ClassID:

234715

H05K2203/0173 - CPC Classification

Classification description:

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by; Tools for processing; Objects used during processing; Carriers and holders Template for holding a PCB having mounted components thereon

Recent Application in this class:
#1
20230164966
2023-05-25

On-demand method of making PCB pallets using additive manufacturing

#2
20230141137
2023-05-11

On-demand method of making PCB pallets using additive manufacturing

#3
20220386450
2022-12-01

System, process and a jig for forming conformal EMI shield on package-level electronics or a portion thereof

#4
20210076504
2021-03-11

DOUBLE-SIDED ASSEMBLY ON FLEXIBLE SUBSTRATES

#5
20200180060
2020-06-11

WAVE SOLDER PALLETS FOR OPTIMAL SOLDER FLOW AND METHODS OF MANUFACTURING

#6
20200180059
2020-06-11

Wave solder pallets for optimal solder flow and methods of manufacturing

#7
20190394914
2019-12-26

On-demand method of making PCB pallets using additive manufacturing

#8
20190174630
2019-06-06

Burned-in Component Assembly

#9
20180359887
2018-12-13

Apparatus for holding a printed circuit board

#10
20180126475
2018-05-10

Method of manufacturing a wave solder pallet

#11
20160330837
2016-11-10

Scalable fabrication techniques and circuit packaging devices

#12
20130329407
2013-12-12

Solder-less electrical assembly

#13
20120323352
2012-12-20

SINGULAR AND CO-MOLDED PRE-FORMS

#14
20110315302
2011-12-29

Occam process for components having variations in part dimensions

#15
20110182042
2011-07-28

Electronic Assemblies without Solder and Methods for their Manufacture

#16
20100251541
2010-10-07

Method and device for connecting a wiring board

#17
20100208425
2010-08-19

Solder and lead-free electronic circuit and method of manufacturing same

#18
20090277677
2009-11-12

Electronic Assemblies without Solder and Method for their Design, Prototyping, and Manufacture

#19
20090255426
2009-10-15

METHOD AND APPARATUS FOR PLACING SUBSTRATE SUPPORT COMPONENTS

#20
20090223705
2009-09-10

Electronic component mounting method

#21
20090090229
2009-04-09

Apparatus for controlling alignment between precision ground plates and method of controlling a desired alignment between opposing precision ground plates

#22
20090067147
2009-03-12

CIRCUIT BOARD CONNECTION STRUCTURE AND CIRCUIT BOARD CONNECTION METHOD

#23
20090059498
2009-03-05

Electronic appliance and method for manufacturing the same

#24
20090008140
2009-01-08

Method of making a circuit assembly

#25
20080284311
2008-11-20

Assembling lighting elements onto a substrate

#26
20080266819
2008-10-30

Retaining apparatus for a flexible printed circuit board

#27
20080156445
2008-07-03

Transfer assembly for manufacturing electronic devices

#28
20080019120
2008-01-24

Lighting systems for attachment to wearing apparel

#29
20070240814
2007-10-18

Through-hole machining apparatus of green sheet and through-hole machining method of the same

#30
20070113717
2007-05-24

Cutting fixture for printed circuit board mounted with electronic components

#31
20070020812
2007-01-25

Circuit board structure integrated with semiconductor chip and method of fabricating the same

#32
20060273447
2006-12-07

Electronic package structures and methods

#33
20060234528
2006-10-19

Electronic apparatus and method for manufacturing the same

#34
20060043635
2006-03-02

Singular and co-molded pre-forms

#35
20060037777
2006-02-23

Method for mounting electronic components on a substrate

#36
20050237663
2005-10-27

Insulator with pocket features

#37
20050231848
2005-10-20

Composite base plate for a data storage device having an integral printed circuit board

#38
20050196531
2005-09-08

Printing apparatus and method for bonding material

#39
20050093201
2005-05-05

Singular molded and co-molded electronic's packaging pre-forms

#40
20050000634
2005-01-06

Transfer assembly for manufacturing electronic devices