H05K2203/0392 - CPC Classification Index

#1

20250198008

2025-06-19

METHODS FOR PRODUCING AN ETCH RESIST PATTERN ON A METALLIC SURFACE

#2

20250168969

2025-05-22

SURFACE-TREATED COPPER FOIL FOR HIGH-FREQUENCY CIRCUIT AND METHOD FOR PRODUCING THE SAME

#3

20240035167

2024-02-01

Methods for producing an etch resist pattern on a metallic surface

#4

20220220272

2022-07-14

Copper-clad laminated plate, resin-clad copper foil, and circuit substrate using said plate and foil

#5

20220145460

2022-05-12

Hydrophobic Low-Dielectric-Constant Film and Preparation Method Therefor

#6

20220136113

2022-05-05

Methods for producing an etch resist pattern on a metallic surface

#7

20210227696

2021-07-22

Methods of etching conductive features, and related devices and systems

#8

20210007225

2021-01-07

Methods for producing an etch resist pattern on a metallic surface

#9

20200053886

2020-02-13

Coating metal foil with N-heterocyclic carbene compounds containing organic functionalities for improving metal-to-resin adhesion

#10

20190335589

2019-10-31

Methods of etching conductive features, and related devices and systems

#11

20190150288

2019-05-16

Method for producing a printed circuit board structure

#12

20180310414

2018-10-25

Method for manufacturing traces of PCB

#13

20180242457

2018-08-23

Methods for producing an etch resist pattern on a metallic surface

#14

20180192521

2018-07-05

Methods of etching conductive features, and related devices and systems

#15

20180168051

2018-06-14

Coating metal foil with n-heterocyclic carbene compounds containing organic functionalities for improving metal-to-resin adhesion

#16

20180166372

2018-06-14

Wiring substrate and semiconductor device

#17

20180160546

2018-06-07

Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device

#18

20170251553

2017-08-31

Transparent conductive layer, a film comprising the layer, and a process for its production

#19

20170164481

2017-06-08

Circuit board structure

#20

20170118845

2017-04-27

System for pressing pre-tin shaping

#21

20160157362

2016-06-02

Coating metal foil with N-heterocyclic carbene compounds containing organic functionalities for improving metal-to-resin adhesion

#22

20160157361

2016-06-02

Enhanced substrate includes a carbene-coated metal foil laminated to a substrate that includes glass fiber impregnated with a base polymer

#23

20160088722

2016-03-24

Rough Copper for Noise Reduction in High Speed Circuits

#24

20160057865

2016-02-25

Circuit substrate having a circuit pattern and method for making the same

#25

20160050755

2016-02-18

Printed circuit board and method of manufacturing the same

#26

20160020163

2016-01-21

Wiring substrate and semiconductor device

#27

20150092356

2015-04-02

Printed wiring board, method for manufacturing printed wiring board and package-on-package

#28

20150037603

2015-02-05

Methods of forming articles including metal structures having maximized bond adhesion and bond reliability

#29

20150014020

2015-01-15

Wiring substrate and method for manufacturing the same

#30

20120273261

2012-11-01

CIRCUIT SUBSTRATE HAVING A CIRCUIT PATTERN AND METHOD FOR MAKING THE SAME

#31

20120168209

2012-07-05

Ceramic circuit board and process for producing same

#32

20110247858

2011-10-13

Printed circuit board and method of manufacturing the same

#33

20110049104

2011-03-03

ETCHANT FOR COPPER OR COPPER ALLOY, LIQUID FOR ETCHING PRETREATMENT, AND ETCHING METHOD

#34

20100215840

2010-08-26

METHOD AND COMPOSITION TO ENHANCE CORROSION RESISTANCE OF THROUGH HOLE COPPER PLATED PWBs FINISHED WITH AN IMMERSION METAL COATING SUCH AS Ag OR Sn

#35

20100147576

2010-06-17

Laminated wiring board and method for manufacturing the same

#36

20100136252

2010-06-03

Method of manufacturing pattern-forming metal structures on a carrier substrate

#37

20100059257

2010-03-11

Method of nickel-gold plating and printed circuit board

#38

20090283497

2009-11-19

Method of manufacturing wiring substrate

#39

20090280243

2009-11-12

Photoresist-free metal deposition

#40

20090277801

2009-11-12

Photoresist-free metal deposition

#41

20090184090

2009-07-23

THIN-FILM ASSEMBLY AND METHOD FOR PRODUCING SAID ASSEMBLY

#42

20090081370

2009-03-26

METHOD FOR COATING SUBSTRATES CONTAINING ANTIMONY COMPOUNDS WITH TIN AND TIN ALLOYS

#43

20080171138

2008-07-17

Process For Producing A Printed Wiring Board

#44

20080163787

2008-07-10

Organic solderability preservative comprising high boiling temperature alcohol

#45

20080093335

2008-04-24

Method of manufacturing circuit board used for switch device

#46

20070287289

2007-12-13

PRODUCTION METHOD OF CONDUCTIVE PATTERN

#47

20070269591

2007-11-22

Pad Metallisation Process

#48

20070235343

2007-10-11

Process for electrolytically plating copper

#49

20070221503

2007-09-27

Precoat composition for organic solderability preservative

#50

20070218695

2007-09-20

Metal pattern forming method

#51

20070042122

2007-02-22

Aqueous solution for surface treatment of metal and method for preventing discoloration of metal surface

#52

20070032080

2007-02-08

System and method for manufacturing flexible copper clad laminate film

#53

20060252247

2006-11-09

Processing apparatus for electroplating conductive bumps on organic circuit board

#54

20060231837

2006-10-19

Thin-film assembly and method for producing said assembly

#55

20060054350

2006-03-16

Circuit board and method of manufacturing the same

#56

20050274689

2005-12-15

Printed wiring board, production process thereof and semiconductor device

#57

14970165

2017-02-07

Security mesh and method of making