Electrical power conversion system

Rectangular waveguide communication between memory and processor

High density coil design and process

WIRING BOARD UNIT FOR DISK DEVICES, ACTUATOR ASSEMBLY FOR DISK DEVICES AND DISK DEVICE COMPRISING THE SAME

Pet care device

MEMORY SYSTEM AND STORAGE SYSTEM

SEMICONDUCTOR MEMORY MODULE AND SEMICONDUCTOR MEMORY MODULE BOARD

Direct current link bus for a power converter and method of forming a direct current link bus

High speed electrical connector for compact electronic systems

Resin multilayer substrate and an electronic device and a joint structure of a resin multilayer substrate

Mmwave waveguide to waveguide connectors for automotive applications

Low profile, nesting capacitor collars

Light guide plate providing protection for electronics components of a printed circuit board

Manufacturing method of a display device

Electronic device

Electrical equipment for an automobile vehicle

Methods and apparatus for mitigating temperature increases in a solid state device (SSD)

Tamper-respondent assembly with interconnect characteristic(s) obscuring circuit layout

Optical projection device

Drive device and electric power steering device using same

Wire arrangement with ground staples on printed circuit board

Electronic module

Die-level error recovery scheme

Electronic module for a transmission control unit, and transmission control unit

Display apparatus including frame for supporting printed circuit board

Stacked and folded above motherboard interposer

Dual-Interface Reversible Plug-in Power Source and Data Docking Station

Structure of a fob key for increasing the operating force of a button

Module

Electronic unit and method of making the same

Semiconductor storage device

Method and apparatus for flexure testing of electronic components

Semiconductor storage device

Electronic apparatus

SiP module and manufacturing method of the SiP module

Embedded organic interposer for high bandwidth

Circuit carrier board and manufacturing method thereof

Circuit carrier board structure and manufacturing method thereof

Wireless communication with dielectric medium

Integrating system in package (SiP) with input/output (IO) board for platform miniaturization

Backlight bar, backlight module and display device

Electronic components

Electronic structure comprising a matrix array of electronic devices having improved thermal performances

Interface arrangement on a system board and computer system

Edgelit light emitting diode retrofit lamp

Cooling of power electronics circuits

Joint structure of a resin multilayer substrate and a circuit board

Light source package, backlight unit including light source package, and display device using the same

Illumination fan

Inductively balanced power supply circuit and method of manufacture

Electronic device module

COMMUNICATION MODULE

Component carrier connected with a separate tilted component carrier for short electric connection

CONDUCTOR PAD FOR FLEXIBLE CIRCUITS AND FLEXIBLE CIRCUIT INCORPORATING THE SAME

Voltage determination device

Symmetrical power stages for high power integrated circuits

Module

Semiconductor memory device

Displays with direct-lit backlight units including light-emitting diodes and encapsulant

Displays with direct-lit backlight units

Displays with direct-lit backlight units and color conversion layers

Light-emitting diodes in displays with direct-lit backlight units

Displays with direct-lit backlight units and light spreading structures

Multi-mode and/or multi-speed non-volatile memory (NVM) express (NVMe) over fabrics (NVMe-of) device

Antenna module

Capacitor loop structure

Circuit module

METHODS FOR REDUCING RADIATED EMISSIONS FROM POWER AMPLIFIERS

Electronic components

Input interface device with semiconductor strain gage

Optical projector module, three-dimensional image sensing apparatus, and method of sensing

Display device with light source control

Method and system for monitoring information of a memory module in real time

Interconnection system with hybrid transmission

Light pipe assembly

Electronic component, electronic component manufacturing method, and mechanical component

Magnetoresistive memory module and computing device including the same

POWER SUPPLY DEVICE, HEADLIGHT AND MOVING BODY

SWITCHING POWER MODULE COMBINING A GATE DRIVER WITH A PHOTONIC ISOLATED POWER SOURCE

Solid state drive apparatus and data storage system having the same

Memory heat dissipation unit

Ceramic electronic component

Display module and method for coating the same

Printed wiring board

Interposer with high bandwidth connections between a central processor and memory

Light source unit for vehicle headlight and vehicle headlight

Switch device

Heat dissipation system of enclosed electronic module with single/multiple active components

Solid state drive apparatus

Method for producing a power electronics system

Circuit assembly having a heat transfer member

Printed circuit board for integrated LED driver

BACKLIGHT ASSEMBLY, DISPLAY DEVICE INCLUDING THE SAME, AND METHODS OF FABRICATING THE BACKLIGHT ASSEMBLY AND THE DISPLAY DEVICE

Capacitor and board having the same

Electronic circuit board

Capacitor module, resonator, wireless power transmission device, wireless power reception device, and wireless power transmission system

