H05K2203/0292 - CPC Classification Index

ClassID:

234734 ⎘

H05K2203/0292 - CPC Classification

Classification description:

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by; Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound Using vibration, e.g. during soldering or screen printing

Recent Application in this class:

20260150713

2026-05-28

HYBRID-MATERIAL LEADS FOR SOLDERLESS COUPLING OF AN ELECTRONIC COMPONENT

20230058180

2023-02-23

Substrate with buried component and manufacture method thereof

20210320168

2021-10-14

Display device and manufacturing method of display device

20200091270

2020-03-19

Display device and manufacturing method of display device

20200068719

2020-02-27

COMPONENT MOUNTING DEVICE AND METHOD OF CONTROLLING THE SAME

20190141842

2019-05-09

Method for manufacturing circuit board

20180298206

2018-10-18

Method of manufacturing anisotropic conductive film using vertical ultrasonic waves

20180175274

2018-06-21

Piezoelectric vibration module

20180153044

2018-05-31

WIRING SUBSTRATE METHOD OF MANUFACTURING, WIRING SUBSTRATE AND WIRING SUBSTRATE MANUFACTURING DEVICE

#10

20180020546

2018-01-18

Method of manufacturing flexible electronic circuits having conformal material coatings

#11

20170164482

2017-06-08

Transient electronic devices comprising inorganic or hybrid inorganic and organic substrates and encapsulates

#12

20170072491

2017-03-16

Soldering Device Minimizing Voids When Soldering Printed Circuit Boards

#13

20160276086

2016-09-22

Method for gapping an embedded magnetic device

#14

20160199887

2016-07-14

DESMEARING METHOD AND DESMEARING APPARATUS

#15

20160120040

2016-04-28

Fabrication of intra-structure conductive traces and interconnects for three-dimensional manufactured structures

#16

20160050750

2016-02-18

Biodegradable materials for multilayer transient printed circuit boards

#17

20150351251

2015-12-03

Desmearing method and desmearing device

#18

20150282329

2015-10-01

Methods for assembling electronic devices with adhesive

#19

20140323968

2014-10-30

Materials, electronic systems and modes for active and passive transience

#20

20140305900

2014-10-16

Transient electronic devices comprising inorganic or hybrid inorganic and organic substrates and encapsulates

#21

20120292377

2012-11-22

Apparatus for adhering solder powder and method for adhering solder powder to electronic circuit board

#22

20120247817

2012-10-04

CONDUCTIVE PARTICLES, CONDUCTIVE PASTE, AND CIRCUIT BOARD

#23

20120179391

2012-07-12

ELECTRONIC DEVICE AND DAMAGE DETECTING METHOD

#24

20120042795

2012-02-23

METHOD AND APPARATUS FOR PRINTING ON A SUBSTRATE

#25

20110023292

2011-02-03

Conductive ball mounting apparatus having a movable conductive ball container

#26

20100272884

2010-10-28

SOLDER BALL PRINTING APPARATUS AND SOLDER BALL PRINTING METHOD

#27

20100270357

2010-10-28

Solder ball printing apparatus

#28

20100230469

2010-09-16

Conductive ball mounting apparatus and conductive ball mounting method

#29

20100213609

2010-08-26

Solder bump, semiconductor chip, method of manufacturing the semiconductor chip, conductive connection structure, and method of manufacturing the conductive connection structure

#30

20100207273

2010-08-19

Micro Ball Feeding Method

#31

20100206457

2010-08-19

Electronic component bonding method and apparatus using vibration energy

#32

20100176088

2010-07-15

Apparatus and method for the wet chemical treatment of a product and method for installing a flow member into the apparatus

#33

20100003398

2010-01-07

Methods for inhibiting tin whisker growth using abrasive powder coatings

#34

20090302096

2009-12-10

Techniques for arranging solder balls and forming bumps

#35

20090302095

2009-12-10

Techniques for arranging solder balls and forming bumps

#36

20090283575

2009-11-19

Techniques for arranging solder balls and forming bumps

#37

20090230101

2009-09-17

METHOD OF SOLDERING METALLIC JOIN PARTNERS AND AN APPRATUS FOR THIS PURPOSE

#38

20090123594

2009-05-14

Filing assembly

#39

20090077791

2009-03-26

Methods for manufacturing magnetic components

#40

20090056977

2009-03-05

Production method of solder circuit board

#41

20090041990

2009-02-12

METHOD FOR ATTACHMENT OF SOLDER POWDER TO ELECTRONIC CIRCUIT BOARD AND SOLDERED ELECTRONIC CIRCUIT BOARD

#42

20090026247

2009-01-29

Apparatus and method of mounting conductive ball

#43

20090023282

2009-01-22

Conductive ball mounting method and apparatus having a movable solder ball container

#44

20090001132

2009-01-01

Micro-ball loading device and loading method

#45

20080302856

2008-12-11

Conductive ball arraying apparatus

#46

20080271995

2008-11-06

AGITATION OF ELECTROLYTIC SOLUTION IN ELECTRODEPOSITION

#47

20080217386

2008-09-11

Conductive ball mounting apparatus and conductive ball mounting method

#48

20080169027

2008-07-17

FLUID FILLING APPARATUS AND METHOD OF FILLING THROUGH HOLES WITH FLUID

#49

20080142484

2008-06-19

Auxiliary method for wet etching by oscillation flow modification and device for the same

#50

20070287024

2007-12-13

Electrical components including abrasive powder coatings for inhibiting tin whisker growth

#51

20070284136

2007-12-13

Method for production of electronic circuit board

#52

20070063807

2007-03-22

Magnetic components

#53

20060288514

2006-12-28

Foreign matter removing apparatus

#54

20060186181

2006-08-24

Ball mounting method

#55

20060125047

2006-06-15

Interposer including at least one passive element at least partially defined by a recess formed therein, system including same, and wafer-scale interposer

#56