Patents-Review.com
ClassID:

234831 ⎘

H05K2203/0773 - CPC Classification

Classification description:

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by; Treatments involving liquids, e.g. plating, rinsing; Uses of liquids, e.g. rinsing, coating, dissolving Dissolving the filler without dissolving the matrix material; Dissolving the matrix material without dissolving the filler

Recent Application in this class:
#1
20160079174
2016-03-17

Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers

 #2
20150027768
2015-01-29

Resin composition for solder bump formation, solder bump formation method, and member having solder bumps

 #3
20140290992
2014-10-02

Conductive film with networked nano-material

 #4
20130299226
2013-11-14

Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers

 #5
20130000965
2013-01-03

DIELECTRIC COMPOSITION, MULTILAYERED PRINTED CIRCUIT BOARD COMPRISING DIELECTRIC LAYER MANUFACTURED THEREOF, AND METHOD FOR PREPARING THE MULTILAYERED PRINTED CIRCUIT BOARD

 #6
20120186867
2012-07-26

Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board

 #7
20120152599
2012-06-21

Printed wiring board, build-up multi-layer board, and production method therefor

 #8
20120125680
2012-05-24

MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

 #9
20110253306
2011-10-20

Method of manufacturing multi-layer printed circuit board

 #10
20110252641
2011-10-20

Method of manufacturing multi-layer printed circuit board

 #11
20110192637
2011-08-11

Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board

 #12
20110189432
2011-08-04

EPOXY RESIN COMPOSITION, PREPREG, CURED BODY, SHEET-LIKE MOLDED BODY, LAMINATE AND MULTILAYER LAMINATE

 #13
20110036626
2011-02-17

Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board

 #14
20110024164
2011-02-03

MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD

 #15
20100122840
2010-05-20

Multi-layer printed circuit board and method of manufacturing multilayer printed circuit board

 #16
20090242109
2009-10-01

Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers

 #17
20090029506
2009-01-29

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

 #18
20090000951
2009-01-01

Method for Forming Electroconductive Circuit

 #19
20080277148
2008-11-13

Multi-layer printed circuit board and method of manufacturing multilayer printed circuit board

 #20
20080189943
2008-08-14

Method of manufacturing a multilayered printed circuit board

 #21
20080173473
2008-07-24

Multilayered printed circuit board and manufacturing method thereof

 #22
20070131243
2007-06-14

Method for cleaning surface of resin layer

 #23
20070025091
2007-02-01

Printed wiring board

 #24
20050178501
2005-08-18

Process for producing a multi-layer printer wiring board

 #25
20050039948
2005-02-24

Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board