H05K2203/0779 - CPC Classification Index

ClassID:

234833 ⎘

H05K2203/0779 - CPC Classification

Classification description:

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by; Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved

Sub-classes:

H05K2203/0783 » Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity 101
H05K2203/0783 » Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity 101
H05K2203/0786 » Using an aqueous solution, e.g. for cleaning or during drilling of holes 51
H05K2203/0786 » Using an aqueous solution, e.g. for cleaning or during drilling of holes 51

Recent Application in this class:

20250351268

2025-11-13

Component Carrier, Method and Apparatus for Manufacturing the Component Carrier

20250040056

2025-01-30

METHOD OF PROVIDING ARTICLE WITH ELECTRICALLY-CONDUCTIVE PATTERN

20240102174

2024-03-28

Etch Chemistry For Metallic Materials

20240006285

2024-01-04

SUBSTRATES HAVING ADHESION PROMOTOR LAYERS AND RELATED METHODS

20200102657

2020-04-02

Etch chemistry for metallic materials

20200006777

2020-01-02

Copper foil having excellent adhesive strength, electrode comprising same, secondary battery comprising same, and manufacturing method therefor

20190141833

2019-05-09

Wiring substrate and process for producing it

20180332712

2018-11-15

HIGH-RESOLUTION PRINTING TECHNIQUE

20150195915

2015-07-09

DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME

#10

20140357147

2014-12-04

CORE OF PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

#11

17542539

2022-11-01

Liquid mixture for filling blind holes in copper foil