H05K2203/0703 - CPC Classification Index

ClassID:

234810 ⎘

H05K2203/0703 - CPC Classification

Classification description:

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by; Treatments involving liquids, e.g. plating, rinsing Plating

Sub-classes:

H05K2203/0706 » Inactivating or removing catalyst, e.g. on surface of resist 7
H05K2203/0706 » Inactivating or removing catalyst, e.g. on surface of resist 7
H05K2203/0709 » Catalytic ink or adhesive for electroless plating 86
H05K2203/0709 » Catalytic ink or adhesive for electroless plating 86
H05K2203/0713 » Plating poison, e.g. for selective plating or for preventing plating on resist 21
H05K2203/0713 » Plating poison, e.g. for selective plating or for preventing plating on resist 21
H05K2203/0716 » Metallic plating catalysts, e.g. for direct electroplating of through holes; Sensitising or activating metallic plating catalysts 40
H05K2203/0716 » Metallic plating catalysts, e.g. for direct electroplating of through holes; Sensitising or activating metallic plating catalysts 40
H05K2203/072 » Electroless plating, e.g. finish plating or initial plating 328
H05K2203/072 » Electroless plating, e.g. finish plating or initial plating 328
H05K2203/0723 » Electroplating, e.g. finish plating 492
H05K2203/0723 » Electroplating, e.g. finish plating 492
H05K2203/0726 » Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure 40
H05K2203/0726 » Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure 40
H05K2203/073 » Displacement plating, substitution plating or immersion plating, e.g. for finish plating 48
H05K2203/073 » Displacement plating, substitution plating or immersion plating, e.g. for finish plating 48
H05K2203/0733 » Method for plating stud vias, i.e. massive vias formed by plating the bottom of a hole without plating on the walls 324
H05K2203/0733 » Method for plating stud vias, i.e. massive vias formed by plating the bottom of a hole without plating on the walls 324

Recent Application in this class:

20250379162

2025-12-11

HYBRID DTC EMBEDDING SUBSTRATE

20220386459

2022-12-01

Wiring circuit board and producing method thereof

20210014962

2021-01-14

Resin substrate and electronic device

20200389979

2020-12-10

Circuit forming method using selective etching of electrically conductive metal this film seed layer and etching solution composition

20200260594

2020-08-13

Creating in-via routing with a light pipe

20190198433

2019-06-27

Wiring substrate

20190069406

2019-02-28

Composite circuit board

20180192516

2018-07-05

Composite circuit board and method of manufacturing the same

20170290150

2017-10-05

Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board

#10

20170229757

2017-08-10

Plating methods for modular and/or ganged waveguides for automatic test equipment for semiconductor testing

#11

20170208695

2017-07-20

Sleeved coaxial printed circuit board vias

#12

20170181292

2017-06-22

METHOD FOR FORMING ORGANIC COATING ON NICKEL SURFACE

#13

20160338208

2016-11-17

Method of removing soluble material layer by dissolving, method of manufacturing member, socket for use in electronic part, and electric and electronic devices

#14