ClassID:

234639

H05K2201/10643 - CPC Classification

Classification description:

Indexing scheme relating to printed circuits covered by; Details of components or other objects attached to or integrated in a printed circuit board; Details of electrical connections of non-printed components, e.g. special leads; Components characterised by their electrical contacts Disc shaped leadless component

Recent Application in this class:
#1
20230109385
2023-04-06

Electronic device including coin-cell battery

#2
20220192025
2022-06-16

Holder for a button cell, arrangement comprising a holder, and method for automatically mounting a holder

#3
20160007481
2016-01-07

Chip capacitors

#4
20140055968
2014-02-27

Apparatus and method for vertically-structured passive components

#5
20130011972
2013-01-10

Method of producing laminated device

#6
20120081832
2012-04-05

Chip Capacitor Precursors

#7
20120079717
2012-04-05

Assembly method for converting the precursors to capacitors

#8
20120039053
2012-02-16

SYSTEM AND METHOD FOR COUPLING A BATTERY WITHIN AN EMBEDDED SYSTEM

#9
20110183162
2011-07-28

Surface mountable PPTC device with integral weld plate

#10
20110180312
2011-07-28

Printed circuit board with embedded chip capacitor

#11
20110179642
2011-07-28

Chip capacitor embedment method

#12
20110085311
2011-04-14

Apparatus and method for vertically-structured passive components

#13
20110031611
2011-02-10

Embedded laminated device

#14
20100165525
2010-07-01

Low profile discrete electronic components and applications of same

#15
20100083497
2010-04-08

Method for coupling a battery within an embedded system

#16
20100055943
2010-03-04

CIRCUIT BOARD FOR MEMORY CARD, AND MEMORY CARD HAVING THE SAME

#17
20100027228
2010-02-04

Semiconductor device and method for manufacturing the same

#18
20090296310
2009-12-03

CHIP CAPACITOR PRECURSORS, PACKAGED SEMICONDUCTORS, AND ASSEMBLY METHOD FOR CONVERTING THE PRECURSORS TO CAPACITORS

#19
20090273079
2009-11-05

SEMICONDUCTOR PACKAGE HAVING PASSIVE COMPONENT BUMPS

#20
20090215231
2009-08-27

Method of manufacturing electronic component built-in substrate

#21
20090183905
2009-07-23

Circuit board configuration

#22
20090085691
2009-04-02

Printed circuit board with embedded chip capacitor and chip capacitor embedment method

#23
20080081253
2008-04-03

Lead plate-attached coin-type battery whose lead plate is attached to exclusively either an outer can or a cap

#24
20070194876
2007-08-23

Multi-layer board with decoupling function

#25
20060291173
2006-12-28

Printed circuit board with embedded electronic components

#26
20060198079
2006-09-07

Embedded multilayer chip capacitor and printed circuit board having the same

#27
20050287423
2005-12-29

Battery holder

#28
20050225408
2005-10-13

Direct current cut structure

#29
20050200447
2005-09-15

Surface mountable PPTC device with integral weld plate