ClassID:

234861

H05K2203/1115 - CPC Classification

Classification description:

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by; Treatments characterised by their effect, e.g. heating, cooling, roughening Resistance heating, e.g. by current through the PCB conductors or through a metallic mask

Recent Application in this class:
#1
20240314935
2024-09-19

DONOR PLATE, DEPOSITION DEVICE AND DEPOSITION METHOD

#2
20210227700
2021-07-22

Method for repairing conductor tracks

#3
20200245469
2020-07-30

Repairing defective through-holes

#4
20200229294
2020-07-16

Reflowable grid array to support grid heating

#5
20200128676
2020-04-23

Facilitating filling a plated through-hole of a circuit board with solder

#6
20190232292
2019-08-01

Test element support

#7
20190200463
2019-06-27

Heating of printed circuit board core during laminate cure

#8
20190098759
2019-03-28

Method to neutralize incorrectly oriented printed diodes

#9
20180190609
2018-07-05

Ball grid array rework

#10
20180139851
2018-05-17

Manufacturing a product using a soldering process

#11
20180007796
2018-01-04

Apparatus for interconnecting circuitry

#12
20170354043
2017-12-07

Heating of printed circuit board core during laminate cure

#13
20160270240
2016-09-15

Manufacturing a product using a soldering process

#14
20160197053
2016-07-07

Ball grid array rework

#15
20160120040
2016-04-28

Fabrication of intra-structure conductive traces and interconnects for three-dimensional manufactured structures

#16
20160035694
2016-02-04

Method of manufacturing electronic device

#17
20150173173
2015-06-18

Circuit board with thermal control

#18
20150113799
2015-04-30

Electronic component assembly apparatus

#19
20140361004
2014-12-11

Flexible display apparatus and method of controlling flexibility of the same

#20
20140345123
2014-11-27

Manufacturing a product using a soldering process

#21
20140020245
2014-01-23

Manufacturing of stacks of multilayer plastic laminates for printed circuits

#22
20140016261
2014-01-16

Heating and heat dissipating multi-layer circuit board structure for keeping operating temperature of electronic components

#23
20130301231
2013-11-14

Electronic module produced by sequential fixation of the components

#24
20130291378
2013-11-07

Electronic component mounting device

#25
20130180973
2013-07-18

Printed circuit board with embedded heater

#26
20130115369
2013-05-09

APPARATUS FOR FORMING CIRCUIT PATTERN ON PCB AND METHOD FOR FORMING CIRCUIT PATTERN USING THE SAME

#27
20120330234
2012-12-27

DEVICE FOR HEATING FLOWING FLUIDS AND PRODUCTION METHOD

#28
20120275128
2012-11-01

Electronic component and electronic component assembly apparatus

#29
20120138339
2012-06-07

METHOD OF PRODUCING AN ELECTRICALLY CONDUCTING VIA IN A SUBSTRATE

#30
20120122278
2012-05-17

Method Of Manufacturing Semiconductor Package Board

#31
20120085750
2012-04-12

Covering Device for an Organic Substrate, Substrate with a Covering Device, and Method for Producing a Covering Device

#32
20110215232
2011-09-08

System for maintaining an even temperature distribution across a laser detector

#33
20110134617
2011-06-09

POLYMER MOLDED BODIES AND PRINTED CIRCUIT BOARD ARRANGEMENT AND METHOD FOR THE PRODUCTION THEREOF

#34
20110042132
2011-02-24

METHOD OF PRODUCING AN ELECTRICALLY CONDUCTING VIA IN A SUBSTRATE

#35
20100325884
2010-12-30

Component mounting apparatus

#36
20100308030
2010-12-09

Method for fabricating a heating element by depositing thin layers on an insulating substrate and the element thus obtained

#37
20100252186
2010-10-07

Methods and apparatuses for assembling components onto substrates

#38
20100193232
2010-08-05

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

#39
20100149810
2010-06-17

Mounting structure of component of lighting device and method thereof

#40
20100129687
2010-05-27

Circuit board for secondary battery and secondary battery with the circuit board

#41
20100046176
2010-02-25

Portable electronic device with maintenance capability

#42
20090301769
2009-12-10

Method for manufacturing conductors and semiconductors

#43
20090217519
2009-09-03

Method for producing an electronic module by means of sequential fixation of the components, and corresponding production line

#44
20090166339
2009-07-02

METHOD FOR PRODUCING AN ELECTRONIC MODULE BY SEQUENTIAL FIXATION OF THE COMPONENTS

#45
20080245674
2008-10-09

SYSTEM AND METHOD FOR OBTAINING ANISOTROPIC ETCHING OF PATTERNED SUBSTRATES

#46
20080112131
2008-05-15

CURRENT SENSING TEMPERATURE CONTROL CIRCUIT AND METHODS FOR MAINTAINING OPERATING TEMPERATURES WITHIN INFORMATION HANDLING SYSTEMS

#47
20080105670
2008-05-08

Printed circuit board or card comprising a heating wire

#48
20080059001
2008-03-06

Current sensing temperature control circuit and methods for maintaining operating temperatures within information handling systems

#49
20060289464
2006-12-28

Electric PCB heating component, electronic circuit board and heating method

#50
20050286238
2005-12-29

Device and method of manufacture of an interconnection structure for printed circuit boards

#51
20050094356
2005-05-05

Circuit assembly, producing method of the same, distribution unit and bus bar substrate