H05K2203/11 - CPC Classification Index

ClassID:

234858 ⎘

H05K2203/11 - CPC Classification

Classification description:

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by Treatments characterised by their effect, e.g. heating, cooling, roughening

Sub-classes:

H05K2203/1105 » Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating 475
H05K2203/1105 » Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating 475
H05K2203/111 » Preheating, e.g. before soldering 37
H05K2203/111 » Preheating, e.g. before soldering 37
H05K2203/1115 » Resistance heating, e.g. by current through the PCB conductors or through a metallic mask 51
H05K2203/1115 » Resistance heating, e.g. by current through the PCB conductors or through a metallic mask 51
H05K2203/1121 » Cooling, e.g. specific areas of a PCB being cooled during reflow soldering 66
H05K2203/1121 » Cooling, e.g. specific areas of a PCB being cooled during reflow soldering 66
H05K2203/1126 » Firing, i.e. heating a powder or paste above the melting temperature of at least one of its constituents 102
H05K2203/1126 » Firing, i.e. heating a powder or paste above the melting temperature of at least one of its constituents 102
H05K2203/1131 » Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity 346
H05K2203/1131 » Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity 346
H05K2203/1136 » Conversion of insulating material into conductive material, e.g. by pyrolysis 30
H05K2203/1136 » Conversion of insulating material into conductive material, e.g. by pyrolysis 30
H05K2203/1142 » Conversion of conductive material into insulating material or into dissolvable compound 50
H05K2203/1142 » Conversion of conductive material into insulating material or into dissolvable compound 50
H05K2203/1147 » Sealing or impregnating, e.g. of pores 144
H05K2203/1147 » Sealing or impregnating, e.g. of pores 144
H05K2203/1152 » Replicating the surface structure of a sacrificial layer, e.g. for roughening 105
H05K2203/1152 » Replicating the surface structure of a sacrificial layer, e.g. for roughening 105
H05K2203/1157 » Using means for chemical reduction 125
H05K2203/1157 » Using means for chemical reduction 125
H05K2203/1163 » Chemical reaction, e.g. heating solder by exothermic reaction 74
H05K2203/1163 » Chemical reaction, e.g. heating solder by exothermic reaction 74
H05K2203/1168 » Graft-polymerization 20
H05K2203/1168 » Graft-polymerization 20
H05K2203/1173 » Differences in wettability, e.g. hydrophilic or hydrophobic areas 180
H05K2203/1173 » Differences in wettability, e.g. hydrophilic or hydrophobic areas 180
H05K2203/1178 » Means for venting or for letting gases escape 152
H05K2203/1178 » Means for venting or for letting gases escape 152
H05K2203/1184 » Underetching, e.g. etching of substrate under conductors or etching of conductor under dielectrics; Means for allowing or controlling underetching 73
H05K2203/1184 » Underetching, e.g. etching of substrate under conductors or etching of conductor under dielectrics; Means for allowing or controlling underetching 73
H05K2203/1189 » Pressing leads, bumps or a die through an insulating layer 225
H05K2203/1189 » Pressing leads, bumps or a die through an insulating layer 225
H05K2203/1194 » Thermal treatment leading to a different chemical state of a material, e.g. annealing for stress-relief, aging 49
H05K2203/1194 » Thermal treatment leading to a different chemical state of a material, e.g. annealing for stress-relief, aging 49

Recent Application in this class:

20260101443

2026-04-09

Structure Utilizing a PCB as an Interconnecting Carrier for Heating Elements

20260068059

2026-03-05

COMPOSITE CERAMIC SUBSTRATE AND METHOD FOR PRODUCING THE SAME

20250227853

2025-07-10

PHOTOSENSITIVE MULTILAYER RESIN FILM, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD FOR PRODUCING PRINTED WIRING BOARD

20250151251

2025-05-08

PORTABLE BAKING ASSEMBLY TO CURE THERMAL INTERFACE MATERIAL FOR PROCESSING UNITS

20240341039

2024-10-10

METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD

20240318915

2024-09-26

MECHATRONIC CURTAIN FOR A PROCESS CHAMBER FOR CARRYING OUT THERMAL PROCESSES IN THE MANUFACTURE OF ELECTRONIC ASSEMBLIES

20240244763

2024-07-18

Method for coating and forming novel material layer structure of high-frequency circuit board and article thereof

20220306888

2022-09-29

Molecular ink and method for printing resistive film coatings

20220304165

2022-09-22

Method for coating and forming novel material layer structure of high-frequency circuit board and article thereof

#10

20190269011

2019-08-29

Display device and method of manufacturing the same

#11

20190090346

2019-03-21

Ceramic circuit board and semiconductor device using the same

#12

20180200990

2018-07-19

Substrate for electrical circuits and method for producing a substrate of this type

#13

20180200989

2018-07-19

Substrate for electrical circuits and method for producing a substrate of this type

#14

20180190634

2018-07-05

Configurable semiconductor package

#15

20180139852

2018-05-17

Printed circuit board and methods to enhance reliability

#16

20170208686

2017-07-20

Copper foil, copper-clad laminate board, method for producing printed wiring board, method for producing electronic apparatus, method for producing transmission channel, and method for producing antenna

#17