H05K2203/14 - CPC Classification

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by Related to the order of processing steps

• H05K2203/1407 » Applying catalyst before applying plating resist 10
• H05K2203/1407 » Applying catalyst before applying plating resist 10
• H05K2203/1415 » Applying catalyst after applying plating resist 4
• H05K2203/1415 » Applying catalyst after applying plating resist 4
• H05K2203/1423 » Applying catalyst before etching, e.g. plating catalyst in holes before etching circuit 8
• H05K2203/1423 » Applying catalyst before etching, e.g. plating catalyst in holes before etching circuit 8
• H05K2203/143 » Treating holes before another process, e.g. coating holes before coating the substrate 23
• H05K2203/143 » Treating holes before another process, e.g. coating holes before coating the substrate 23
• H05K2203/1438 » Treating holes after another process, e.g. coating holes after coating the substrate 22
• H05K2203/1438 » Treating holes after another process, e.g. coating holes after coating the substrate 22
• H05K2203/1446 » Treatment after insertion of lead into hole, e.g. bending, cutting, caulking or curing of adhesive but excluding soldering 31
• H05K2203/1446 » Treatment after insertion of lead into hole, e.g. bending, cutting, caulking or curing of adhesive but excluding soldering 31
• H05K2203/1453 » Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors 90
• H05K2203/1453 » Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors 90
• H05K2203/1461 » Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors 153
• H05K2203/1461 » Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors 153
• H05K2203/1476 » Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning 722
• H05K2203/1476 » Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning 722
• H05K2203/1484 » Simultaneous treatments, e.g. soldering lead-in-hole components simultaneously with surface mounted components 18
• H05K2203/1484 » Simultaneous treatments, e.g. soldering lead-in-hole components simultaneously with surface mounted components 18
• H05K2203/1492 » Periodical treatments, e.g. pulse plating of through-holes 41
• H05K2203/1492 » Periodical treatments, e.g. pulse plating of through-holes 41

Recent Application in this class: