234648 ⎘
Indexing scheme relating to printed circuits covered by; Details of components or other objects attached to or integrated in a printed circuit board; Details of electrical connections of non-printed components, e.g. special leads; Components characterised by their electrical contacts Via grid array, e.g. via grid array capacitor
HIGH-DENSITY DECOUPLING CAPACITOR ROUTING OPTIMIZING CAPACITANCE WITH CONSIDERATION FOR HIGH-YIELD MANUFACTURING
#2Fine pitch component placement on printed circuit boards
#3Electronic apparatus, and circuit board and control device thereof
#4Component carrier and manufacturing method
#5Array type discrete decoupling under BGA grid
#6Ball grid array formed on printed circuit board
#7Method of manufacturing wiring substrate having built-in component
#8Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate
#9PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
#10Capacitor for incorporation in wiring board, wiring board, method of manufacturing wiring board, and ceramic chip for embedment
#11Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate
#12Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate
#13Component-incorporating wiring board
#14PRINTED CIRCUIT BOARD UNIT AND ELECTRONIC DEVICE
#15Ceramic capacitor and wiring board
#16Printed wiring board and method for manufacturing the same
#17METHOD FOR MANUFACTURING WIRING BOARD WITH BUILT-IN COMPONENT
#18METHOD FOR MANUFACTURING WIRING BOARD WITH BUILT-IN COMPONENT
#19Method for manufacturing a wiring board
#20Component built-in wiring substrate and manufacturing method thereof
#21Method of manufacturing capacitor for incorporation in wiring board, capacitor for incorporation in wiring board, and wiring board
#22Wiring substrate and method of manufacturing the same
#23Wiring board and ceramic chip to be embedded
#24Wiring board with built-in component and method for manufacturing the same
#25Capacitor and wiring board including the capacitor
#26CAPACITOR BUILT-IN WIRING BOARD
#27Wiring board and capacitor to be built into wiring board
#28Ceramic interposer with silicon voltage regulator and array capacitor combination for integrated circuit packages
#29Individual sub-assembly containing a ceramic interposer, silicon voltage regulator, and array capacitor
#30Ceramic package substrate with recessed device
#31Embedded array capacitor with top and bottom exterior surface metallization
#32Embedded array capacitor with side terminals
#33Monolithic capacitor, circuit board, and circuit module
#34Multilayer capacitor
#35Method for manufacturing wiring board
#36Wiring board
#37Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate
#38Thin-film capacitor and method for fabricating the same, electronic device and circuit board
#39Built-in capacitor type wiring board and method for manufacturing the same
#40Via array capacitor, wiring board incorporating a via array capacitor, and method of manufacturing the same
#41Wiring board and capacitor
#42Ceramic capacitor
#43Method of manufacturing capacitor for incorporation in wiring board, capacitor for incorporation in wiring board, and wiring board
#44Wiring board construction including embedded ceramic capacitors(s)
#45Wiring board and ceramic chip to be embedded
#46Capacitor for incorporation in wiring board, wiring board, method of manufacturing wiring board, and ceramic chip for embedment
#47Wiring board and method for manufacturing the same
#48Wiring board and manufacturing method of wiring board
#49Wiring board and capacitor to be built into wiring board
#50Intermediate substrate