H05K2203/0502 - CPC Classification Index

ClassID:

234769 ⎘

H05K2203/0502 - CPC Classification

Classification description:

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by; Patterning and lithography; Masks; Details of resist Patterning and lithography

Sub-classes:

H05K2203/0505 » Double exposure of the same photosensitive layer 19
H05K2203/0505 » Double exposure of the same photosensitive layer 19
H05K2203/0508 » Flood exposure 7
H05K2203/0508 » Flood exposure 7
H05K2203/0511 » Diffusion patterning 0
H05K2203/0511 » Diffusion patterning 0
H05K2203/0514 » Photodevelopable thick film, e.g. conductive or insulating paste 79
H05K2203/0514 » Photodevelopable thick film, e.g. conductive or insulating paste 79
H05K2203/0517 » Electrographic patterning 63
H05K2203/0517 » Electrographic patterning 63
H05K2203/052 » Magnetographic patterning 2
H05K2203/052 » Magnetographic patterning 2
H05K2203/0522 » Using an adhesive pattern 77
H05K2203/0522 » Using an adhesive pattern 77
H05K2203/0525 » Patterning by phototackifying or by photopatterning adhesive 16
H05K2203/0525 » Patterning by phototackifying or by photopatterning adhesive 16
H05K2203/0528 » Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser 79
H05K2203/0528 » Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser 79
H05K2203/0531 » Decalcomania, i.e. transfer of a pattern detached from its carrier before affixing the pattern to the substrate 7
H05K2203/0531 » Decalcomania, i.e. transfer of a pattern detached from its carrier before affixing the pattern to the substrate 7
H05K2203/0534 » Offset printing, i.e. transfer of a pattern from a carrier onto the substrate by using an intermediate member 55
H05K2203/0534 » Offset printing, i.e. transfer of a pattern from a carrier onto the substrate by using an intermediate member 55
H05K2203/0537 » Transfer of pre-fabricated insulating pattern 47
H05K2203/0537 » Transfer of pre-fabricated insulating pattern 47
H05K2203/054 » Continuous temporary metal layer over resist, e.g. for selective electroplating 111
H05K2203/054 » Continuous temporary metal layer over resist, e.g. for selective electroplating 111
H05K2203/0542 » Continuous temporary metal layer over metal pattern 53
H05K2203/0542 » Continuous temporary metal layer over metal pattern 53
H05K2203/0545 » Pattern for applying drops or paste; Applying a pattern made of drops or paste 76
H05K2203/0545 » Pattern for applying drops or paste; Applying a pattern made of drops or paste 76

Recent Application in this class:

20260129767

2026-05-07

Systems and Methods for Liquid Metal Printing

20260075720

2026-03-12

MANUFACTURING METHOD OF CIRCUIT BOARD

20260025914

2026-01-22

CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME

20250358936

2025-11-20

CIRCUIT BOARD WITH EMBEDDED ELEMENTS AND METHOD FOR FABRICATING THE SAME

20250240898

2025-07-24

MANUFACTURING METHOD OF ELECTRONIC DEVICE

20250056712

2025-02-13

MANUFACTURING METHOD OF CIRCUIT BOARD

20240306295

2024-09-12

CIRCUIT STRUCTURE

20240292543

2024-08-29

TRANSFER PRINTING HIGH-PRECISION DEVICES

20240255854

2024-08-01

ENHANCING EFFICIENCY OF RESIST PATTERNING

#10

20240015891

2024-01-11

Method of producing circuits of substrate of display device

#11

20230413453

2023-12-21

CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME, AND ELECTRONIC DEVICE COMPRISING SAME CIRCUIT BOARD

#12

20230269885

2023-08-24

Wiring board

#13

20230217598

2023-07-06

Transfer printing high-precision devices

#14

20230199968

2023-06-22

METHOD FOR FORMING PATTERN ON SUBSTRATE STRUCTURE WITHOUT USING MASK LAYER AND SUBSTRATE STRUCTURE

#15

20230147650

2023-05-11

METHOD OF MANUFACTURING MULTI-LAYER CIRCUIT BOARD INCLUDING EXTREME FINE VIA AND MULTI-LAYER CIRCUIT BOARD MANUFACTURED BY THE SAME

#16

20230095608

2023-03-30

CONFORMAL POWER DELIVERY STRUCTURES INCLUDING EMBEDDED PASSIVE DEVICES

#17

20220408565

2022-12-22

System, Apparatus and Method for Utilizing Surface Mount Technology on Metal Substrates

#18

20220240369

2022-07-28

Circuit board and manufacturing method thereof and electronic device

#19

20220232695

2022-07-21

Circuit board and manufacturing method thereof and electronic device

#20

20220217850

2022-07-07

Method of producing wiring board that includes dual-layered insulating film

#21

20220183158

2022-06-09

Method of manufacturing printed wiring board

#22

20220167505

2022-05-26

Electronic device housings with patterned electrolytic plating layers

#23

20220046808

2022-02-10

METHOD OF MANUFACTURING CIRCUIT BOARD AND LAMINATE

#24

20210385944

2021-12-09

TRANSPARENT PCB AND METHOD FOR MANUFACTURING THE SAME

#25

20210282270

2021-09-09

Deposition with solid feedstock

#26

20210243904

2021-08-05

DIRECT INKJET PRINTING OF INFRASTRUCTURE FOR INTEGRATED CIRCUITS

#27

20210195762

2021-06-24

Method for fabricating printed circuit board and printed circuit board fabricated thereby

#28

20200205295

2020-06-25

System, Apparatus and Method for Utilizing Surface Mount Technology on Metal Substrates

