H05K2203/0445 - CPC Classification Index

ClassID:

234757 ⎘

H05K2203/0445 - CPC Classification

Classification description:

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by; Soldering or other types of metallurgic bonding Removing excess solder on pads; removing solder bridges, e.g. for repairing or reworking

Recent Application in this class:

20240268036

2024-08-08

METHOD FOR PRODUCING ELECTRONIC COMPONENT MOUNTED SUBSTRATE

20180235080

2018-08-16

Accurate positioning and alignment of a component during processes such as reflow soldering

20180185945

2018-07-05

Solder paste misprint cleaning

20180185944

2018-07-05

Solder paste misprint cleaning

20180141144

2018-05-24

Method for cleaning an Electronic circuit board

20170348784

2017-12-07

Solder paste misprint cleaning

20160105964

2016-04-14

Method of manufacture an electric circuit

20160044795

2016-02-11

Soldering device, soldering method, and substrate and electronic component produced by the soldering device or the soldering method

20160029490

2016-01-28

Apparatus for cleaning an electronic circuit board

#10

20150319851

2015-11-05

Printed circuit board and method of manufacturing the same

#11

20150027768

2015-01-29

Resin composition for solder bump formation, solder bump formation method, and member having solder bumps

#12

20090045245

2009-02-19

Solder repairing apparatus and method of repairing solder