234835 ⎘
Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by; Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved Using an aqueous solution, e.g. for cleaning or during drilling of holes
Sub-classes:Ceramic-cladded copper plate and method for manufacturing ceramic-cladded copper plate
#2APPARATUS AND METHOD FOR FORMING A RESIST FINE PATTERN
#3ELECTRONIC CIRCUIT HAVING GRAPHENE OXIDE PAPER SUBSTRATE AND METHOD OF RECOVERING PARTS OF AN ELECTRONIC CIRCUIT
#4Bath and method for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloy
#5High thermal conductivity prepreg and uses of the same
#6Electroless copper plating polydopamine nanoparticles
#7MINIATURIZED CIRCUIT AND METHOD OF MAKING THE SAME
#8METHOD FOR PRODUCING PRINTED CIRCUIT BOARD, AND RESIN COMPOSITION
#9Transient electronic devices comprising inorganic or hybrid inorganic and organic substrates and encapsulates
#10Microreactor-assisted printing of conductive traces with in-situ reactive inks
#11Electroless copper plating polydopamine nanoparticles
#12Biodegradable materials for multilayer transient printed circuit boards
#13Hybrid electronic sheets
#14Hybrid electronic sheets
#15Materials, electronic systems and modes for active and passive transience
#16Aqueous phase pore sealing agent imroving PCB coating oxidation-resistant and corrosion-resistant properties and method for using same
#17Transient electronic devices comprising inorganic or hybrid inorganic and organic substrates and encapsulates
#18Method for improving plating on non-conductive substrates
#19METHOD FOR PRODUCING A CONDUCTIVE FILM
#20Method for improving plating on non-conductive substrates
#21Process for cleaning articles
#22SUPPORT BOARD FOR PERFORATION PROCESSING AND METHOD OF PERFORATION PROCESSING
#23Organic polymer coating for protection against creep corrosion
#24Metal-clad laminate
#25Process for the production of entry sheet for drilling and entry sheet
#26SUPPORT BOARD FOR PERFORATION PROCESSING AND METHOD OF PERFORATION PROCESSING
#27Laminate including water soluble release layer for producing circuit board and method of producing circuit board
#28FILM FOR METAL FILM TRANSFER, METHOD FOR TRANSFERRING METAL FILM AND METHOD FOR MANUFACTURING CIRCUIT BOARD
#29Conductive film and method of producing thereof
#30Process for preparing conductive material
#31FLEXIBLE PC BOARD MADE THROUGH A WATER CLEANING PROCESS
#32COMPOSITIONS AND METHODS FOR WET LAMINATION OF PHOTOPOLYMERIZABLE DRY FILMS ONTO SUBSTRATES
#33Water-soluble preflux and usage of the same
#34Method for forming film of silane coupling agent
#35POLISHING COMPOUND AND POLISHING METHOD
#36Process for producing articles having an electrically conductive coating
#37Circuit board and manufacturing method of the same
#38Method for attachment of solder powder to electronic circuit board and solder-attached electronic circuit board
#39Process for the production of entry sheet for drilling and use thereof
#40ETCHED DIELECTRIC FILM IN HARD DISK DRIVES
#41Method for cleaning surface of resin layer
#42Method for manufacturing crystalline dielectric film,crystalline dielectric film manufactured thereby and thin film capacitor having the same
#43Etchant rinse method
#44Circuit board and process for producing the same
#45Selective application of conductive material to substrates by pick and place of compliant contact arrays
#46Method of cleaning substrate
#47Ink composition for etching resist, method of forming etching resist pattern using the same, and method of forming microchannel using the ink composition
#48Method of cleaning substrate
#49Selective application of conductive material to circuit boards by pick and place
#50Apparatus and method for formation of a wiring pattern on a substrate, and electronic devices and producing methods thereof
#51Water soluble protective paste for manufacturing printed circuit boards
#52Printed wiring board, electronic component mounting method, and electronic apparatus