234876 ⎘
Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by; Treatments characterised by their effect, e.g. heating, cooling, roughening Thermal treatment leading to a different chemical state of a material, e.g. annealing for stress-relief, aging
THIN, STRETCHABLE AND FLEXIBLE PRINTED CIRCUIT AND MANUFACTURING METHOD THEREFOR
#2CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
#3SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
#4LAMINATE, FILM, THERMOSETTING FILM, AND MANUFACTURING METHOD OF WIRING BOARD
#5WIRING BOARD
#6METHOD FOR FABRICATING ELECTRONIC CIRCUIT AND METAL ION SOLUTION
#7Insulated circuit board
#8WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
#9Wiring board and method for manufacturing wiring board
#10Hermetic metallized via with improved reliability
#11Flexible laminated board and multilayer circuit board
#12Glass circuit board and stress relief layer
#13Doped, low-temperature co-fired glass-ceramic (LTCC) insulating substrates, and related wiring boards and methods of manufacture
#14Conductive graphene interfacial barriers for liquid metal electronics
#15Hermetic metallized via with improved reliability
#16Hermetic metallized via with improved reliability
#17Wiring substrate
#18Substrate for high-frequency printed wiring board
#19Method of forming a metal silicide transparent conductive electrode
#20Method of forming a metal silicide transparent conductive electrode
#21High-speed interconnects for printed circuit boards
#22Substrate with transparent electrode and method for manufacturing same
#23Wiring substrate
#24GLASS SUBSTRATE ASSEMBLIES HAVING LOW DIELECTRIC PROPERTIES
#25Substrates for stretchable electronics and method of manufacture
#26Circuit board and method for manufacturing same
#27High-speed interconnects for printed circuit boards
#28Method of fabricating heat dissipating board
#29Fabrication of intra-structure conductive traces and interconnects for three-dimensional manufactured structures
#30Two-step, direct-write laser metallization
#31Method of forming a metal silicide transparent conductive electrode
#32Substrate with transparent electrode and method for manufacturing same
#33POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE WITH HEAT SINK, POWER MODULE, METHOD OF PRODUCING POWER MODULE SUBSTRATE, PASTE FOR COPPER SHEET BONDING, AND METHOD OF PRODUCING BONDED BODY
#34Methods for assembling electronic devices with adhesive
#35Flexible printed circuits with bend retention structures
#36One up, one down connection structure for piezoelectric device in tire patch
#37OPTICAL COMMUNICATION MODULE AND METHOD FOR ASSEMBLING SAME
#38Method for producing substrate with transparent electrode, and substrate with transparent electrode
#39Flexible printed circuit board and method for making same
#40Methods of forming conductive jumper traces
#41Structures for z-axis interconnection of multilayer electronic substrates
#42Electronic circuit board, assembly and a related method thereof
#43Photonic heating of silver grids
#44Structure with a metal silicide transparent conductive electrode and a method of forming the structure
#45Method of processing solder bump by vacuum annealing
#46Transparent capacitor with multi-layer grid structure
#47Making transparent capacitor with multi-layer grid
#48Methods of Forming Through-Substrate Vias
#49Method of manufacturing multilayer printed wiring board
#50METHOD OF MANUFACTURING THIN-FILM DIELECTRICS AND CAPACITORS ON METAL FOILS
#51Method of manufacturing electric device
#52Graduated stiffness for electrical connections in tires
#53Strain-resistant electrical connection