ClassID:

234756

H05K2203/044 - CPC Classification

Classification description:

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by; Soldering or other types of metallurgic bonding Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering

Recent Application in this class:
#1
20260113834
2026-04-23

Electronic Device and System With an Improved Cooling Concept

#2
20250128344
2025-04-24

SOLDERING SYSTEM AND METHOD OF USE

#3
20230247772
2023-08-03

Coating device and component mounting machine

#4
20230164966
2023-05-25

On-demand method of making PCB pallets using additive manufacturing

#5
20230141137
2023-05-11

On-demand method of making PCB pallets using additive manufacturing

#6
20230086271
2023-03-23

PROTECTIVE HEAT SHIELDS FOR THERMALLY SENSITIVE COMPONENTS AND METHODS FOR PROTECTING THERMALLY SENSITIVE COMPONENTS

#7
20220400557
2022-12-15

Compliant pin surface mount technology pad for rework

#8
20200187364
2020-06-11

Protective heat shields for thermally sensitive components and methods for protecting thermally sensitive components

#9
20200180059
2020-06-11

Wave solder pallets for optimal solder flow and methods of manufacturing

#10
20200139466
2020-05-07

Non-destructive identifying of plating dissolution in soldered, plated through-hole

#11
20200064578
2020-02-27

Reel for the purpose of winding a length of cable of optical fiber cable type

#12
20190394914
2019-12-26

On-demand method of making PCB pallets using additive manufacturing

#13
20190174629
2019-06-06

Method for manufacturing a circuit board

#14
20180343748
2018-11-29

Substrate on which electronic component is soldered, electronic device, method for soldering electronic component

#15
20180332705
2018-11-15

Printed circuit board structure

#16
20180160544
2018-06-07

Printed circuit board, power supply apparatus, image forming apparatus, and printed circuit board manufacturing method

#17
20180132361
2018-05-10

Protective heat shields for thermally sensitive components and methods for protecting thermally sensitive components

#18
20180126475
2018-05-10

Method of manufacturing a wave solder pallet

#19
20180116080
2018-04-26

Work machine

#20
20160297022
2016-10-13

Increasing solder hole-fill in a printed circuit board assembly

#21
20160082551
2016-03-24

Tin-based solder composition with low void characteristic

#22
20160052074
2016-02-25

Wave soldering nozzle system and method of wave soldering

#23
20160044791
2016-02-11

Increasing solder hole-fill in a printed circuit board assembly

#24
20150367438
2015-12-24

Pre-heater latch and seal mechanism for wave solder machine and related method

#25
20150298233
2015-10-22

Method and soldering device for selective soldering with at least one solder nozzle and another functional element which are moved synchronously by a movement device

#26
20150245499
2015-08-27

Pre-heater latch and seal mechanism for wave solder machine and related method

#27
20150223346
2015-08-06

Dual solder layer for fluidic self assembly and electrical component substrate and method employing same

#28
20150174678
2015-06-25

Device for coating thin molten solder film, thin solder film-covered component and manufacturing method therefor

#29
20150082822
2015-03-26

Refrigerating apparatus

#30
20140284374
2014-09-25

Carrier with a test surface wettable with liquid solder and method for application thereof

#31
20140192502
2014-07-10

Reducing impedance of a printed circuit board through a square wave pattern of plated-through holes

#32
20140183250
2014-07-03

Heat transfer device for wave soldering

#33
20140182909
2014-07-03

Heat transfer device for wave soldering

#34
20140162060
2014-06-12

Strippable adhesion composition and uses thereof

#35
20140104807
2014-04-17

ESD protection in a very small form factor consumer electronic product

#36
20130126590
2013-05-23

Wave soldering of surface-mounting electronic devices on printed circuit board

#37
20130107460
2013-05-02

Protecting a thermal sensitive component in a thermal process

#38
20130083490
2013-04-04

Electronic system for wave soldering

#39
20130004196
2013-01-03

Printed circuit board, power supply apparatus, image forming apparatus, and printed circuit board manufacturing method

#40
20120318852
2012-12-20

METHOD OF PREVENTING EMI FOR A FASTENING HOLE IN A CIRCUIT BOARD AND A FIXTURE THEREFOR

#41
20120050938
2012-03-01

ESD protection in a very small form factor consumer electronic product

#42
20120024938
2012-02-02

Soldering apparatus

#43
20110235348
2011-09-29

Connector having a terminal with a tin plated contact pressed against a hot-dip tinned face of a board

#44
20110062483
2011-03-17

Light-emitting diode

#45
20100290203
2010-11-18

Printed circuit board equipped with piezoelectric element

#46
20090260854
2009-10-22

ELECTRONIC CIRCUIT BOARD

#47
20080241359
2008-10-02

Method of making circuitized substrate with selected conductors having solder thereon

#48
20070263362
2007-11-15

Heat dissipating type printed circuit board and structure thereof for conducting heat with heap pipe

#49
20070134007
2007-06-14

Printed circuit board and an image forming apparatus having the printed circuit board

#50
20070107214
2007-05-17

Soldering method

#51
20070068822
2007-03-29

Method for fabricating metal wires

#52
20070019060
2007-01-25

Substrate sheet, manufacturing method of circuit substrate, and ink jet head

#53
20060141864
2006-06-29

Flexible circuit sheet, continuous tape, and ink jet head

#54
20060054347
2006-03-16

Electric conductors

#55
20050067189
2005-03-31

Soldering method and solder joint member

#56
20050042892
2005-02-24

Printed circuit board and an image forming apparatus having the printed circuit board