ClassID:

234895

H05K2203/1361 - CPC Classification

Classification description:

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by; Moulding and encapsulation; Deposition techniques; Protective layers; Deposition techniques, e.g. coating Coating by immersion in coating bath

Recent Application in this class:
#1
20210407896
2021-12-30

Hermetic metallized via with improved reliability

#2
20210298182
2021-09-23

Manufacturing implantable tissue stimulators

#3
20200165160
2020-05-28

Hermetic metallized via with improved reliability

#4
20190313524
2019-10-10

Hermetic metallized via with improved reliability

#5
20190302721
2019-10-03

Processing machine

#6
20190069416
2019-02-28

Potting method

#7
20180352661
2018-12-06

Methods of fast fabrication of single and multilayer circuit with highly conductive interconnections without drilling

#8
20180311889
2018-11-01

Method for treating millimetre and/or micrometre and/or nanometre structures on a surface of a substrate

#9
20170273193
2017-09-21

Machine control unit

#10
20140216784
2014-08-07

Method of making electrically conductive micro-wires

#11
20110256363
2011-10-20

Surface metal film material, method of producing surface metal film material, method of producing metal pattern material, and metal pattern material

#12
20110162578
2011-07-07

Flip-chip mounting method and bump formation method

#13
20100163606
2010-07-01

Apparatus and method of coating flux

#14
20090242263
2009-10-01

System and method of forming a low profile conformal shield

#15
20090140426
2009-06-04

Flip chip package and method for manufacturing the same

#16
20090059470
2009-03-05

Capacitor unit, and its manufacturing method

#17
20070270001
2007-11-22

Printed circuit board assembly and method of producing the same

#18
20070243664
2007-10-18

Flip-chip mounting method and bump formation method