Localized Soldering U&C Shape with Metal Pin Design

PIN ARRANGEMENT STRUCTURE, PACKAGE SUBSTRATE, AND PACKAGE STRUCTURE

EMBEDDED COOLING SYSTEMS FOR ADVANCED DEVICE PACKAGING AND METHODS OF MANUFACTURING THE SAME

ELECTRONIC CIRCUIT BOARD

EMBEDDED COOLING SYSTEMS FOR ADVANCED DEVICE PACKAGING AND METHODS OF MANUFACTURING THE SAME

Pluggable CPU Modules with Vertical Power

CONNECTION COMPONENTS FOR CONNECTING A SEMICONDUCTOR PACKAGE WITH A BOTTOM STIFFENER TO A PRINTED CIRCUIT BOARD

PACKAGE DEVICE INCLUDING CAPACITOR DISPOSED ON OPPOSITE SIDE OF DIE RELATIVE TO SUBSTRATE

STAGGERED DUAL-SIDE MULTI-CHIP INTERCONNECT

COMPRESSED PINOUTS FOR HIGH-SPEED DIFFERENTIAL PAIRS

POWER REGULATOR INTERFACES FOR INTEGRATED CIRCUITS

Pluggable CPU modules with vertical power

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Staggered dual-side multi-chip interconnect

POWER SUPPLY MODULE AND POWER DEVICE

Short interconnect assembly with strip elastomer

Electronic-component carrier board and a wiring method for the same

Electronic assembly including a compression assembly for cable connector modules

Short interconnect assembly with strip elastomer

Short interconnect assembly with strip elastomer

Integrating system in package (SiP) with input/output (IO) board for platform miniaturization

Semiconductor device and manufacturing method thereof

Systems and methods for providing a high speed interconnect system with reduced crosstalk

Integrating system in package (SiP) with input/output (IO) board for platform miniaturization

Socket connector for an electronic package

Socket connector assembly for an electronic package

Cable socket connector assembly for an electronic

Embedding component with pre-connected pillar in component carrier

Information handling system interposer enabling specialty processor integrated circuit in standard sockets

Integrating system in package (SIP) with input/output (IO) board for platform miniaturization

System-in-Package device ball map and layout optimization

Information handling system interposer enabling specialty processor integrated circuit in standard sockets

Array type discrete decoupling under BGA grid

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Control circuit board and robot control device

Printed wiring board

Pin connector structure and method

Semiconductor device and manufacturing method thereof

CPU package substrates with removable memory mechanical interfaces

Cable for alternative interconnect attachement

Ball grid array formed on printed circuit board

Bump structure, wiring substrate, semiconductor apparatus and bump structure manufacturing method

Consolidated thermal module

Reducing loadline impedance in a system

Delta arrangement of hexagonal-close-packed signal pairs

Planar contact with solder

Consolidated thermal module

METHOD AND SYSTEM FOR PROCESSING FROZEN ADHESIVE PARTICLES

Electronic device and noise suppression method

SEMICONDUCTOR DEVICE AND ELECTRONIC COMPONENT MODULE USING THE SAME

Lead pin for package substrate, and method for manufacturing package substrate with the same

THERMAL FLEX CONTACT CARRIERS #2

Multimode signaling on decoupled input/output and power channels

Electronic passive device

Electrical connection arrangement having PCB with contacts received therein

Multimode signaling on decoupled input/output and power channels

System And Method For Processor Power Delivery And Thermal Management

Planar contact with solder

Method and system for processing frozen adhesive particles

Method of connecting a grid array package to a printed circuit board

POP PACKAGE AND METHOD OF FABRICATING THE SAME

Interconnect System without Through-Holes

Multimode signaling on decoupled input/output and power channels

DIRECT ATTACH INTERCONNECT FOR CONNECTING PACKAGE AND PRINTED CIRCUIT BOARD

Apparatus for electrically coupling a semiconductor package to a printed circuit board

SEMICONDUCTOR PACKAGE HAVING A GRID ARRAY OF PIN-ATTACHED BALLS

Assembly of Encapsulated Electronic Components to a Printed Circuit Board

Electronic assemblies without solder having overlapping components

TFCC (TM) and SWCC (TM) thermal flex contact carriers

Method and apparatus for stackable modular integrated circuits

Rugged Chip Packaging

ELECTRONIC SYSTEM WITH INTEGRATED CIRCUIT DEVICE AND PASSIVE COMPONENT

Passive electronic device

Semiconductor device power interconnect striping

POP package and method of fabricating the same

Interconnections resistant to wicking

Printed circuit board unit

SYSTEM AND METHOD FOR PROCESSOR POWER DELIVERY AND THERMAL MANAGEMENT

Flexible circuit connectors

Electronic component with high density, low cost attachment

System and method of using a compliant lead interposer

Semiconductor device and electronic component module using the same

Expanding high speed transport interface hardware method for motherboard

Universal integrated circuit programming socket board rewirable by means of an interconnect adapter board

Computer system and bridge module thereof

Method for reducing loadline impedance in a system

LSI package provided with interface module

Enhanced PGA Interconnection

System and method for processor power delivery and thermal management

Electronic package connected to a substrate

PCI mezzanine card

Power delivery to base of processor

Soldering method & its applied circuit board

Pitch converting connector and method of manufacture thereof

Adapter module

Systems and methods for providing co-processors to computing systems

METHOD FOR ATTACHING AN INTEGRATED CIRCUIT PACKAGE TO A CIRCUIT BOARD

Flexible cable for high-speed interconnect

Hybrid compression socket connector for integrated circuits

Enhanced PGA interconnection

Semiconductor package having a grid array of pin-attached balls

Reducing loadline impedance in a system

Sheet capacitor, IC socket using the same, and manufacturing method of sheet capacitor

System and method for processor power delivery and thermal management

Enhanced blind hole termination of pin to PCB

Package modification for channel-routed circuit boards

Semiconductor device power interconnect striping

PIN GRID ARRAY PACKAGE CARRIER AND PROCESS OF MOUNTING PASSIVE COMPONENT THEREON

Interconnect system without through-holes

Interconnect structure and method for connecting buried signal lines to electrical devices

LSI package provided with interface module

Wire loop grid array package

Stair step printed circuit board structures for high speed signal transmissions

Interconnections

Systems and methods for providing a high speed interconnect system with reduced crosstalk