H05K2201/10621 - CPC Classification Index

ClassID:

234636 ⎘

H05K2201/10621 - CPC Classification

Classification description:

Indexing scheme relating to printed circuits covered by; Details of components or other objects attached to or integrated in a printed circuit board; Details of electrical connections of non-printed components, e.g. special leads Components characterised by their electrical contacts

Sub-classes:

H05K2201/10628 » Leaded surface mounted device 88
H05K2201/10628 » Leaded surface mounted device 88
H05K2201/10636 » Leadless chip, e.g. chip capacitor or resistor 944
H05K2201/10636 » Leadless chip, e.g. chip capacitor or resistor 944
H05K2201/10643 » Disc shaped leadless component 29
H05K2201/10643 » Disc shaped leadless component 29
H05K2201/10651 » Component having two leads, e.g. resistor, capacitor 140
H05K2201/10651 » Component having two leads, e.g. resistor, capacitor 140
H05K2201/10659 » Different types of terminals for the same component, e.g. solder balls combined with leads 67
H05K2201/10659 » Different types of terminals for the same component, e.g. solder balls combined with leads 67
H05K2201/10666 » Plated through-hole for surface mounting on PCB 65
H05K2201/10666 » Plated through-hole for surface mounting on PCB 65
H05K2201/10674 » Flip chip 1,7K
H05K2201/10674 » Flip chip 1,7K
H05K2201/10681 » Tape Carrier Package [TCP]; Flexible sheet connector 162
H05K2201/10681 » Tape Carrier Package [TCP]; Flexible sheet connector 162
H05K2201/10689 » Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL] 552
H05K2201/10689 » Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL] 552
H05K2201/10696 » Single-in-line [SIL] package 7
H05K2201/10696 » Single-in-line [SIL] package 7
H05K2201/10704 » Pin grid array [PGA] 109
H05K2201/10704 » Pin grid array [PGA] 109
H05K2201/10712 » Via grid array, e.g. via grid array capacitor 49
H05K2201/10712 » Via grid array, e.g. via grid array capacitor 49
H05K2201/10719 » Land grid array [LGA] 228
H05K2201/10719 » Land grid array [LGA] 228
H05K2201/10727 » Leadless chip carrier [LCC], e.g. chip-modules for cards 231
H05K2201/10727 » Leadless chip carrier [LCC], e.g. chip-modules for cards 231
H05K2201/10734 » Ball grid array [BGA]; Bump grid array 1,5K
H05K2201/10734 » Ball grid array [BGA]; Bump grid array 1,5K

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Circuit module

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Electronic device

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Printed wiring board

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BI-DIRECTIONAL OPTICAL SUB ASSEMBLY CONNECTING STRUCTURE

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Circuit module and method of manufacturing the same

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Electronic device including at least one electronic chip and electronic package

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Adjustable circuit board assembly

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Solder paste with oxalic acid and amine component

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Reflected signal absorption in interconnect

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Electronic control device

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Method of forming a circuit board

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Electronic component package and method for forming same

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Bump electrode, board which has bump electrodes, and method for manufacturing the board

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Utilizing chip-on-glass technology to jumper routing traces

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OPTICAL CONNECTOR AND CIRCUIT BOARD OF SAME

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Printed circuit board trace for galvanic effect reduction