on an edge 373
H05K2201/10454 » Vertically mounted 73
H05K2201/10454 » Vertically mounted 73
H05K2201/10462 » Flat component oriented parallel to the PCB surface 47
H05K2201/10462 » Flat component oriented parallel to the PCB surface 47
H05K2201/10469 » Asymmetrically mounted component 7
H05K2201/10469 » Asymmetrically mounted component 7
H05K2201/10477 » Inverted 105
H05K2201/10477 » Inverted 105
H05K2201/10484 » Obliquely mounted 66
H05K2201/10484 » Obliquely mounted 66
H05K2201/10492 » Electrically connected to another device 61
H05K2201/10492 » Electrically connected to another device 61
H05K2201/105 » Mechanically attached to another device 28
H05K2201/105 » Mechanically attached to another device 28

Recent Application in this class:

20260040959

2026-02-05

CHIP ON LEAD DEVICE AND MANUFACTURING METHOD

20240334609

2024-10-03

ANTENNA MODULE

20240224414

2024-07-04

CIRCUIT BOARD

20220369524

2022-11-17

Optical module and method of manufacturing optical module

20210127478

2021-04-29

Component carrier with embedded component and horizontally elongated via

20180317318

2018-11-01

Stretchable circuit board and strain sensor

20160353567

2016-12-01

Stretchable flexible substrate including first insulating layer, second insulating layer, first metal layer, and second metal layer

20160316557

2016-10-27

Printed circuit board

20150083478

2015-03-26

Electric part soldered onto printed circuit board

#10

20150043176

2015-02-12

Circuit board and display device having the same

#11

20150041197

2015-02-12

EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT AND PRINTED CIRCUIT BOARD HAVING THE SAME

#12

20150036306

2015-02-05

Redistribution layer system in package

#13

20150022987

2015-01-22

ELECTRONIC DEVICE COMPRISING AN INTEGRATED CIRCUIT CHIP PROVIDED WITH PROJECTING ELECTRICAL CONNECTION PADS

#14

20150003020

2015-01-01

ELECTRONIC COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD HAVING COOLING MEMBER

#15

20140369014

2014-12-18

WIRING BOARD

#16

20140332260

2014-11-13

Method of manufacturing ceramic electronic component, ceramic electronic component, and wiring board

#17

20140311774

2014-10-23

BOARD, MOUNTING STRUCTURE OF SURFACE MOUNTING COMPONENT, AND ELECTRONIC DEVICE

#18

20130170147

2013-07-04

Method of manufacturing an electronic module

#19

20120018205

2012-01-26

Method of manufacturing a ceramic electronic component

#20

20100288535

2010-11-18

ELECTRONIC COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD COMPRISING COOLING MEMBER AND METHOD OF MANUFACTURING THE SAME

#21

16936487

2020-12-29

Wiring board