H05K2203/1407 - CPC Classification Index

ClassID:

234903 ⎘

H05K2203/1407 - CPC Classification

Classification description:

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by; Related to the order of processing steps Applying catalyst before applying plating resist

Recent Application in this class:

20230247774

2023-08-03

Semi-Additive Process for Printed Circuit Boards

20200389983

2020-12-10

Process for fabrication of a printed circuit board using a semi-additive process and removable backing foil

20200328114

2020-10-15

Plated metallization structures

20190259631

2019-08-22

Package substrate having copper alloy sputter seed layer and high density interconnects

20190148229

2019-05-16

Plated metallization structures

20190014667

2019-01-10

Process for printed circuit boards using backing foil

20170336710

2017-11-23

Method for fine line manufacturing

20150271924

2015-09-24

WIRING METHOD, STRUCTURE HAVING WIRING PROVIDED ON SURFACE, SEMICONDUCTOR DEVICE, WIRING BOARD, MEMORY CARD, ELECTRIC DEVICE, MODULE, AND MULTILAYER CIRCUIT BOARD

20130056247

2013-03-07

Wiring method, structure having wiring provided on surface, semiconductor device, wiring board, memory card, electric device, module and multilayer circuit board

#10

20110292622

2011-12-01

METHOD FOR ELECTRIC CIRCUIT DEPOSITION

#11

20090023011

2009-01-22

Systems and Methods for Forming Conductive Traces on Plastic Substrates