234646 ⎘
Indexing scheme relating to printed circuits covered by; Details of components or other objects attached to or integrated in a printed circuit board; Details of electrical connections of non-printed components, e.g. special leads; Components characterised by their electrical contacts Single-in-line [SIL] package
ASSEMBLABLE SUBSTRATE FOR IN-LINE PACKAGE AND ASSEMBLY WITH SAME
#2Method of fabricating a vertically mountable IC package
#3Electrical device allowing for increased device densities
#4Vertically mountable and alignable semiconductor device packages and assemblies including the same
#5Methods for securing packaged semiconductor devices to carrier substrates
#6Semiconductor device packages including leads with substantially planar exposed portions extending from bottom edges of the packages, and assemblies including the packages
#7Alignment devices for securing semiconductor devices to carrier substrates, and assemblies including the alignment devices