H05K2203/047 - CPC Classification Index

ClassID:

234762 ⎘

H05K2203/047 - CPC Classification

Classification description:

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by; Soldering or other types of metallurgic bonding Soldering with different solders, e.g. two different solders on two sides of the PCB

Recent Application in this class:

20260150199

2026-05-28

ELECTRONIC PACKAGE AND METHOD FOR FORMING THE SAME

20250218998

2025-07-03

LOW TEMPERATURE SOLDER INTERCONNECT FOR PACKAGE PITCH SCALING

20240389240

2024-11-21

MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS OF USING THE SAME

20220078919

2022-03-10

PRINTED CIRCUIT BOARDS WITH ELECTRICAL CONTACTS AND SOLDER JOINTS OF HIGHER MELTING TEMPERATURES

20210007217

2021-01-07

Insulated circuit board

20190229045

2019-07-25

Ball grid array and land grid array assemblies fabricated using temporary resist

20160183384

2016-06-23

Electrical devices and methods for manufacturing same

20160141776

2016-05-19

Press fit electrical terminal having a solder tab shorter than PCB thickness and method of using same

20160133595

2016-05-12

Electrical apparatus

#10

20160133554

2016-05-12

Ball grid array and land grid array assemblies fabricated using temporary resist

#11

20160079201

2016-03-17

Method of manufacturing a semiconductor device

#12

20160057869

2016-02-25

Voiding control using solid solder preforms embedded in solder paste

#13

20160035694

2016-02-04

Method of manufacturing electronic device

#14

20160035688

2016-02-04

Semiconductor component, semiconductor-mounted product including the component, and method of producing the product

#15

20150296623

2015-10-15

Electrical devices with solder dam

#16

20150262926

2015-09-17

Electronic device including soldered surface-mount component

#17

20150223346

2015-08-06

Dual solder layer for fluidic self assembly and electrical component substrate and method employing same

#18

20150103495

2015-04-16

Electronic component module

#19

20140049930

2014-02-20

Mounted structure and manufacturing method of mounted structure

#20

20130314885

2013-11-28

Printed circuit board assembly

#21

20130291378

2013-11-07

Electronic component mounting device

#22

20120292087

2012-11-22

Method for soldering surface-mount component and surface-mount component

#23

20120162928

2012-06-28

ELECTRONIC PACKAGE AND METHOD OF MAKING SAME

#24

20120152606

2012-06-21

PRINTED WIRING BOARD

#25

20110239456

2011-10-06

In system reflow of low temperature eutectic bond balls

#26

20110180205

2011-07-28

CARRIER FOR MANUFACTURING SUBSTRATE AND METHOD OF MANUFACTURING SUBSTRATE USING THE SAME

#27

20110138621

2011-06-16

Carrier for manufacturing a printed circuit board

#28

20110089438

2011-04-21

OPTO-ELECTRICAL ASSEMBLIES AND ASSOCIATED APPARATUS AND METHODS

#29

20110006414

2011-01-13

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

#30

20100139954

2010-06-10

Self-assembled electrical contacts

#31

20080266805

2008-10-30

Carrier For Electrical Components With Soldered-On Cooling Body

#32

20070107214

2007-05-17

Soldering method

#33

20070102490

2007-05-10

CIRCUIT BOARD,METHOD OF MOUNTING SURFACE MOUNTING COMPONENT ON CIRCUIT BOARD, AND ELECTRONIC EQUIPMENT USING THE SAME CIRCUIT BOARD

#34

20070063324

2007-03-22

Structure and method for reducing warp of substrate

#35

20060289977

2006-12-28

Lead-free semiconductor package

#36

20060286714

2006-12-21

Semiconductor device and system having semiconductor device mounted thereon

#37

20050258548

2005-11-24

Capacitor-built-in type printed wiring substrate, printed wiring substrate, and capacitor

#38

20050127143

2005-06-16

Solder joint structure and method for soldering electronic components

#39

20050067189

2005-03-31

Soldering method and solder joint member

#40

20050046032

2005-03-03

Bonding material and circuit device using the same