H05K2203/0763 - CPC Classification Index

ClassID:

234828 ⎘

H05K2203/0763 - CPC Classification

Classification description:

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by; Treatments involving liquids, e.g. plating, rinsing; Uses of liquids, e.g. rinsing, coating, dissolving Treating individual holes or single row of holes, e.g. by nozzle

Recent Application in this class:

20240431037

2024-12-26

DESIGN OF A RECYCLABLE ELECTRONIC DEVICE

20240422916

2024-12-19

CIRCUIT-FORMING METHOD AND CIRCUIT-FORMING APPARATUS

20230262904

2023-08-17

METHOD FOR AT LEAST PARTIALLY CLOSING A CHANNEL-SHAPED OPENING

20210204412

2021-07-01

Carbon-Based Direct Plating Process

20190350089

2019-11-14

Carbon-based direct plating process

20190335630

2019-10-31

Maintenance board

20120091188

2012-04-19

SOLDER POT

20120031873

2012-02-09

Etching device and method for manufacturing printed circuit board using same

20120006886

2012-01-12

Localized jet soldering device and partial jet soldering method

#10

20110284619

2011-11-24

Point flow soldering apparatus

#11

20100223775

2010-09-09

METHOD FOR DISMOUNTING ELECTRONIC DEVICE

#12

20100163606

2010-07-01

Apparatus and method of coating flux

#13

20100059575

2010-03-11

Device and method for selective soldering

#14

20090294169

2009-12-03

Printed circuit board fabrication method

#15

20090223710

2009-09-10

Method of forming solid vias in a printed circuit board

#16

20090127321

2009-05-21

Electronic assembly remanufacturing system and method

#17

20080057691

2008-03-06

Methods for selectively filling apertures in a substrate to form conductive vias with a liquid using a vacuum

#18

20060040517

2006-02-23

Method of mounting terminal on printed board, terminal mounted printed board and electric connection box accommodating the terminal mounted printed board, which are formed by the method