234764 ⎘
Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by; Soldering or other types of metallurgic bonding Self-alignment during soldering; Terminals, pads or shape of solder adapted therefor
BONDING SHEET AND METHOD FOR PRODUCING SAME
#2LIGHT-EMITTING DIODE ARRAY WITH PRECISE POSITION ASSEMBLY FOR AUTOMOTIVE HEADLIGHT APPLICATIONS
#3Right angle sidewall and button interconnects for molded SiPs
#4Semiconductor module and electronic apparatus
#5Land for surface mounted component
#6Signal transmission apparatus and display apparatus
#7Light device, headlight and method
#8Connection arrangement, component carrier and method of forming a component carrier structure
#9Systems and methods for precision placement of components
#10Solder printing inspection device, solder printing inspection method and method of manufacturing substrate
#11Ball grid array and land grid array assemblies fabricated using temporary resist
#12Electronic component mount structure, electronic component, and method for manufacturing electronic component
#13Spoked solder pad to improve solderability and self-alignment of integrated circuit packages
#14METAL ELECTRODE LEADLESS FACE (MELF) DEVICE CRADLE
#15Accurate positioning and alignment of a component during processes such as reflow soldering
#16Ceramic filter with window coupling
#17Electronic component mount structure, electronic component, and method for manufacturing electronic component
#18Electronic component, mounted electronic component, and method for mounting electronic component
#19Electronic circuit device
#20Light emitting device and wiring board thereof
#21Resin-sealed module
#22Inductor and printed circuit board
#23Method of manufacturing printed circuit board with embedded electronic components positioned by using solder paste
#24Planar lighting device and mounting substrate including conduction pattern with extension parts
#25Wired circuit board
#26Spoked solder pad to improve solderability and self-alignment of integrated circuit packages
#27LED lamp using ultra-small LED electrode assembly
#28Ultra-small LED electrode assembly and method for manufacturing same
#29Ball grid array and land grid array assemblies fabricated using temporary resist
#30Solder pads, methods, and systems for circuitry components
#31Semiconductor device mounting structure, backlight device, and mounting substrate
#32Illumination device
#33Circuit board and vehicle brake hydraulic pressure control unit
#34Dual solder layer for fluidic self assembly and electrical component substrate and method employing same
#35Structure mounted with electronic component
#36Electromagnetic field assisted self-assembly with formation of electrical contacts
#37Mounting method of electronic component and electronic component mount body
#38ELECTROMAGNETIC FIELD ASSISTED SELF-ASSEMBLY WITH FORMATION OF ELECTRICAL CONTACTS
#39Planar lighting device and mounting substrate including conduction pattern with extension parts
#40Cut-edge positioning type soldering structure and method for preventing pin deviation
#41Bonding pad structure
#42Enhanced magnetic self-assembly using integrated micromagnets
#43Overcoming laminate warpage and misalignment in flip-chip packages
#44Lead pin and wiring substrate with lead pin, and method of manufacturing the same
#45FLIPPED MICRO-STRIP FILTER
#46Electronic component and method of manufacturing electronic component
#47MEMORY MODULE
#48Self-assembled electrical contacts
#49Self-assembly of components
#50Printed board
#51OC2 oriented connections 2
#52Solder Mounting Structure, Method for Manufacturing Such Solder Mounting Structure and Use of Such Solder Mounting Structure
#53Electronic component mounting method and electronic component mounting device
#54Solder mounting structure, method for manufacturing such solder mounting structure and use of such solder mounting structure
#55Method and structure for magnetically-directed, self-assembly of three-dimensional structures
#56Method for producing a module with components stacked one above another
#57Method and System for Self-Aligning Parts in Mems
#58Mounting structure for electronic component
#59Method of self-assembly on a surface
#60Electronic component with high density, low cost attachment
#61Method for diffusion soldering
#62OPTICAL STRUCTURES INCLUDING LIQUID BUMPS
#63Mounting flexible circuits onto integrated circuit substrates
#64Wiring board, electronic component mounting structure, and electronic component mounting method
#65Method for hybridization of two components by using different sized solder protrusions and a device that uses two components hybridized according to this method
#66Method and device for producing a system having a component applied to a predetermined location of a surface of a substrate
#67Self alignment features for an electronic assembly
#68Self alignment features for an electronic assembly
#69Method and Device for Producing a System Having a Component Applied to a Predetermined Location of a Surface of a Substrate
#70Method for mounting semiconductor chips on a substrate and corresponding assembly
#71Substrate, device and method for forming a guidance structure in the substrate, and positioning method
#72Accurate relative alignment and epoxy-free attachment of optical elements
#73Reinforced solder bump structure and method for forming a reinforced solder bump
#74FLIP-CHIP SUBSTRATE AND FLIP-CHIP BONDING PROCESS THEREOF
#75Optical structures including liquid bumps and related methods
#76Mounting substrate and mounting method of electronic part
#77Solder bump structure and method for forming a solder bump
#78Surface mounting structure for surface mounting an electronic component
#79Circuit carrier and package structure thereof
#80Method of fabricating an electronic device