H05K2203/1423 - CPC Classification Index

ClassID:

234905 ⎘

H05K2203/1423 - CPC Classification

Classification description:

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by; Related to the order of processing steps Applying catalyst before etching, e.g. plating catalyst in holes before etching circuit

Recent Application in this class:

20220151081

2022-05-12

Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor

20200344895

2020-10-29

Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor

20200329567

2020-10-15

Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor

20200328114

2020-10-15

Plated metallization structures

20190306991

2019-10-03

Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor

20190148229

2019-05-16

Plated metallization structures

20160050769

2016-02-18

Method for manufacturing multilayer wiring substrate

20130319734

2013-12-05

PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME