Patents-Review.com
ClassID:

234763 ⎘

H05K2203/0475 - CPC Classification

Classification description:

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by; Soldering or other types of metallurgic bonding Molten solder just before placing the component

Recent Application in this class:
#1
20240389240
2024-11-21

MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS OF USING THE SAME

 #2
20220320811
2022-10-06

LASER SOLDERING METHOD AND DEVICE

 #3
20200305283
2020-09-24

Electronic device comprising an electronic component mounted on a support substrate and assembly method

 #4
20200170155
2020-05-28

Flux residue detection

 #5
20200105713
2020-04-02

Wafer-level methods of fabricating semiconductor device packages and related packages

 #6
20190036245
2019-01-31

Interconnection including a cable assembly and a board assembly, a board assembly for an interconnection and a method for making an interconnection

 #7
20180185946
2018-07-05

Estimation device

 #8
20180015558
2018-01-18

SOLDERING APPARATUS

 #9
20170221854
2017-08-03

Thermocompression bonding systems and methods of operating the same

 #10
20150249027
2015-09-03

Thermocompression bonding systems and methods of operating the same

 #11
20100159692
2010-06-24

Attachment using magnetic particle based solder composites

 #12
20100139954
2010-06-10

Self-assembled electrical contacts

 #13
20090205203
2009-08-20

Method of mounting electronic components

 #14
20080188040
2008-08-07

Method of manufacturing semiconductor device

 #15
20060124614
2006-06-15

Method for soldering miniaturized components to a baseplate

 #16
20060051895
2006-03-09

Method for manufacturing electronic component-mounted board

 #17
20050139389
2005-06-30

Method of mounting electronic component on substrate without generation of voids in bonding material