Patents-Review.com
ClassID:

234813 ⎘

H05K2203/0713 - CPC Classification

Classification description:

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by; Treatments involving liquids, e.g. plating, rinsing; Plating Plating poison, e.g. for selective plating or for preventing plating on resist

Recent Application in this class:
#1
20250234462
2025-07-17

Method of Plating a Printed Circuit Board

 #2
20210204409
2021-07-01

Method for manufacturing wiring board

 #3
20210153360
2021-05-20

Simultaneous and selective wide gap partitioning of via structures using plating resist

 #4
20200383204
2020-12-03

Simultaneous and selective wide gap partitioning of via structures using plating resist

 #5
20200015364
2020-01-09

Simultaneous and selective wide gap partitioning of via structures using plating resist

 #6
20190254176
2019-08-15

Implementing customized PCB via creation through use of magnetic pads

 #7
20190075662
2019-03-07

Simultaneous and selective wide gap partitioning of via structures using plating resist

 #8
20180317327
2018-11-01

METHODS OF FORMING SEGMENTED VIAS FOR PRINTED CIRCUIT BOARDS

 #9
20180310418
2018-10-25

Selective partitioning of via structures in printed circuit boards

 #10
20180237917
2018-08-23

ELECTROLESS PLATING METHOD AND PRODUCT OBTAINED

 #11
20180098426
2018-04-05

Simultaneous and selective wide gap partitioning of via structures using plating resist

 #12
20180092222
2018-03-29

Simultaneous and selective wide gap partitioning of via structures using plating resist

 #13
20160021762
2016-01-21

Selective partitioning of via structures in printed circuit boards

 #14
20140262455
2014-09-18

Simultaneous and selective wide gap partitioning of via structures using plating resist

 #15
20140251663
2014-09-11

Simultaneous and selective wide gap partitioning of via structures using plating resist

 #16
20140014401
2014-01-16

CIRCUIT DEVICE AND METHOD FOR MAKING THE SAME

 #17
20110292622
2011-12-01

METHOD FOR ELECTRIC CIRCUIT DEPOSITION

 #18
20110017495
2011-01-27

Method for preparing a patterned electric circuit

 #19
20100255325
2010-10-07

Plastic articles, optionally with partial metal coating

 #20
20090280243
2009-11-12

Photoresist-free metal deposition

 #21
20090277801
2009-11-12

Photoresist-free metal deposition

 #22
20090239079
2009-09-24

Process for Preventing Plating on a Portion of a Molded Plastic Part