H05K2203/0435 - CPC Classification Index

ClassID:

234755 ⎘

H05K2203/0435 - CPC Classification

Classification description:

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by; Soldering or other types of metallurgic bonding Metal coated solder, e.g. for passivation of solder balls

Recent Application in this class:

20220339742

2022-10-27

Composite solder balls metallised on the surface and calibrated for the assembly of electronic boards

20160021752

2016-01-21

Package base, package, electronic device, electronic apparatus, and moving object

20110259627

2011-10-27

Circuit board with buried circuit pattern

20110127669

2011-06-02

Solder structure, method for forming the solder structure, and semiconductor module including the solder structure

20110051376

2011-03-03

Solder joint reliability in microelectronic packaging

20100213591

2010-08-26

Semiconductor package and method of manufacturing the same

20100044848

2010-02-25

Solder joint reliability in microelectronic packaging

20090246911

2009-10-01

SUBSTRATE FOR MOUNTING ELECTRONIC COMPONENTS AND ITS METHOD OF MANUFACTURE

20090233117

2009-09-17

Method for soldering electronic component and soldering structure of electronic component

#10

20090050470

2009-02-26

Method And Device For Enhancing Solderability

#11

20080115968

2008-05-22

Solder joint reliability in microelectronic packaging

#12

20080101045

2008-05-01

Method of manufacturing a circuit board

#13

20070278456

2007-12-06

SOLDER PASTE

#14

20070036952

2007-02-15

Method And Device For Enhancing Solderability

#15

20050109820

2005-05-26

Low temperature solder chip attach structure and process to produce a high temperature interconnection