H05K2203/1344 - CPC Classification Index

ClassID:

234892 ⎘

H05K2203/1344 - CPC Classification

Classification description:

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by; Moulding and encapsulation; Deposition techniques; Protective layers; Deposition techniques, e.g. coating Spraying small metal particles or droplets of molten metal

Recent Application in this class:

20230422402

2023-12-28

Lift Printing of Fine Metal Lines

20200120809

2020-04-16

Method for manufacturing aluminum circuit board

20190214781

2019-07-11

Method for manufacturing electrically conductive adhesive film, electrically conductive adhesive film, and method for manufacturing connector

20190092955

2019-03-28

Liquid metal ink

20190008065

2019-01-03

Integrated wiring system for composite structures

20180332711

2018-11-15

Method for creating patterned coatings on a molded article, and device for carrying out said method

20180324948

2018-11-08

Systems and methods for strain sensing using aerosol jet printing of flexible capacitive strain gauges

20180168029

2018-06-14

EMI shielding structure and manufacturing method thereof

20170236777

2017-08-17

Method for reinforcing conductor tracks of a circuit board

#10

20160200095

2016-07-14

Printing of multiple inks to achieve precision registration during subsequent processing

#11

20150342077

2015-11-26

Integrated wiring system for composite structures

#12

20150329958

2015-11-19

Printing of multiple inks to achieve precision registration during subsequent processing

#13

20150310982

2015-10-29

Method for producing a coil and electronic device

#14

20150024119

2015-01-22

Method and arrangement for transferring electrically conductive material in fluid form on a substrate to be printed

#15

20140377474

2014-12-25

Method and use of a binder for providing a metallic coat covering a surface

#16

20140370203

2014-12-18

MICRO COLD SPRAY DIRECT WRITE SYSTEMS AND METHODS FOR PRINTED MICRO ELECTRONICS

#17

20140252394

2014-09-11

Light emitting device

#18

20140232552

2014-08-21

Digitizing sensors coupled to a structure

#19

20140160650

2014-06-12

Methods for applying protective coatings to internal surfaces of fully assembled electronic devices

#20

20140138124

2014-05-22

Method of manufacturing an electronic high-current circuit by means of gas injection technology and sealing with an insulating polymer

#21

20140132386

2014-05-15

Method for producing a coil

#22

20140131067

2014-05-15

Transparent conductor and preparation method thereof

#23

20140099788

2014-04-10

Method for applying an image of an electrically conductive material onto a recording medium and device for ejecting droplets of an electrically conductive fluid

#24

20140072705

2014-03-13

Systems, devices and methods related to paint recirculation during manufacture of radio-frequency modules

#25

20140070022

2014-03-13

Systems, devices and methods related to spray-painting fluid path for manufacture of radio-frequency modules

#26

20130248232

2013-09-26

CONDUCTIVE PATTERN FILM SUBSTRATE AND MANUFACTURING METHOD

#27

20130236653

2013-09-12

Method and use of a binder for providing a metallic coat covering a surface

#28

20130082298

2013-04-04

LED light disposed on a flexible substrate and connected with a printed 3D conductor

#29

20120328794

2012-12-27

Method for producing an anisotropic conductive film

#30

20120256323

2012-10-11

Method for processing a semiconductor wafer or die, and particle deposition device

#31

20120175667

2012-07-12

LED LIGHT DISPOSED ON A FLEXIBLE SUBSTRATE AND CONNECTED WITH A PRINTED 3D CONDUCTOR

#32

20110272826

2011-11-10

Electronic module and method for producing an electric functional layer on a substrate by blowing powder particles of an electrically conductive material

#33

20110236566

2011-09-29

Method of depositing electrically conductive material onto a substrate

#34

20110222225

2011-09-15

Method of coupling digitizing sensors to a structure

#35

20110171392

2011-07-14

System and Method for Manufacturing Embedded Conformal Electronics

#36

20110052828

2011-03-03

Method for high-temperature ceramic circuits

#37

20110044002

2011-02-24

METHOD FOR ARRANGING COOLING FOR A COMPONENT AND A COOLING ELEMENT

#38

20100326512

2010-12-30

Method for constructing contact element for multi-layer system

#39

20100243107

2010-09-30

Material and method of manufacturing of a solder joint with high thermal conductivity and high electrical conductivity

#40

20100230469

2010-09-16

Conductive ball mounting apparatus and conductive ball mounting method

#41

20100188829

2010-07-29

ANISOTROPIC CONDUCTIVE FILM, METHOD FOR PRODUCING THE SAME, AND JOINED STRUCTURE USING THE SAME

#42

20100187000

2010-07-29

Method for the production of a ceramic multilayer circuit arrangement

#43

20100068410

2010-03-18

Cold gas spraying method

#44

20100052697

2010-03-04

Repairing defects

#45

20100041228

2010-02-18

Method of manufacturing a wiring board

#46

20100001294

2010-01-07

LED module having a heat sink

#47

20090314520

2009-12-24

Method and apparatus for spraying on a track, in particular a conductor track, and electrical component with a conductor track

#48

20090053507

2009-02-26

CONVERGENT-DIVERGENT-CONVERGENT NOZZLE FOCUSING OF AEROSOL PARTICLES FOR MICRON-SCALE DIRECT WRITING

#49

20080220373

2008-09-11

Method for forming a photoresist-laminated substrate, method for plating an insulating substrate, method for surface treating of a metal layer of a circuit board, and method for manufacturing a multi layer ceramic condenser using metal nanoparticles aerosol

#50