Mechanically-compliant and electrically and thermally conductive leadframes for component-on-package circuits

Backlight unit and liquid crystal display device including the same

Assemblies including heat dispersing elements and related systems and methods

Mounting system for mechanical-shock resistant printed circuit board (PCB)

Encapsulation of downhole microelectronics and method the same

Systems and apparatuses for power electronics with high current carrying conductors

Communication module packaging

DDR electronic module assembly

Circuit mounting structure and lead frame for system in package (SIP) devices

Symmetrical power stages for high power integrated circuits

Power supply device

Circuit board and control device

Touch-controlling device, functional expansion member thereof, and USB socket connector

Circuit board, motor driving apparatus, and electric power steering apparatus

Memory device with plurality of interface connectors

ELECTRONIC COMPONENT ALIGNMENT DEVICE AND METHOD

Memory device with memory modules located within liquid coolant chamber

Backlight unit and liquid crystal display device including the same

Power module with integrated liquid cooling

PCB Assembly with Molded Matrix Core

Multilayer ceramic substrate and electronic device

Power module assembly and assembling method thereof

System and method for rapid current sensing and transistor timing control

Solar origami-like portable light assembly and device charger

Lighting system, headlamp, and method for producing a lighting system

Power conversion device

Magnetic adjustment tool for a display module

Circuit board and communication device with side coupler

Miniature printed circuit board mounted haptic device

Methods and apparatus for programming an integrated circuit using a configuration memory module

Component-embedded substrate and method for manufacturing component-embedded substrate

Power supply module and power supply device

Tamper-respondent assembly with interconnect characteristic(s) obscuring circuit layout

Tamper-respondent assembly with interconnect characteristic(s) obscuring circuit layout

Configurable smart object system with methods of making modules and contactors

Front-end circuit and high-frequency module

Light source device, backlight device comprising the same and liquid crystal display device

Circuit substrate

High density organic bridge device and method

Electronic control unit and electric power steering device using the same

Electronic device and method for disposing electromagnetic interference suppressor

Multi-planar circuit board having reduced z-height

Surface mount multilayer coupling capacitor and circuit board containing the same

Printed circuit board and semiconductor package structure

Printed circuit board and semiconductor package structure

Printed circuit board and semiconductor package structure

Capacitor substrate unit for opening/closing module

Power conversion apparatus and method of producing the same

Multilayer structure and related method of manufacture for electronics

Inverter

Power module, power module assembly and assembling method thereof

Integrating system in package (SIP) with input/output (IO) board for platform miniaturization

WATERPROOF SEALED CIRCUIT APPARATUS AND METHOD OF MAKING THE SAME

Heat spreaders with staggered fins

Taping electronic component array

Non-etched wiring board for LED applications

Electronic component module, DC-DC converter, and electronic device

Circuit board module

GLASS WIRED SUBSTRATE AND POWER MODULE

Reduction of passive components in system-in-package devices

Wireless interconnects on flexible cables between computing platforms

Capacitor and board having the same

STACKED OUTPUT STRUCTURE OF CAPACITIVE POWER SUPPLY FOR WELDING EQUIPMENT

Illumination device for a fluid delivery apparatus

Faucet illumination device

Linear lighting with distributed power conversion and reduced flicker

Data processing device

Luminaire circuit board and method for manufacturing a luminaire circuit board

Resin multilayer substrate and electronic device

Light-emitting diode apparatus and method for manufacturing a light-emitting diode apparatus

Device for bending sheet, LED module and display screen

Wireless communications with dielectric medium

Capacitor and substrate module

Printing apparatus and power supply unit for printing apparatus

Electronic device

Printed wiring board and method for manufacturing the same

Semiconductor device

Proximity sensor

Circuit board and lighting apparatus

Mounting aid and method for mounting electrical components on a printed circuit board

Stretchable board

Light source module and lighting device having same

CURVED SHIELD ON A CIRCUIT BOARD

Electronic apparatus, electronic apparatus manufacturing method, and die

LIGHT SENSOR LEAD FRAME SUBSTRATE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

Filter circuit, multiplexer, and module

Electronic Control Device

Sensor for measuring a position

Illuminated display

Evacuated core circuit board

Media-tight control device for a motor vehicle

Media-tight control device for a motor vehicle and method for producing the control device

Component module

Electronic control unit

REDUCING THERMAL CYCLING FATIGUE

Reducing thermal cycling fatigue

Multi-layer printed circuit board and a wireless communication node

Configurable semiconductor package

Semiconductor device and semiconductor device manufacturing method

Optical module

Electronic module with a component which can be flexibly placed by means of a base element, and method for producing same