#29

20200201178

2020-06-25

PHOTOCURABLE COMPOSITION HAVING LOW SHRINKAGE AFTER CURING

#30

20200113063

2020-04-09

Method for reducing thin films on low temperature substrates

#31

20190306990

2019-10-03

Display device and manufacturing method thereof

#32

20190281703

2019-09-12

Manufacturing method of circuit board

#33

20190191556

2019-06-20

CIRCUIT BOARD WITH A SUBSTRATE MADE OF SILICON

#34

20190191555

2019-06-20

CIRCUIT BOARD WITH A SUBSTRATE MADE OF SILICON

#35

20190191554

2019-06-20

Circuit board with a substrate made of silicon and the methods for forming the same

#36

20190157001

2019-05-23

Multilayer coil and method for manufacturing the same

#37

20190104618

2019-04-04

METHOD FOR SOLVENT-FREE PRINTING CONDUCTORS ON SUBSTRATE

#38

20190021171

2019-01-17

Circuit board and method for manufacturing the same

#39

20190018514

2019-01-17

TOUCH DISPLAY MODULE, MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE

#40

20180376599

2018-12-27

Piezochromic stamp

#41

20180270961

2018-09-20

DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF

#42

20180255648

2018-09-06

High-current transmitting method utilizing printed circuit board

#43

20180208785

2018-07-26

Interlayer printing process

#44

20180139850

2018-05-17

ELECTRICAL, PLATING AND CATALYTIC USES OF METAL NANOMATERIAL COMPOSITIONS

#45

20180103546

2018-04-12

Method for reducing thin films on low temperature substrates

#46

20180098435

2018-04-05

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

#47

20180092219

2018-03-29

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

#48

20170285786

2017-10-05

Wiring body, wiring board, touch sensor and method for producing wiring body

#49

20170277290

2017-09-28

Wiring body, wiring board, and touch sensor

#50

20170273191

2017-09-21

Manufacturing method of circuit board and stamp

#51

20170273190

2017-09-21

Manufacturing method of circuit board

#52

20170273189

2017-09-21

Manufacturing method of circuit board

#53

20170273187

2017-09-21

Plasma etching of solder resist openings

#54

20170273186

2017-09-21

Manufacturing method of circuit board

#55

20170231101

2017-08-10

Laminate for printed wiring board, method of manufacturing printed wiring board, and method of manufacturing electronic device

#56

20170171972

2017-06-15

Transparent conductive film and method for producing transparent conductive film

#57

20170156205

2017-06-01

Rigid-flex circuit board and manufacturing method thereof

#58

20170150598

2017-05-25

Light-transmitting conductor having nanostructure pattern and method for manufacturing same

#59

20170034920

2017-02-02

Method for manufacturing circuit board and circuit board

#60

20170027063

2017-01-26

Electrical, plating and catalytic uses of metal nanomaterial compositions

#61

20160192491

2016-06-30

Printed circuit board and method of manufacturing the same

#62

20160174390

2016-06-16

Substrate structure and manufacturing method thereof

#63

20160077628

2016-03-17

Touch screen, method for producing touch screen, touch display device

#64

20150313020

2015-10-29

Method of manufacturing glass component, glass component, and glass interposer

#65

20150313007

2015-10-29

Substrate structure and manufacturing method thereof

#66

20150305138

2015-10-22

Wrap-around micro-wire circuit method

#67

20150264795

2015-09-17

Suspension board and load beam combination including a positioning reference hole and a reinforcing layer

#68

20150201485

2015-07-16

Wiring substrate, manufacturing method therefor, and semiconductor package

#69

20150182142

2015-07-02

Insulated implantable electrical curcuit

#70

20150176133

2015-06-25

Method for reducing thin films on low temperature substrates

#71

20150118391

2015-04-30

THERMAL MANAGEMENT CIRCUIT MATERIALS, METHOD OF MANUFACTURE THEREOF, AND ARTICLES FORMED THEREFROM

#72

20150053457

2015-02-26

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

#73

20150050473

2015-02-19

Resin composition, printed circuit board using the composition, and method of manufacturing the same

#74

20150041428

2015-02-12

Methods of manufacturing printed circuit boards with stacked micro vias

#75

20140370203

2014-12-18

MICRO COLD SPRAY DIRECT WRITE SYSTEMS AND METHODS FOR PRINTED MICRO ELECTRONICS

#76

20140363633

2014-12-11

Methods of reducing a registration error of a photomask, and related photomasks and methods of manufacturing an integrated circuit

#77

20140363584

2014-12-11

Method of producing cured product and method of forming pattern

#78

20140352144

2014-12-04

METHODS FOR IMPROVING ELECTRICAL ISOLATION OF PATTERNED TRANSPARENT CONDUCTIVE FILMS

#79

20110041330

2011-02-24

Methods of manufacturing printed circuit boards with stacked micro vias

#80

20100032201

2010-02-11

Suspension board with circuit, producing method thereof, and positioning method of suspension board with circuit

#81

20090181184

2009-07-16

Method for reducing thin films on low temperature substrates

#82

20090178274

2009-07-16

Methods of manufacturing printed circuit boards with stacked micro vias

#83

20070246254

2007-10-25

Methods of manufacturing printed circuit boards with stacked micro vias

#84

20070158100

2007-07-12

Insulated implantable electrical circuit

#85

20060225274

2006-10-12

Insulated implantable electrical circuit

#86

15841313

2019-04-30

Method for forming a circuit board with a substrate made of silicon

#87

14244803

2016-01-26

Transparent metal mesh and method of manufacture