Patents-Review.com
ClassID:

234641 ⎘

H05K2201/10659 - CPC Classification

Classification description:

Indexing scheme relating to printed circuits covered by; Details of components or other objects attached to or integrated in a printed circuit board; Details of electrical connections of non-printed components, e.g. special leads; Components characterised by their electrical contacts Different types of terminals for the same component, e.g. solder balls combined with leads

Recent Application in this class:
#1
20240397614
2024-11-28

PRINTED CIRCUIT BOARD ASSEMBLY

 #2
20240268031
2024-08-08

CIRCUIT BOARD AND CHIP PACKAGE COMPRISING SAME

 #3
20240147619
2024-05-02

SUBSTRATE STRUCTURE CONNECTED ON BASIS OF SOLDER BALL AND ELASTIC BODY

 #4
20230284378
2023-09-07

STORAGE DEVICE INCLUDING CONFIGURABLE PRINTED CIRCUIT BOARD

 #5
20230093341
2023-03-23

Semiconductor Package Comprising a Cavity with Exposed Contacts and a Semiconductor Module

 #6
20220399256
2022-12-15

Semiconductor device, printed circuit board (PCB), and method of interfacing control pin (gate pin) of a power semiconductor device (MOSFET) to a printed circuit board (PCB)

 #7
20210307169
2021-09-30

Solderable circuit board module system

 #8
20210048489
2021-02-18

Magnetic sensor component and assembly

 #9
20190293728
2019-09-26

Magnetic sensor component and assembly

 #10
20190090348
2019-03-21

High density multi-component packages

 #11
20190082539
2019-03-14

High density multi-component packages

 #12
20190075658
2019-03-07

Electric connection structure and electric connection member

 #13
20170273192
2017-09-21

Electric connection structure and electric connection member

 #14
20140182914
2014-07-03

Universal serial bus hybrid footprint design

 #15
20140041920
2014-02-13

Printed circuit board

 #16
20120162924
2012-06-28

Integrated Semiconductor Outline Package

 #17
20120155044
2012-06-21

ELECTRONIC CIRCUIT BOARD AND A RELATED METHOD THEREOF

 #18
20110266672
2011-11-03

INTEGRATED-CIRCUIT ATTACHMENT STRUCTURE WITH SOLDER BALLS AND PINS

 #19
20110201216
2011-08-18

Printed board, and car-mounted electric connection box containing the printed board

 #20
20110157855
2011-06-30

INTEGRATED CIRCUITS HAVING LEAD CONTACTS AND LEADLESS CONTACT PADS CONNECTED TO A SURFACE OF A PRINTED WIRING BOARD, AND METHODS FOR CONNECTING THE SAME

 #21
20110156203
2011-06-30

INTEGRATED PASSIVE DEVICE ASSEMBLY

 #22
20110101075
2011-05-05

Apparatus and methods of attaching hybrid vlsi chips to printed wiring boards

 #23
20110043345
2011-02-24

Dashboard indicator module formed by a motor and electrical connection means

 #24
20110018669
2011-01-27

Low profile inductors for high density circuit boards

 #25
20100327709
2010-12-30

Semiconductor module and electronic circuit-integrated motor device using same

 #26
20100220454
2010-09-02

Printed circuit board

 #27
20100134228
2010-06-03

Choke module having improved terminal arrangement

 #28
20100127402
2010-05-27

Interconnect System without Through-Holes

 #29
20100046185
2010-02-25

Printed circuit board

 #30
20100039196
2010-02-18

Electromagnetic relay

 #31
20100007006
2010-01-14

Integrated semiconductor outline package

 #32
20100006863
2010-01-14

Optical semiconductor device with flexible substrate

 #33
20100003843
2010-01-07

SMT/DIP TYPE CONNECTOR STRUCTURE HAVING AT LEAST THREE ROWS OF TERMINALS

 #34
20090256255
2009-10-15

Composite interconnect

 #35
20090251446
2009-10-08

Liquid crystal display device

 #36
20090250506
2009-10-08

Apparatus and methods of attaching hybrid vlsi chips to printed wiring boards

 #37
20090196002
2009-08-06

Printed wiring board unit

 #38
20090149041
2009-06-11

Orthogonal Backplane Connector

 #39
20090032822
2009-02-05

High power light emitting diode

 #40
20080291602
2008-11-27

STACKED MULTILAYER CAPACITOR

 #41
20080283982
2008-11-20

Multi-chip semiconductor device having leads and method for fabricating the same

 #42
20080151512
2008-06-26

Enhanced Ball Grid Array Package

 #43
20080137315
2008-06-12

Electronic component device and method of mounting electronic component

 #44
20080083554
2008-04-10

HYBRID BONDED FLEX CIRCUIT

 #45
20080081253
2008-04-03

Lead plate-attached coin-type battery whose lead plate is attached to exclusively either an outer can or a cap

 #46
20080038943
2008-02-14

Electric junction box

 #47
20080024424
2008-01-31

Liquid Crystal Display Device

 #48
20070290341
2007-12-20

SEMICONDUCTOR PACKAGE AND METHOD OF MOUNTING THE SAME

 #49
20070279878
2007-12-06

Circuit board including hybrid via structures

 #50
20070257375
2007-11-08

Increased interconnect density electronic package and method of fabrication

 #51
20070051535
2007-03-08

CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE UTILIZING THE SAME

 #52
20070002551
2007-01-04

PRINTED CIRCUIT BOARD ASSEMBLY

 #53
20070002254
2007-01-04

Liquid crystal display device

 #54
20060267217
2006-11-30

Apparatuses and associated methods for improved solder joint reliability

 #55
20060231935
2006-10-19

BGA type semiconductor package featuring additional flat electrode teminals, and method for manufacturing the same

 #56
20060228912
2006-10-12

Orthogonal backplane connector

 #57
20060216972
2006-09-28

Method for repair soldering of multi-pole miniature plug connectors

 #58
20060208357
2006-09-21

Integrated device and electronic system

 #59
20060139892
2006-06-29

Heat dissipating arrangement for an electronic appliance

 #60
20060078715
2006-04-13

Bonding structure of device packaging

 #61
20060067057
2006-03-30

Heat sink module

 #62
20050257958
2005-11-24

Package modification for channel-routed circuit boards

 #63
20050236706
2005-10-27

Semiconductor device and hybrid integrated circuit device

 #64
20050189640
2005-09-01

Interconnect system without through-holes

 #65
20050189138
2005-09-01

Electronic assembly and method of manufacture thereof

 #66
20050162604
2005-07-28

Display device

 #67
20050077610
2005-04-14

Ball grid array package with external leads