Camera module and array camera module based on integral packaging technology

Method for manufacturing an electronic device and method for operating an electronic device

Hybrid-type power module having dual-sided cooling

Electronic Module

Electronic module

Display device

Printed circuit board and solid state drive apparatus having the same

Semiconductor device

Display device

HIGH-FREQUENCY MODULE

Motherboard of computer

Protective heat shields for thermally sensitive components and methods for protecting thermally sensitive components

METHOD FOR MANUFACTURING CAPACITOR BUILT-IN SUBSTRATE

Electronic device and display device

Amplifier and optical transmitter using the same

EMI shielding structure

Passive bias temperature compensation circuit module

Printed circuit boards and solid state drives including the same

Display device

Method of forming a plurality of electro-optical module assemblies

Method of forming a plurality of electro-optical module assemblies

Capacitor component

Integrated electro-optical module assembly

High-frequency module

PCB assembly with molded matrix core

High-frequency module

Control and power module for brushless motor

Optoelectronic assembly, and method for producing an optoelectronic assembly

Control and power module for brushless motor

High-frequency module

BATTERY PACK WITH CIRCUIT BOARD HAVING NESTED CASTELLATIONS FOR SUB-FLUSH POWER WIRE SOLDERING

Air-cavity package with two heat dissipation interfaces

Capacitor with improved heat dissipation

Semiconductor detector

Vertical shielding and interconnect for SIP modules

Half-bridge switching circuit system

Intelligent power module and manufacturing method thereof

Electronic component

Electronic component-embedded board and electronic component device

Printable 3D electronic structure

Multi-surface edge pads for vertical mount packages and methods of making package stacks

SINGLE BASE MULTI-FLOATING SURFACE COOLING SOLUTION

Mounting substrate

WIRING BOARD AND ELECTRONIC APPARATUS

LED module and method of sealing

Printed circuit board for integrated LED driver

Metal PCB assembly for vehicle lamp and manufacturing method thereof

Electrical device, model series of electrical devices, and production method

Electronic device

Linear lighting with distributed onboard power conversion and filtering

Electric connector with mounting surface

Printed substrate and electronic device

Component carrier and method to produce said component carrier

Display module and method for coating the same

Electronic Assembly and Method for the Production thereof

Camera module and array camera module based on integral packaging technology

Encapsulated Circuit Module, And Production Method Therefor

STRUCTURAL BRACE FOR ELECTRONIC CIRCUIT WITH STRETCHABLE SUBSTRATE

METHOD AND DEVICE FOR POTTING AN LED LUMINAIRE POTTED IN A POTTING COMPOUND, AND LED LUMINAIRE

Mounted structure of laminated capacitor, and method of mounting laminated capacitor

Printed circuit board having a plurality of electronic components arranged on the printed circuit board in at least one group

Resin substrate and electronic device

MECHANICALLY-COMPLIANT AND ELECTRICALLY AND THERMALLY CONDUCTIVE LEADFRAMES FOR COMPONENT-ON-PACKAGE CIRCUITS

Small pitch direct view display and method of making thereof

Power conversion apparatus

Capacitor mounting structure

Systems and methods for thermal management for high power density EMI shielded electronic devices

Printed wiring board, circuit board, and control unit

Substrate for system in package (SIP) devices

Wireless communication module and solar photovoltaic system

System and method for monitoring conditions of a subject based on wireless sensor data

Automation module for building automation

Electronic circuit board assembly including EMI shielding structure and thermal pad

RADIO IC DEVICE

Wiring board with stacked embedded capacitors and method of making

Electronic apparatus

Single base multi-floating surface cooling solution

Circuit assembly

Conductor pad for flexible circuits and flexible circuit incorporating the same

Formable shielding film

Circuit substrate and method for managing the placement of one or more capacitors

Sensor device and sensor arrangement

Electronic device with shield structure

Integrated circuit, electronic device and method for transmitting data in electronic device

Composite electronic component and board on which composite electronic component is mounted

Power amplifier die configurations having reduced radiated emissions

Methods for reducing radiated emissions from power amplifiers

Wireless communication with dielectric medium

Electronic device and substrate

Flexible electronic assemblies with embedded electronic devices and methods for their fabrication

Data processing device

Data processing device

Resin-sealed module

Semiconductor device

Mounting system for mechanical-shock resistant printed circuit board (PCB)

Circuitry on printed circuit boards in a plurality of planes, having an interface for a plug-in board

Cable connection structure and cable arranging part

Circuit module

Optimized high current connector pattern for PDB

Radio IC device

Electronic component

Package structure including a package substrate having an integrated waveguide coupled to first and second integrated circuits, where the package substrate is mounted to an application board