ClassID:

234770

H05K2203/0505 - CPC Classification

Classification description:

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by; Patterning and lithography; Masks; Details of resist; Patterning and lithography Double exposure of the same photosensitive layer

Recent Application in this class:
#1
20210243900
2021-08-05

Wired circuit board and production method thereof

#2
20200344888
2020-10-29

Wired circuit board and production method thereof

#3
20190150291
2019-05-16

Zero-misalignment via-pad structures

#4
20170280568
2017-09-28

Zero-misalignment via-pad structures

#5
20160183370
2016-06-23

Zero-misalignment via-pad structures

#6
20130157200
2013-06-20

Suspension board with circuit and producing method thereof

#7
20120000067
2012-01-05

Method of manufacturing printed circuit board having flow preventing dam

#8
20100330504
2010-12-30

Method for electroconductive pattern formation

#9
20100258545
2010-10-14

Method of manufacturing printed circuit board

#10
20100224391
2010-09-09

Suspension board with circuit and production method thereof

#11
20100116534
2010-05-13

Printed circuit board with solder bump on solder pad and flow preventing dam

#12
20090111062
2009-04-30

Pattern Formation Method

#13
20090059195
2009-03-05

Exposure device with mechanism for forming alignment marks and exposure process conducted by the same

#14
20080135784
2008-06-12

Patterning compositions, masks, and methods

#15
20060043158
2006-03-02

Method for fabricating electrical connections of circuit board

#16
20060030140
2006-02-09

Method of making bondable leads using positive photoresist and structures made therefrom

#17
20060017161
2006-01-26

Semiconductor package having protective layer for re-routing lines and method of manufacturing the same

#18
20050186786
2005-08-25

Method for fabricating metallic interconnects on electronic components

#19
20050101136
2005-05-12

Etching method and method of manufacturing circuit device using the same