H05K2201/10431 - CPC Classification Index

ClassID:

234611 ⎘

H05K2201/10431 - CPC Classification

Classification description:

Indexing scheme relating to printed circuits covered by; Details of components or other objects attached to or integrated in a printed circuit board Details of mounted components

Sub-classes:

H05K2201/10439 » Position of a single component 19
H05K2201/10439 » Position of a single component 19
H05K2201/10507 » Involving several components 69
H05K2201/10507 » Involving several components 69
H05K2201/10553 » Component over metal, i.e. metal plate in between bottom of component and surface of PCB 49
H05K2201/10553 » Component over metal, i.e. metal plate in between bottom of component and surface of PCB 49
H05K2201/1056 » Metal over component, i.e. metal plate over component mounted on or embedded in PCB 191
H05K2201/1056 » Metal over component, i.e. metal plate over component mounted on or embedded in PCB 191
H05K2201/10568 » Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element 93
H05K2201/10568 » Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element 93
H05K2201/10575 » Insulating foil under component 22
H05K2201/10575 » Insulating foil under component 22
H05K2201/10583 » Cylindrically shaped component; Fixing means therefore 47
H05K2201/10583 » Cylindrically shaped component; Fixing means therefore 47
H05K2201/1059 » Connections made by press-fit insertion 293
H05K2201/1059 » Connections made by press-fit insertion 293
H05K2201/10598 » Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB 290
H05K2201/10598 » Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB 290
H05K2201/10606 » Permanent holder for component or auxiliary PCB mounted on a PCB 109
H05K2201/10606 » Permanent holder for component or auxiliary PCB mounted on a PCB 109

Recent Application in this class:

20260075723

2026-03-12

ELECTRONIC MODULE AND METHOD FOR MANUFACTURING ELECTRONIC MODULE

20240215171

2024-06-27

STRAP FOR A WEARABLE DEVICE

20240080986

2024-03-07

CONTAMINANT SHIELD FOR AN OSCILLATOR

20230369256

2023-11-16

Multi-Device Power Module Arrangement

20230180393

2023-06-08

Three-dimensional patterned module exterior surface for improved heat dissipation and method of fabricating

20220404865

2022-12-22

Attaching apparatus and attaching method

20220279685

2022-09-01

Electronic device including PCB including shielding structure, and PCB

20210333492

2021-10-28

Optical module

20210324936

2021-10-21

Vibration isolator and method of assembly using flex circuits

#10

20210100129

2021-04-01

Power conversion device including cooling components

#11

20200388438

2020-12-10

Method of manufacturing electronic device and the same

#12

20200366168

2020-11-19

Power conversion device

#13

20200274268

2020-08-27

Electrical terminal and electrical connector thereof

#14

20200267875

2020-08-20

ELECTRONIC APPARATUS HAVING NOISE SUPPRESSION MECHANISM

#15

20200259280

2020-08-13

Electrical connector and connector assembly thereof

#16

20190296463

2019-09-26

Mobile terminal, power adapter and power interface

#17

20190148854

2019-05-16

Mobile terminal, power interface, and method for manufacturing power interface

#18

20190080841

2019-03-14

Method of manufacturing electronic device and the same

#19

20190020129

2019-01-17

Electrical contact terminal

#20

20170228060

2017-08-10

Appliance User Interface Panel Having Integrated Components

#21

20170215280

2017-07-27

SELECTIVE TRANSFER OF MICRO DEVICES

#22

20170048982

2017-02-16

Resin-sealed module

#23

20160270230

2016-09-15

Component support for dense circuit board

#24

20150049445

2015-02-19

METHOD FOR MANUFACTURING ELECTRONIC COMPONENT EMBEDDING SUBSTRATE AND ELECTRONIC COMPONENT EMBEDDING SUBSTRATE

#25

20140226288

2014-08-14

Component-embedded resin substrate

#26

20140217608

2014-08-07

SEMICONDUCTOR MODULE, CIRCUIT BOARD

#27

20140216801

2014-08-07

METHOD OF MANUFACTURING COMPONENT-EMBEDDED SUBSTRATE AND COMPONENT-EMBEDDED SUBSTRATE MANUFACTURED BY THE SAME

#28

16100456

2019-10-22

Connection pad for embedded components in PCB packaging

#29

16028238

2022-01-11

Heat transfer in the printed circuit board of an SMPS by an integrated heat exchanger