234748 ⎘
Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by Soldering or other types of metallurgic bonding
Sub-classes:ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDING METHOD THEREOF
#2INSULATED METAL SUBSTRATE AND METHOD FOR PRODUCING AN INSULATED METAL SUBSTRATE
#3WAVE SOLDERING DEVICE, MANUFACTURING METHOD THEREOF AND PRINTED CIRCUIT BOARD
#4BONDED BODY, CERAMIC COPPER CIRCUIT BOARD, METHOD FOR MANUFACTURING BONDED BODY, AND METHOD FOR MANUFACTURING CERAMIC COPPER CIRCUIT BOARD
#5Advanced Device Assembly Structures And Methods
#6LASER WELDING APPARATUS AND WELDING METHOD USING THE SAME
#7SACRIFICIAL SOLDER LAYER FOR BROACHING CLINCH NUT ASSEMBLY
#8ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDING METHOD THEREOF
#9CIRCUIT BOARD ASSEMBLY, MANUFACTURING METHOD, AND ELECTRONIC DEVICE
#10SYSTEMS AND METHODS FOR ADDITIVE MANUFACTURING OF ELECTRONICS
#11Electronic component, electric device including the same, and bonding method thereof
#12Solder recovery device
#13Welding structure and display module
#14ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDING METHOD THEREOF
#15SIMPLIFIED PEN CORE MODULE AND THE PREPARATION METHOD THEREOF
#16Method of installing an image sensor of a camera
#17Bonded body, ceramic copper circuit board, method for manufacturing bonded body, and method for manufacturing ceramic copper circuit board
#18BRAZING MATERIAL, BONDED BODY, CERAMIC CIRCUIT BOARD, AND METHOD FOR MANUFACTURING BONDED BODY
#19Semiconductor device including semiconductor chip having elongated bumps
#20Ceramic substrate manufacturing method
#21Advanced device assembly structures and methods
#22Assembly structure for vehicle camera module using solder-jet
#23PCB structure and method and apparatus for forming the PCB structure
#24Camera with alignable image sensor
#25Electroconductive substrate, electronic device and display device
#26Camera with adjustable circuit holder
#27Electroconductive substrate, electronic device and display device
#28Variable temperature controlled soldering iron
#29Semiconductor device including semiconductor chip having elongated bumps
#30Variable temperature controlled soldering iron
#31Electronic component, electric device including the same, and bonding method thereof
#32Power converter for electric vehicle drive systems
#33Power converter for electric vehicle drive systems
#34Printed board, display device, and method of manufacturing the display device
#35Electroconductive substrate, electronic device and display device
#36Electronic component, electric device including the same, and bonding method thereof
#37Surface-Treated Copper Foil, Copper Foil Having Carrier, Laminated Material, Method For Producing Printed Wiring Board, And Method For Producing Electronic Apparatus
#38Method for forming solder bumps using sacrificial layer
#39METHOD FOR FORMING SOLDER BUMPS USING SACRIFICIAL LAYER
#40Electrical circuitry assembly and method for manufacturing the same
#41POPULATED PRINTED CIRCUIT BOARD AND METHOD FOR POPULATING A PRINTED CIRCUIT BOARD
#42VARIABLE TEMPERATURE CONTROLLED SOLDERING IRON
#43Solar Lamp, PCB Circuit for the Solar Lamp and a Preparation Method Thereof
#44Method for forming solder bumps using sacrificial layer
#45System and method for depositing a material on a workpiece
#46Intelligent soldering cartridge for automatic soldering connection validation
#47Positioning device
#48Automatic power disconnect method
#49Method for producing a metal-ceramic substrate
#50Exposed pad integrated circuit package
#51Portable electronic device contact puck alignment
#52Module and method for manufacturing the module
#53Thermal compression bonding process cooling manifold
#54Press fit electrical terminal having a solder tab shorter than PCB thickness and method of using same
#55Circuit board and manufacturing method thereof
#56Method of mounting self-adhesive substrate on electronic device
#57Apparatus for manufacturing semiconductor device and the semiconductor device
#58Method of manufacturing a semiconductor device
#59Forming a solder joint between metal layers
#60Metallized particle interconnect with solder components
#61Encapsulation process enabling hotbar soldering without direct PCB support
#62Method for producing a module
#63Soldering device, soldering method, and substrate and electronic component produced by the soldering device or the soldering method
#64Increasing solder hole-fill in a printed circuit board assembly
#65Soldering iron with automatic soldering connection validation
#66Solder pads, methods, and systems for circuitry components
#67Solder assembly temperature monitoring process
#68Device for thermal management of surface mount devices during reflow soldering
#69Manufacturing method of power-module substrate
#70Gas-blowing-hole array structure and soldering apparatus
#71Thermocompression bonders, methods of operating thermocompression bonders, and interconnect methods for fine pitch flip chip assembly
#72HEEL FILLET CAPACITOR WITH NOISE REDUCTION
#73Vacuum pallet reflow
#74Anisotropic conductive film and method of producing the same
#75Method of manufacturing surface mount device
#76POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE WITH HEAT SINK, POWER MODULE, METHOD OF PRODUCING POWER MODULE SUBSTRATE, PASTE FOR COPPER SHEET BONDING, AND METHOD OF PRODUCING BONDED BODY
#77Electronic component mounting system and electronic component mounting method
#78Method and soldering device for selective soldering with at least one solder nozzle and another functional element which are moved synchronously by a movement device
#79Electronic component mounting system and electronic component mounting method
#80CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, ELECTRONIC COMPONENT PACKAGE, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT PACKAGE
#81Electronic component mounting system
#82Manufacturing method of power-module substrate
#83Soldering method using a low-temperature solder paste
#84Method and apparatus for improving selective soldering
#85Electronic component mounting system and electronic component mounting method
#86METHOD FOR PRODUCING A DRIED PASTE LAYER, METHOD FOR PRODUCING A SINTERING CONNECTION, METHOD FOR PRODUCING A POWER SEMICONDUCTOR MODULE AND CONTINUOUS INSTALLATION
#87One up, one down connection structure for piezoelectric device in tire patch
#88ADVANCED DEVICE ASSEMBLY STRUCTURES AND METHODS
#89Flux Composition and Techniques for Use Thereof
#90Electronic component module and manufacturing method thereof
#91Method of soldering an electronic component with a high lateral accuracy
#92Carrier plate, device having the carrier plate and method for producing a carrier plate
#93Ceramic circuit substrate and its production method
#94Method of soldering electronic part
#95Wiring substrate and production method therefor
#96Thermal compression bonding process cooling manifold
#97Electronic device and method for assembling the same
#98Electronic component, electric device including the same, and bonding method thereof
#99BONDING MEMBER
#100Electromagnetic field assisted self-assembly with formation of electrical contacts
#101FLEXIBLE LED LIGHT BAR AND MANUFACTURING METHOD THEREOF
#102Methods of forming dual sided coreless package structures with land side capacitor
#103Bonding device
#104Manufacturing a product using a soldering process
#105Method for manufacturing a component interconnect board
#106Method and device of a LED matrix
#107Solder assembly temperature monitoring process
#108ELECTROMAGNETIC FIELD ASSISTED SELF-ASSEMBLY WITH FORMATION OF ELECTRICAL CONTACTS
#109VACUUM PALLET REFLOW
#110Flux composition and techniques for use thereof
#111Surface mount device
#112Cream solder and method of soldering electronic part
#113Automatic power disconnect device