H05K2203/03 - CPC Classification

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by Metal processing

• H05K2203/0307 » Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites 165
• H05K2203/0307 » Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites 165
• H05K2203/0315 » Oxidising metal 298
• H05K2203/0315 » Oxidising metal 298
• H05K2203/0323 » Working metal substrate or core, e.g. by etching, deforming 98
• H05K2203/0323 » Working metal substrate or core, e.g. by etching, deforming 98
• H05K2203/033 » Punching metal foil, e.g. solder foil 18
• H05K2203/033 » Punching metal foil, e.g. solder foil 18
• H05K2203/0338 » Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component 155
• H05K2203/0338 » Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component 155
• H05K2203/0346 » Deburring, rounding, bevelling or smoothing conductor edges 25
• H05K2203/0346 » Deburring, rounding, bevelling or smoothing conductor edges 25
• H05K2203/0353 » Making conductive layer thin, e.g. by etching 116
• H05K2203/0353 » Making conductive layer thin, e.g. by etching 116
• H05K2203/0361 » Stripping a part of an upper metal layer to expose a lower metal layer, e.g by etching or using a laser 129
• H05K2203/0361 » Stripping a part of an upper metal layer to expose a lower metal layer, e.g by etching or using a laser 129
• H05K2203/0369 » Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist 209
• H05K2203/0369 » Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist 209
• H05K2203/0376 » Etching temporary metallic carrier substrate 92
• H05K2203/0376 » Etching temporary metallic carrier substrate 92
• H05K2203/0384 » Etch stop layer, i.e. a buried barrier layer for preventing etching of layers under the etch stop layer 116
• H05K2203/0384 » Etch stop layer, i.e. a buried barrier layer for preventing etching of layers under the etch stop layer 116
• H05K2203/0392 » Pretreatment of metal, e.g. before finish plating, etching 54
• H05K2203/0392 » Pretreatment of metal, e.g. before finish plating, etching 54

Recent Application in this class: