H05K2203/045 - CPC Classification Index

ClassID:

234758 ⎘

H05K2203/045 - CPC Classification

Classification description:

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by; Soldering or other types of metallurgic bonding Solder-filled plated through-hole [PTH] during processing wherein the solder is removed from the PTH after processing

Recent Application in this class:

20240357736

WIRING SUBSTRATE FOR ELECTRONIC CONTROL DEVICE, AND METHOD FOR MANUFACTURING SAME

20200245469

Repairing defective through-holes

20200236775

Method for producing a printed circuit board having thermal through-contacts

20200139466

Non-destructive identifying of plating dissolution in soldered, plated through-hole

20200128676

Facilitating filling a plated through-hole of a circuit board with solder

20180343748

Substrate on which electronic component is soldered, electronic device, method for soldering electronic component

20180206346

PRINTED CIRCUIT BOARD MANUFACTURING METHOD AND PRINTED CIRCUIT BOARD THEREOF

20180199425

Printed circuit board and method for producing a printed circuit board

20140322936

Electrical connector assembly and mounting structure thereof

20110155450

PRINTED CIRCUIT BOARD AND ELECTRONIC APPARATUS

20080160252

Via design for flux residue mitigation

20070257355

Soldering structure of through hole