ClassID:

234874

H05K2203/1184 - CPC Classification

Classification description:

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by; Treatments characterised by their effect, e.g. heating, cooling, roughening Underetching, e.g. etching of substrate under conductors or etching of conductor under dielectrics; Means for allowing or controlling underetching

Recent Application in this class:
#1
20230337370
2023-10-19

Printed circuit board and method of fabricating the same

#2
20220319865
2022-10-06

Interconnect structure for insertion loss reduction in signal transmission and method thereof

#3
20220240390
2022-07-28

Printed circuit board and method of fabricating the same

#4
20210345494
2021-11-04

Methods and processes for forming electrical circuitries on three-dimensional geometries

#5
20210243901
2021-08-05

Printed circuit board and method of fabricating the same

#6
20210227696
2021-07-22

Methods of etching conductive features, and related devices and systems

#7
20210120677
2021-04-22

Printed circuit board and method of manufacturing the same

#8
20200396846
2020-12-17

Printed circuit board and method of fabricating the same

#9
20200286844
2020-09-10

SEMICONDUCTOR DEVICE WITH ELECTROPLATED COPPER STRUCTURES

#10
20200146156
2020-05-07

Printed circuit board and method of fabricating the same

#11
20190335589
2019-10-31

Methods of etching conductive features, and related devices and systems

#12
20190274220
2019-09-05

Circuit board and manufacturing method therefor

#13
20180332714
2018-11-15

Printed circuit board and method of fabricating the same

#14
20180192521
2018-07-05

Methods of etching conductive features, and related devices and systems

#15
20170135223
2017-05-11

Method of manufacturing printed circuit board

#16
20170055347
2017-02-23

Printed circuit board and method of manufacturing the same

#17
20170019992
2017-01-19

Printed circuit board and method of fabricating the same

#18
20160249463
2016-08-25

Method for manufacturing multilayer wiring substrate

#19
20160242299
2016-08-18

Method for manufacturing multilayer wiring substrate

#20
20160242285
2016-08-18

Printed wiring board

#21
20160192482
2016-06-30

Patterned conductive structure and method for forming the same

#22
20160104679
2016-04-14

Methods of forming substrate microvias with anchor structures

#23
20150342050
2015-11-26

Origami enabled manufacturing systems and methods

#24
20150289380
2015-10-08

Method of fabricating a wiring board

#25
20150250054
2015-09-03

Printed wiring board, method for manufacturing printed wiring board, and package-on-package

#26
20150092379
2015-04-02

Semiconductor device and method for manufacturing the same

#27
20150041192
2015-02-12

Line width protector printed circuit board and method of manufacturing the same

#28
20150027752
2015-01-29

Printed circuit board and method of manufacturing same

#29
20150014027
2015-01-15

Wiring board and method for manufacturing the same

#30
20150009645
2015-01-08

Wiring substrate and semiconductor package

#31
20140151109
2014-06-05

Conductive pattern and manufacturing method thereof

#32
20140138134
2014-05-22

Wiring substrate

#33
20130134127
2013-05-30

Method of fabricating a wiring board

#34
20120175157
2012-07-12

Wiring board and method of producing the same

#35
20120031647
2012-02-09

Conductive pattern and manufacturing method thereof

#36
20110290548
2011-12-01

Method for manufacturing insulated conductive pattern and laminate

#37
20110253794
2011-10-20

Method for manufacturing a component by etching

#38
20110092083
2011-04-21

Out of plane integral conductive arms and methods for manufacturing the same

#39
20110048782
2011-03-03

Solder pad structure with high bondability to solder ball

#40
20100208437
2010-08-19

Multilayer wiring substrate and method for manufacturing the same

#41
20100193225
2010-08-05

Circuit board, method of manufacturing the same, and resistance element

#42
20100132995
2010-06-03

Wiring board and method of producing the same

#43
20100084163
2010-04-08

WIRING BOARD AND METHOD OF FABRICATING THE SAME

#44
20100065852
2010-03-18

System for displaying images and fabricating method thereof

#45
20100051324
2010-03-04

DIELECTRIC SUBSTRATE WITH HOLES AND METHOD OF MANUFACTURE

#46
20100032194
2010-02-11

PRINTED WIRING BOARD, MANUFACTURING METHOD FOR PRINTED WIRING BOARD AND ELECTRONIC DEVICE

#47
20100000776
2010-01-07

Circuit board and method of manufacturing the same

#48
20090266587
2009-10-29

FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF FORMING FINE PITCH THEREIN

#49
20090236137
2009-09-24

Method for forming resist pattern, method for producing circuit board, and circuit board

#50
20090226665
2009-09-10

Nickel structures and methods for manufacturing the same by removal of an underlying material

#51
20090133908
2009-05-28

INTERCONNECT STRUCTURE FOR A MICROELECTRONIC DEVICE, METHOD OF MANFACTURING SAME, AND MICROELECTRONIC STRUCTURE CONTAINING SAME

#52
20090114345
2009-05-07

Method for manufacturing a substrate for mounting a semiconductor element

#53
20080308307
2008-12-18

TRACE STRUCTURE AND METHOD FOR FABRICATING THE SAME

#54
20080308302
2008-12-18

Printed circuit board with anti-oxidation layer

#55
20080277147
2008-11-13

Wired circuit board and producing method thereof

#56
20080185362
2008-08-07

Printed circuit board and manufacturing method thereof

#57
20080137263
2008-06-12

Method of fabricating a microelectronic device including embedded thin film capacitor by over-etching thin film capacitor bottom electrode and microelectronic device made according to the method

#58
20080041822
2008-02-21

Substrate having blind hole and method for forming blind hole

#59
20070181994
2007-08-09

Circuit board manufacturing method and circuit board

#60
20070170566
2007-07-26

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

#61
20070170556
2007-07-26

Semiconductor device having flange structure

#62
20070158104
2007-07-12

Printed wiring board and production method thereof

#63
20070122553
2007-05-31

Method of forming patterned film

#64
20070074902
2007-04-05

Printed-wiring board, multilayer printed-wiring board and manufacturing process therefor

#65
20070062730
2007-03-22

CONTROLLED DEPTH ETCHED VIAS

#66
20070049060
2007-03-01

Printed circuit board and manufacturing method thereof

#67
20070017090
2007-01-25

Method of forming metal plate pattern and circuit board

#68
20060141762
2006-06-29

Interlocking via for package via integrity

#69
20060006536
2006-01-12

BGA package with concave shaped bonding pads

#70
20050101136
2005-05-12

Etching method and method of manufacturing circuit device using the same

#71
20050006765
2005-01-13

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

#72
20050006763
2005-01-13

Circuit substrate, semiconductor module and method of manufacturing circuit substrate

#73
20050000816
2005-01-06

Method of making a microstructure using a circuit board