H05K2203/042 - CPC Classification Index

ClassID:

234752 ⎘

H05K2203/042 - CPC Classification

Classification description:

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by; Soldering or other types of metallurgic bonding Remote solder depot on the PCB, the solder flowing to the connections from this depot

Recent Application in this class:

20220071021

2022-03-03

PRINTED WIRING BOARD AND ELECTRONIC DEVICE

20180199425

2018-07-12

Printed circuit board and method for producing a printed circuit board

20180093338

2018-04-05

Method for void reduction in solder joints

20160184914

2016-06-30

Device for soldering electrical or electronic components

20140174795

2014-06-26

Printed wiring board, printed circuit board, and method for manufacturing printed circuit board

20120295454

2012-11-22

Printed circuit board assembly chip package component and soldering component

20090321120

2009-12-31

PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE

20070221398

2007-09-27

Printed-wiring board with built-in component, manufacturing method of printed-wiring board with built-in component, and electronic device

20050092814

2005-05-05

Electrical circuit apparatus and method