ClassID:

234894

H05K2203/1355 - CPC Classification

Classification description:

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by; Moulding and encapsulation; Deposition techniques; Protective layers; Deposition techniques, e.g. coating Powder coating of insulating material

Recent Application in this class:
#1
20210345494
2021-11-04

Methods and processes for forming electrical circuitries on three-dimensional geometries

#2
20210014966
2021-01-14

Printed wiring board, multilayer printed wiring board and method for manufacturing printed wiring board

#3
20180213652
2018-07-26

Electrically isolated assembly and method for the electrical isolation of an assembly

#4
20180186138
2018-07-05

Method of manufacturing treated sheet and method of manufacturing resin multilayer substrate

#5
20170167714
2017-06-15

Light source module

#6
20170167713
2017-06-15

Light source module

#7
20170009976
2017-01-12

Light source module, fabrication method therefor, and lighting device including the same

#8
20170009975
2017-01-12

Light source module, fabrication method therefor, and lighting device including the same

#9
20130329356
2013-12-12

Thermal dissipation techniques for multi-sensory electromechanical products packaged in sealed enclosures

#10
20120328794
2012-12-27

Method for producing an anisotropic conductive film

#11
20120085573
2012-04-12

STACKED STRUCTURE AND METHOD OF MANUFACTURING THE SAME

#12
20110293823
2011-12-01

Method and device for producing a plastic coating

#13
20100188829
2010-07-29

ANISOTROPIC CONDUCTIVE FILM, METHOD FOR PRODUCING THE SAME, AND JOINED STRUCTURE USING THE SAME

#14
20100003398
2010-01-07

Methods for inhibiting tin whisker growth using abrasive powder coatings

#15
20080268166
2008-10-30

Fluidized bed process for mixing and transfer of powders to conductive substrates

#16
20070287024
2007-12-13

Electrical components including abrasive powder coatings for inhibiting tin whisker growth

#17
20070128843
2007-06-07

Manufacturing method of workpiece

#18
20070101573
2007-05-10

Manufacturing method of three-dimensional circuit board

#19
20070093620
2007-04-26

Powder coating and process for the preparation of thin layers in the manufacture of printed circuit boards

#20
20050112369
2005-05-26

Printed circuit board manufacture

#21
20050065295
2005-03-24

Epoxy resin compositions, processes utilizing same and articles made therefrom