ClassID:

234871

H05K2203/1168 - CPC Classification

Classification description:

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by; Treatments characterised by their effect, e.g. heating, cooling, roughening Graft-polymerization

Recent Application in this class:
#1
20240237230
2024-07-11

Component Carrier With Photosensitive Adhesion Promoter and Method of Manufacturing the Same

#2
20150299364
2015-10-22

Dispersant, metal particle dispersion for electroconductive substrates, and method for producing electroconductive substrate

#3
20150279505
2015-10-01

Metal particle dispersion for electroconductive substrates, method for producing the same, and method for producing an electroconductive substrate

#4
20140017575
2014-01-16

Metal coating of objects using plasma polymerisation pretreatment

#5
20110121947
2011-05-26

RF TAG AND METHOD FOR PRODUCING SAME

#6
20100272902
2010-10-28

PLATING METHOD, METHOD FOR FORMING METAL THIN FILM, AND PLATING CATALYST LIQUID

#7
20100243311
2010-09-30

Substrate with metal film and method for manufacturing the same

#8
20100224317
2010-09-09

METHOD FOR FORMING GRAFT POLYMER PATTERN AND METHOD FOR FORMING ELECTRICALLY CONDUCTIVE PATTERN

#9
20100044079
2010-02-25

Metal Deposition

#10
20090277672
2009-11-12

Method for forming metal pattern, metal pattern and printed wiring board

#11
20090136719
2009-05-28

SURFACE GRAFT MATERIAL AND ITS MANUFACTURING METHOD, ELECTRICALLY CONDUCTIVE MATERIAL AND ITS MANUFACTURING METHOD, AND ELECTRICALLY CONDUCTIVE PATTERN MATERIAL

#12
20090127517
2009-05-21

High-frequency substrate and production method therefor

#13
20090114432
2009-05-07

LAMINATE FOR PRINTED WIRING BOARD, PRINTED WIRING BOARD USING SAME, METHOD FOR MANUFACTURING PRINTED WIRING BOARD, ELECTRICAL COMPONENT, ELECTRONIC COMPONENT, AND ELECTRICAL DEVICE

#14
20090090463
2009-04-09

PATTERN FORMING METHOD AND METHOD FOR FORMING MULTILAYER WIRING STRUCTURE

#15
20080286585
2008-11-20

Method to Produce Adhesiveless Metallized Polyimide Film

#16
20080038468
2008-02-14

Method for manufacturing an electro-conductive pattern material

#17
20080029294
2008-02-07

Method of making multi-layer circuit board

#18
20050266352
2005-12-01

Metallic pattern forming method and conductive pattern material

#19
20050215721
2005-09-29

Pattern forming method, arranged fine particle pattern forming method, conductive pattern forming method, and conductive pattern material

#20
20050214693
2005-09-29

Pattern forming method, graft pattern material, conductive pattern forming method and conductive pattern material