H05K2203/1388 - CPC Classification Index

ClassID:

234900 ⎘

H05K2203/1388 - CPC Classification

Classification description:

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by; Moulding and encapsulation; Deposition techniques; Protective layers; Protective layers Temporary protective conductive layer

Recent Application in this class:

20210132718

2021-05-06

Flexible circuit board and display device

20150223342

2015-08-06

Embedded printed circuit board

20140251945

2014-09-11

Method of etching metal layer

20120192417

2012-08-02

METHOD OF MANUFACTURING A METAL CLAD LAMINATE

20120160551

2012-06-28

EMBEDDED STRUCTURE OF CIRCUIT BOARD

20110056732

2011-03-10

FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

20110036486

2011-02-17

Method of manufacturing a metal clad laminate

20110005821

2011-01-13

Method for manufacturing laminated circuit board

20100230142

2010-09-16

METHOD FOR MANUFACTURING PRINTED WIRING BOARD

#10

20100101849

2010-04-29

Electronic component built-in substrate and method of manufacturing the same

#11

20100065324

2010-03-18

Method for making an embedded structure

#12

20090324992

2009-12-31

Metal clad laminate and manufacturing method thereof

#13

20090321387

2009-12-31

Manufacturing method of printed circuit board

#14

20090288870

2009-11-26

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

#15

20080073025

2008-03-27

Method of manufacturing copper-clad laminate for VOP application