H05K2203/0756 - CPC Classification Index

ClassID:

234826 ⎘

H05K2203/0756 - CPC Classification

Classification description:

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by; Treatments involving liquids, e.g. plating, rinsing Uses of liquids, e.g. rinsing, coating, dissolving

Sub-classes:

H05K2203/0759 » Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer 115
H05K2203/0759 » Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer 115
H05K2203/0763 » Treating individual holes or single row of holes, e.g. by nozzle 18
H05K2203/0763 » Treating individual holes or single row of holes, e.g. by nozzle 18
H05K2203/0766 » Rinsing, e.g. after cleaning or polishing a conductive pattern 22
H05K2203/0766 » Rinsing, e.g. after cleaning or polishing a conductive pattern 22
H05K2203/0769 » Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure 56
H05K2203/0769 » Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure 56
H05K2203/0773 » Dissolving the filler without dissolving the matrix material; Dissolving the matrix material without dissolving the filler 25
H05K2203/0773 » Dissolving the filler without dissolving the matrix material; Dissolving the matrix material without dissolving the filler 25
H05K2203/0776 » Uses of liquids not otherwise provided for in - 81
H05K2203/0776 » Uses of liquids not otherwise provided for in - 81

Recent Application in this class:

20260113852

2026-04-23

METHOD OF MANUFACTURING CIRCUIT BOARD

20250294686

2025-09-18

DUAL LASER REPAIR DEVICE AND OPERATING METHOD THEREOF

20240172366

2024-05-23

COMPONENT MOUNT BOARD

20210402424

2021-12-30

SURFACE TREATMENT DEVICE

20210298180

2021-09-23

Circuit forming method

20210095161

2021-04-01

Polishing composition and polishing method

20190191556

2019-06-20

CIRCUIT BOARD WITH A SUBSTRATE MADE OF SILICON

20170042031

2017-02-09

Method for protecting an electronic circuit carrier against environmental influences and circuit module

20160338208

2016-11-17

Method of removing soluble material layer by dissolving, method of manufacturing member, socket for use in electronic part, and electric and electronic devices

#10

20150264795

2015-09-17

Suspension board and load beam combination including a positioning reference hole and a reinforcing layer

#11

20100032201

2010-02-11

Suspension board with circuit, producing method thereof, and positioning method of suspension board with circuit

#12

15841313

2019-04-30

Method for forming a circuit board with a substrate made of silicon

#13

14304650

2018-08-21

Fabrication methods for bio-compatible devices using an etch stop and/or a coating