Patents-Review.com
ClassID:

234817 ⎘

H05K2203/0726 - CPC Classification

Classification description:

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by; Treatments involving liquids, e.g. plating, rinsing; Plating Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure

Recent Application in this class:
#1
20240292533
2024-08-29

WIRING BOARD

 #2
20240122073
2024-04-11

ELECTRICAL CONTACT ARRANGEMENT FOR MICROFABRICATED ULTRASONIC TRANSDUCER

 #3
20220159842
2022-05-19

Solder paste stencil with aperture wall coating

 #4
20200066966
2020-02-27

Electrical contact arrangement for microfabricated ultrasonic transducer

 #5
20190320529
2019-10-17

Circuit board pad resonance control system

 #6
20190003066
2019-01-03

Copper foil with minimized bagginess and tear, electrode comprising the same, secondary battery comprising the same and method for manufacturing the same

 #7
20180355495
2018-12-13

METALIZATION OF FLEXIBLE POLYMER SHEETS

 #8
20180279482
2018-09-27

SURFACE-TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, SUBSTRATE, RESIN SUBSTRATE, PRINTED WIRING BOARD, COPPER CLAD LAMINATE AND METHOD FOR PRODUCING PRINTED WIRING BOARD

 #9
20180235089
2018-08-16

WIRING BOARD AND MANUFACTURING METHOD OF WIRING BOARD

 #10
20180223412
2018-08-09

Roughened copper foil, copper clad laminate, and printed circuit board

 #11
20180063950
2018-03-01

COPPER FOIL PROVIDED WITH CARRIER, LAMINATE, PRINTED WIRING BOARD, ELECTRONIC DEVICE AND METHOD FOR FABRICATING PRINTED WIRING BOARD

 #12
20170365774
2017-12-21

Electrical contact arrangement for microfabricated ultrasonic transducer

 #13
20170096743
2017-04-06

Metalization of flexible polymer sheets

 #14
20170032978
2017-02-02

Carrier-attached copper foil, laminate, method for manufacturing printed-wiring board and method for manufacturing electronic device

 #15
20160234935
2016-08-11

Copper foil provided with carrier, laminate, printed wiring board, electronic device and method for fabricating printed wiring board

 #16
20160212857
2016-07-21

Copper foil provided with carrier, laminate, printed wiring board, and method for fabricating printed wiring board

 #17
20160183380
2016-06-23

Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board

 #18
20160157356
2016-06-02

Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board

 #19
20150097318
2015-04-09

Manufacturing method of interposed substrate

 #20
20150068912
2015-03-12

Copper foil structure having blackened ultra-thin foil and manufacturing method thereof

 #21
20140141274
2014-05-22

Copper foil structure having blackened ultra-thin foil and manufacturing method thereof

 #22
20130313011
2013-11-28

Interposed substrate and manufacturing method thereof

 #23
20110147934
2011-06-23

Metal plugged substrates with no adhesive between metal and polyimide

 #24
20110061234
2011-03-17

Method For Fabricating Carrier Board Having No Conduction Line

 #25
20090169837
2009-07-02

Method of manufacturing a package substrate

 #26
20090083976
2009-04-02

Method for manufacturing printed circuit board

 #27
20090057155
2009-03-05

Process of preparing copper foil for use in fine geometry circuit boards

 #28
20080307644
2008-12-18

Method of fabricating a semiconductor device

 #29
20070130762
2007-06-14

Circuit substrate manufacturing method

 #30
20070041123
2007-02-22

Method for making noble metal conductive leads for suspension assemblies

 #31
20060249834
2006-11-09

Method for fabricating structure of polymer-matrix conductive film

 #32
20060243972
2006-11-02

Structure of polymer-matrix conductive film and method for fabricating the same

 #33
20060175203
2006-08-10

Electroplating pcb components

 #34
20060085976
2006-04-27

Method of manufacturing a resilient contact

 #35
20060081989
2006-04-20

Structure of polymer-matrix conductive film and method for fabricating the same

 #36
20050255636
2005-11-17

Microtools for package substrate patterning

 #37
20050254175
2005-11-17

Method for making noble metal conductive leads for suspension assemblies

 #38
20050224256
2005-10-13

Interlayer member used for producing multilayer wiring board and method of producing the same

 #39
20050221112
2005-10-06

Microtools for package substrate patterning

 #40
20050155222
2005-07-21

Circuit substrate manufacturing method

 #41
17583236
2022-11-08

Electrodeposited copper foil and copper clad laminate